DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

Features

  • Lightning protection, IEC61000-4-5, 35A (8/20μs)
  • EFT , IEC61000-4-4, 50A (5/50ns)
  • ESD, IEC61000-4-2, ±30kV contact, ±30kV air
  • Low clamping voltage
  • Low leakage current
  • SOIC-8 surface mount package (JEDEC MS-012) Functional Block Diagram Pinout Note: Pinout diagrams above shown as device footprint on circuit board. SOIC-8 (Top View) I/O 1 I/O 2 I/O 3 I/O 4Ref 1 Ref 1 Ref 2 Ref 2 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example 1 4 SRDA3.3-4 T1/E1/T3/E3 Interface Protection T1/E1/T3/E3 Transceiver R Tip R Ring T Tip T Ring SRDA3.3 Series 8pF 35A Diode Array
  • Tertiary (IC Side) Protection: - T1/E1/T3/E3 - HDSL/SDSL - Ethernet
  • RS232, RS485
  • Video Line Protection
  • Security Cameras
  • Storage DVRs
  • Network Equipment
  • Instrumentation, Medical Equipment I/O 1 I/O 3 I/O 2 I/O 4 Ref 2 Ref 1

©2013 Littelfuse, Inc. Specifi cations are subject to change without notice. Please refer to http://www.littelfuse.com for current information. TVS Diode Arrays (SPA® Diodes) Revision: June 14, 2013 Lightning Surge Protection- SRDA3.3 Series SRDA3.3 Series SP4040 Absolute Maximum Ratings Electrical Characteristics (TOP = 25°C) Thermal Information Parameter Rating Units Operating Temperature Range -40 to 125 °C Storage Temperature Range -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) (SOIC - Lead Tips Only) 260 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifi cation is not implied. 1 Parameter is guaranteed by design and/or device characterization. Normalized Capacitance vs. Bias Voltage Symbol Parameter Value Units Ppk Peak Pulse Power (8/20μs) 600 W Ipp Peak Pulse Current (8/20μs) 35 A Top Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Parameter Symbol Test Conditions Min Typ Max Units Reverse Stand-Off Voltage V RWM I T ≤1μA - - 3.3 V Reverse Breakdown Voltage V BR I T =2uA 3.5 - - V Snap Back Voltage V SB I T=50mA 2.9 - - V Reverse Leakage Current I R V R = 3.3V - - 1 μA Clamping Voltage, Line-Ground1 V C I PP = 1A, t p =8/20 μs - 5.7 - V Clamping Voltage, Line-Ground1 V C I PP = 10A, t p =8/20 μs - 10.1 - V Clamping Voltage, Line-Ground1 V C I PP = 30A, t p =8/20 μs - 17 .7 - V Dynamic Resistance, Line-Ground1 R DYN ( VC2-VC1)/(IPP2-IPP1) - 0.5 - Ω ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact Discharge) ±30 - - kV IEC61000-4-2 (Air Discharge) ±30 - - kV Diode Capacitance1 C I/O-I/O Reverse Bias=0V - 4.0 - pF C I/O-GND Reverse Bias=0V - 8.0 - pF 0.01 0.1 0.1 1 10 100 1000 Pulse Duration-tp(μS) Peak Pulse Power-Ppk (kW) Non-Repetitive Peak Pulse Power vs. Pulse Time Bias Voltage (V) Normalized Capacitance (pF) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

3©2013 Littelfuse, Inc. Specifi cations are subject to change without notice. Please refer to www.littelfuse.com for current information. TVS Diode Arrays (SPA® Diodes) Revision: June 14, 2013 Lightning Surge Protection- SRDA3.3 Series SRDA3.3 SRDA3.3 Series Clamp Voltage V C (V) 10 20 30 35 IPPPeak Pulse Current- (A) 5 15 25 Clamping Voltage vs. IPP Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (μs) Percent of IPP Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Refl ow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Refl ow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold fl ash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte fi nish VDI 11-13. Power Derating Curve 100 110 0 25 50 75 100 125 150 Ambient Temperature-TA (oC) % of Rated Power or I PP

©2013 Littelfuse, Inc. Specifi cations are subject to change without notice. Please refer to http://www.littelfuse.com for current information. TVS Diode Arrays (SPA® Diodes) Revision: June 14, 2013 Lightning Surge Protection- SRDA3.3 Series SRDA3.3 Series Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package SOIC Pins 8 JEDEC MS-012 Millimetres Inches Min Max Min Max A 1 .35 1 .75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1 .25 1 .65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 1 .27 BSC 0.050 BSC L 0.40 1 .27 0.016 0.050 o Recommended Soldering Pad Outline (Reference Only) FL Embossed Carrier T ape & Reel Specifi cation — SOIC Package Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1 .95 2.05 0.077 0.081 D 1 .5 1 .6 0.059 0.063 D1 1 .50 Min 0.059 Min P0 3.9 4.1 0.154 0.161 W 11 .9 12.1 0.468 0.476 P 7 .9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 User Feeding Direction Pin 1 Location

Ordering Information

Part Number Package Marking Min. Order Qty. SRDA3.3-4BTG SOIC-8 SRDA3.3 2500 Part Numbering System SRDA 3.3 B T G TVS Diode Arrays (SPA Diodes) Voltage Package B = SOIC-8 T= Tape & Reel G= Green Channel 4= 4 Channels Part Marking System Marking FLSRDA-3.3 CYYWW Date code Pin1