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Technical content

Features

Applications

The SR70 consists of four, low capacitance, rail-to-rail diodes that provide protection against ESD and lightning surge events. These robust diodes can safely absorb up to 40A (t P=8/20μs) and repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Its low loading capacitance makes it ideal for protecting high-speed data lines such as VDSL and VDSL2.

  • ESD, IEC61000-4-2 , ±30kV contact discharge, ±30kV air discharge
  • EFT , IEC61000-4-4, 80A p=5/50ns)
  • Lightning protection, IEC61000-4-5, 40A (tp=8/20µs)
  • Low capacitance of 2.0pF (TYP) per I/O
  • Low clamp voltage
  • Small SOT143 (JEDEC TO- 253) packaging
  • xDSL Lines
  • Video Lines
  • Customer Premises Equipment
  • 10/100/1000 Ethernet Pinout Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example SR70 Series 70V 40A Diode Array SOT-143-4 GND I/O 1 Vcc I/O 2 VCCI/OI/O 2 3 4Additional Information Datasheet SamplesResources

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SR70 Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 40.0 A TOP Operating Temperature –40 to 125 °C TSTOR Storage Temperature –55 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM 70 V Reverse Leakage Current ILEAK VR=70V 5 µA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Fwd 1. 4 V IPP=10A, tp=8/20µs, Fwd 4.7 V IPP=30A, tp=8/20µs, Fwd 12 V Dynamic Resistance RDYN (VC2-VC1)/(IPP2-IPP1) 0.35 Ω ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) ±30 kV IEC61000-4-2 (Air) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V , f=1MHz 2.0 3.0 pF CI/O-I/O Reverse Bias=0V , f=1MHz 1. 3 2.0 pF Note: 1 . Parameter is guaranteed by design and/or device characterization. Capacitance vs. Reverse Bias DC Bias (V) Capacitance (pF) 0.00 0.50 1.00 1.50 2.00 2.50 I/O -G ND I/O -I /O Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (μs ) Percent of IPP

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SR70 Series Soldering Parameters Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C

Ordering Information

Part Number Package Marking Min. Order Qty. SR70-02CTG SOT143 702C 3000 Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Numbering System Part Marking System SR 70 02 C T G Series Number of Channels Package T= Tape & Reel G= Green C: SOT143-4 702C Clamping Voltage vs. IPP Peak Pulse Current-IPP (A) Clamp Voltage (VC) 05 10 15 20 25 30 35 40

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SR70 Series Embossed Carrier T ape & Reel Specification—SOT143 User Feeding DirectionPin 1 Symbol Millimeters A 3.19±0.10 B 2.8±0.10 C 1 .31±0.10 d 1 .50±0.10 E 1 .75±0.10 F 3.50±0.10 P0 4.00±0.10 P 4.00±0.10 P1 2.00±0.10 W 8.00±0.10 Notes : 1 . All dimensions are in millimeters 503B EE1 c e 1 2 4 3 b2 b A1 A D L 3.40 (.134") 3.60 (.140") 0.80 (.032") 1.00 (.040") 2.20 (.087") REF 1.90 (.075") 1.70 (.067") 1.00 (.040") 1.20 (.048") 0.80 (.032") 1.00 (.040") BSC MAX 1.40 (.055") Pins 4 JEDEC TO-253 Millimeters Inches Min Max Min Max A 0.8 1 .22 0.03 0.048 A1 0.05 0.15 0.002 0.006 b 0.30 0.50 0.012 0.020 b2 0.76 0.89 0.030 0.035 c 0.08 0.20 0.003 0.008 D 2.80 3.04 0.110 0.120 E 2.10 2.64 0.082 0.104 E1 1 .20 1 .40 0.047 0.055 e 1 .92 BSC 0.076 BSC e1 0.20 BSC 0.008 BSC L 0.4 0.6 0.016 0.024 L1 0.550 REF 0.022 REF 503B EE1 c e 1 2 4 3 b2 b A1 A D L 3.40 (.134") 3.60 (.140") 0.80 (.032") 1.00 (.040") 2.20 (.087") REF 1.90 (.075") 1.70 (.067") 1.00 (.040") 1.20 (.048") 0.80 (.032") 1.00 (.040") BSC MAX 1.40 (.055") Recommended Pad Layout Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.