SR1502 TSC | Alldatasheet
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Green compound with suffix "G" on packing code & prefix "G" on datecode. Marking Diagram SR150X = Specific Device Code G = Green Compound Y = Year WW = Work Week Dimensions in inches and (millimeters) Lead: Pure tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed High temperature soldering guaranteed: 260oC/10 seconds /.375”,(9.5mm) lead lengths at 5 lbs., (2.3kg) tension Maximuml Thermal Resistance Rating for fusing t < 10ms @ TA=25℃ 390 Peak Forward Surge Current, 50/60 Hz Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) Maximum Instantaneous Forward Voltage @ 5.0A V F Weight: 1.1 gram Pb RoHS COMPLIANCE RoHS COMPLIANCE B09
RATINGS AND CHARACTERISTIC CURVES (SR1502 THRU SR1504) FIG.1 Rated Forward Current vs Ambient Temp. Curve DC forward 100 0 25 50 75 100 125 150 175 200 Ambient Temperature (oC) Average Forward Current (%) FIG 2 Maximum Forward Surge Current 50 Hz 60Hz 100 150 200 250 300 350 1 10 100 Number of Cycles at 60 Hz Peak Forward Surge Current (A) FIG 3 Typical Forward Characteristics 0.01 0.1 100 Forward Voltage (V) Forward current (A) FIG 4 Typical Reverse Characteristic Ta=25oC Ta=100oC 0.01 0.1 100 0 20 40 60 80 100 120 140 Percentage of VR (%) Reverse lreakage current (mA) FIG 5 Typical Junction Capacitance 100 1000 10000 0.1 1 10 100 Reverse Voltage (V) Capacitance (pF) FIG 6 Typical transient Thermal Resistance 0.1 0.01 0.1 1 10 100 T, pulse Duration (Sec) Transient Thermal Resistance (oC/W) Page : 2 of 2 Version : A08 B09