AN-7820 FAIRCHILD | Alldatasheet

Document overview

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Technical content

FEATURES

  • 20 and 40 MSPS Conversion Rate
  • On-Board Clock Drivers
  • Data Output and Strobe Signal
  • User Selectable Capture Clock
  • On-Board Reference Drivers

APPLICATIONS

  • Evaluation of SPT7820 and SPT7824
  • Engineering System Prototype Aid
  • Incoming Inspection Tool
  • Differential Linearity Error (DLE) Testing
  • Integral Linearity Error (ILE) Testing
  • AC Accuracy Testing: SNR, THD
  • Guide for System Layout GENERAL DESCRIPTION The EB7820/24 evaluation board demonstrates the perfor- mance of the SPT7820 and SPT7824, monolithic high speed analog-to-digital converters (ADCs). This document can used as an application note and as supplemental information to the existing data sheets (SPT7820 or SPT7824). Both the SPT7820 and SPT7824 have analog input ranges of ±2V . The SPT7820 is capable of digitizing an analog input signal into 10-bit words at a minimum update rate of 20 MSPS, while the SPT7824 is capable of digitizing an analog input signal into 10-bit words at a minimum update rate of 40 MSPS. Both devices are pin-compatible. All input/output logic is TTL- compatible. Figure 1: EB7820/24 Block Diagram. (The full detail schematic is shown in figure 17.) DAC OUT CCLK +2.5V REF VF T VFB VIN CLK LATCHES SPT7820/24 VIN Dout -A5.2V CLK +5 -5.2 TTL COMP 12-BIT DAC ADC OUT (TTL) PART OF DB792 (DAUGHTER BOARD) - 1 (80 MSPS MAX) DGNDDGND AGND EB7820/24 REVB +A5 - D5.2V +D5V The EB7820/24 (≈ 4" X 7.5") consists of five separate sections: - Reference circuits - Clock circuits - SPT7820 or SPT7824, 10-bit ADC (not included with the board) - Output latches available through 26-pin female ribbon connector - The DB792 DAC reconstruction board is a separate daughter board (≈ 2.5" X 3.0") that directly interfaces with the EB7820/24

frequency. On both devices, the expected full scale analog input range is from VST to VSB. The analog input is latched at the leading edge of the CLK. There are 11 digital TTL outputs. D0 - D9 are the parallel TTL-output bits, with D0 the LSB, D9 the MSB and D10 the overrange bit. The data outputs are latched at the rising edge of the CLK, with a propagation delay of typically 14 nsec. There is one clock latency between CLK and valid output data (see figure 5 for more detail). The output code is a straight binary: Table 3: SPT7820/24 Output Coding (Ø Indicates the Flickering Bit Between Logic 0 and 1) Analog Input D12 (Overrange Bit) Data Output Code <- 2.0 V 0 OO OOOO OOOO - 2.0 V +1 LSB 0 OO OOOO OOOØ

0 V 0 ØØ ØØØØ ØØØØ

+ 2.0 V - 1 LSB 0 11 1111 111Ø > + 2.0 V + 1/2 LSB 1 11 1111 1111 Pin 21 is the analog input pin. Selecting the analog input driver for the SPT7820/24 is less of an issue than with most Flash ADCs because the input impedance and input capaci- tance are typically 300 kΩ and 5 pF, respectively. For example, at 10 MHz and 4 V P-P sinewave input, the input driver source only requires 0.648 mA of peak output current (4 πFC). The analog input is directly fed from a BNC (VIN). R10 (51 Ω ), analog input source termination is mounted on a socket as a user-selectable termination. The analog input pin has no circuit protection. Its maximum rating is from VFT to VFB (±2.5 V). In an application in which the analog input range is greater than ±2.5 V, protect the input pin from permanent damage with a voltage limiter. INPUT CLOCK DRIVER CLK is the single-ended input clock to the EB7820/24 (evalu- ation board), CLK IN is the input clock to the SPT7820 or SPT7824, and CCLK is the capture clock used for the output latches (U7 & U8). The clock input of the SPT7820/24 requires a TTL-logic level of 6 nsec or faster to improve the noise. TTL-logic family (74FXX) is good for driving the SPT7820/24. Finding a TTL- square wave generator up to 40 MHz with fast slew rate and low jitter is harder than a sine wave, low jitter generator. U5 (MAX9686, TTL-voltage comparator) provides most of the above requirements to drive the SPT7820 or SPT7824 (ex- cept the low jitter generator). The CLK signal can be a sine wave signal with the amplitude not to exceed ± 3 V (input common mode limitation of U5). R11 (51 Ω ) is the CLK source termination. Use R3 to adjust the duty cycle of the CLK IN. CLK IN is in phase with CLK and has a a propagation delay of 6 nsec typically. The positive clock (CLK IN) pulse width must be kept between 10 nsec and 300 nsec for the mends that these references (VFT & VFB) be operated to within ± 2% (or ± 2.5 V ± 50 mV) to maintain accuracy within the specified limit. Before each EB7820/24 board is shipped, the references are adjusted for VFT and VFB of ±2.5 V ±5 mV respectively. For each new SPT7820 or SPT7824, VST and VSB need to be readjusted. All measurement must be referenced to AGND test point (provided). REFERENCE MONITORING Table 2 - Recommended Operating Voltage Range Monitoring Ref Point Min Typ Max Adjust VST U1, PIN 20 +1.95 V +2.00 V +2.05 V R1 VSB U1, PIN 23 - 2.05 V - 2.00 V - 1.95 V R2 Note that the SPT7820 and SPT7824 (especially refer- ence taps VFT VFB, VST and VRM) are sensitive to electrostatic discharge (ESD). Figure 4A shows one type of reference driver. Figure 4B is another way to drive the reference circuits using force and sense. The alternate circuit provides better control of plus full scale (+FS) and minus full scale (-FS) errors by sensing VST and VSB to ± 2.0 V respectively. However, the refer- ence pins VST and VSB are not low impedance nodes that require additional precaution when routing (PCB layout). Figure 4A - Reference Driver REF-03 VFT VFBOP-07+ -2.5 V R R Figure 4B - Alternative Reference Driver 10 k OP-07 OP-07+ +2.0 V REF-03 OUT 10 k 10 k VFT VST VSB VFB 0.1 +2.0 V -2.0 V » -2.5 V » +2.5 V +2.5 V SPT7820 OR SPT7824, 10-BIT ADC The SPT7820 integrated circuit is a 10-bit analog-to-digital converter capable of digitizing an input signal with a minimum update rate of 20 mega-samples per second (MSPS). The SPT7824, on the other hand is pin compatible with the SPT7820 except that it is faster: 40 MSPS for the sampling

SPT7824 and 20 to 300 nsec for SPT7820. This is due to the internal THA. When operating the SPT7820 or SPT7824 faster than 3 MSPS, keep the clock duty cycle at approxi- mately 50% ±10%. The probe jack PJ1 is the monitoring test point for the CLK IN. Use this test point when adjusting the clock duty cycle. Logic low of the CLK IN (pin 17) causes the internal THA to go into track. It is necessary to keep the SPT7820 or SPT7824 in the track mode when the device is idle for an extended period of time or at the start-up time. This setup will prevent the internal THA from going to saturation due to the internal THA’s droop. EB7820/24 provides a logic low to the clock of the SPT7820/24 when the pulse generator (CLK) is removed from the evaluation board. TTL-OUTPUT DATA LATCHES The rise time (Trise) and fall time (Tfall) of SPT7820/24 (D0- D9) are not symmetrical. The propagation delay with respect to trise (at the 2.4 V crossing) is typically 14 nsec and 6 nsec is typical with respect to tfall (at the 2.4 V crossing). Figure 5 shows the actual output characteristic of the SPT7820/24. This nonsymmetrical trise and tfall creates approximately 8 nsec of invalid data. In an application where a reconstruction DAC is needed, the above invalid data zone will cause the reconstruction signal to have an unwanted heavy glitch if the DAC is directly interfaced with SPT7820 or SPT7824. To avoid this, buffer the SPT7820/24 by the edge-triggered latches. FAST family TTL logic will fit well in this application due to its fast setup and hold time. U7 and U8 (74F174) are the output latches. The FAST family TTL-logic is very sensitive to electrostatic discharge (ESD). RN1 and RN2 are the 8 pin SIP resistor networks, 10 kΩ . They protect U7 and U8 by providing the ESD path to DGND. The BNC connector (CCLK) is the capture clock, which has 51 Ω termination R12 on board. The outputs of the data latches (D0-D9) are routed through the standard 26-pin female ribbon connector (P2). SJ3-5 are the solder jumper options for the capture clock. Only one of these jumpers needs to be connected: - When SJ3 is installed (factory installed when this board is shipped), SPT7820/24 and the latches (U7 and U8) are clocked at the same time. With this configuration, the data seen at the connector P2 adds another clock of latency (two clocks of latency total as shown in figure 6). - When SJ4 is installed, the capture clock must be supplied externally through CCLK. The setup time (ts) and hold time (th) in table 5 must be met when selecting this option. - When SJ5 is selected, the buffers will be latched at the falling edge of the CLK IN (SPT7820/24). With this option, the setup time (ts) and hold time requirements for the 74F174 latches must be met (table 5). The placement of this capture clock edge is dependent on the clock pulse width and the sampling frequency. This option is not recommended above 25 MSPS to avoid latching the invalid data. Figure 5 - Digital Output Characteristic of the SPT7820 or SPT7824 N+1 INVALID DATA Rise Time £ 6nSEC2.4V 2.4V Invalid Data tpd1 (14 nS typ.) 6nS typ. CLK IN DATA OUT (Actual) N (N-2) (N-1)(N-2) (N-1) Invalid Data (N) INVALID DATA (N-1)DATA OUT (Equivalent) 3.5V 0.8V 0.5V The digital outputs (latched) are routed through P2, 26 pin ribbon connector. (See table 4.) The overrange bit (D10) could be viewed through test point TP13. D10 does not bring out through P2.

Figure 6 - EB7820/24 Timing Diagram Where CCLK is the Same as CLK IN Figure 7 - EB7820/24 Timing Diagram Where CCLK is 180° Out of Phase From CLK IN N N+1 N+2 N+3 N+4 ts VALID (N-1) VALID (N) VALID (N+1) VALID (N+2) VALID (N-2) INVALID INVALID INVALID INVALID tpd2 tpd3 tpd1 tpwLtpwH tpd4 th CLK (EB7820/24) CLK IN (SPT7820/24) DATA OUT (SPT7820/24) CCLK (LATCHES) DATA OUT (P2) U5, pin 3 Table 4 - P2, SPT7820/24 Output Data (Latched) , 26-Pin Female Ribbon Connector P2 Function Logic P2 Function Logic

1 CCLK TTL 2 DGND DGND

3 N/A TTL/LO 4 DGND DGND

5 N/A TTL/LO 6 DGND DGND

7 D0 (LSB) TTL 8 DGND DGND

9 D1 TTL 10 DGND DGND

11 D2 TTL 12 DGND DGND

13 D3 TTL 14 DGND DGND

15 D4 TTL 16 DGND DGND

17 D5 TTL 18 DGND DGND

19 D6 TTL 20 DGND DGND

21 D7 TTL 22 DGND DGND

23 D8 TTL 24 DGND DGND

25 D9 (MSB) TTL 26 DGND DGND

Table 6 : Critical Timing Specifications Parameter Description Min Typ Max Unit tHTS THA, Hold to Track Settling Time X X X tTHS THA, Track to Hold Settling Time X X X tacq SPT7820 ADC Acquisition Time

4 V Step 20 nsec

4 V Step 12 nsec

X= This Limit Depends on the THA Chosen The settling time to 1/2 LSB (1.953 mV) is one of the principal requirement in a 10-bit THA. This includes both track to hold (tTHS) and hold-to-track (tHTS) settling time. tHTS varies with the step size (voltages) that the THA needs to swing. The rising edge of the ADC’s clock should be placed after tTHS has settled. SPT7820/24 requires that the analog input be held for an additional 5 nsec minimum (th1) after the rising edge of the clock. Figure 9 shows the ADC running at Nyquist; the sampling frequency is practically twice the input frequency. In this example, the ADC could have as much as a 4 Volt step (±FS) from one conversion to the next. The acquisition time (tacq) of the ADC must be met. This is the time necessary to allow the internal THA of the SPT7820/24 to track (CLK= low) and settle to 1/2 LSB while the input is sharply changed to its new continuous level. The minimum acquisition time is 20 nsec for a 4 volt step and 12 nsec for a 0.5 volt or less step. The maximum sampling rate of the SPT7820 or SPT7824 when driving from an external THA can be decided from the proper combination of tTHS, tHTS and tacq . The pedestal and the droop of the THA shown in figure 9 are not critical to the dynamic performance as long as they are constant with respect to the analog input range. They are seen as offset errors. LOW LEVEL ANALOG INPUT SIGNAL SPT7820 and SPT7824 require that the analog input (VIN) range be operated within ± 2 V ± 2%. Amplification and level shifting are needed for a low voltage level VIN. Figure 10: Driving Circuit Block Diagram TH A AMP 2 SPT7820/24AMP1VIN Figure 10 shows the typical analog driving circuit. AMP1 and/ or AMP2 are optional. For an application in which noise is the major concern, use AMP1 (disregard AMP2) low noise ampli- fier to gain up to ± 2 volts before getting to the THA. In another application in which high frequency VIN is the major concern, use AMP2 instead of AMP1 to amplify the THA signal to ±2 volts before reaching to SPT7820 or SPT7824. In the latter case, the low level VIN provides a faster acquisition time for the THA. UNCOMMITTED PROTO SOCKET SPACE Referring to the detail schematic figure 17, there are two slots available for applications where additional circuits may be needed to interface with the EB7820/24. These two slots (labeled A and D in the PCB assembly) are electrically noncommitted: - Slot A is physically located near VIN (BNC) and is in- tended for the analog interfacing circuit. It has one 16- DIP and one 8-SIP. - Slot D is physically located between P2 and P3 connectors and is intended for the digital interfacing circuit. It has three 16-DIPs, three 8-SIPs and one 37-pin D connector. Both slots have the appropriate power supplies and grounds in their vicinity as labeled. DB792 DAUGHTER BOARD (RECONSTRUCTION DAC) DB792 (figure 18) is the daughter board that interfaces directly to the EB7820/24 via P2 and P3. It is suited for an application where the reconstruction DAC is needed to evaluate the ADC performance in the time domain. DB792 is designed around the Analog Device's AD9713, 12-bit TTL, digital-to-analog converter, 80 MSPS update rate. It is setup in bipolar operation. The detailed schematic is shown in figure 18. Refer to Analog Device's AD9713B data sheet for detail. SPT7820/24 INPUT AND LATCH-UP PROTECTIONS The SPT7820/24 is free from any possible latch-up when the recommended interfacing circuit as shown in figure 11 is followed. The following lists are for both latch-up and input protection interface requirements: 1) Drive the input clock (pin 15) from a TTL logic (VIH ≤ 4.5 V). Fast TTL logic family or equivalent is strongly recom- mended due to its fast rise time (6 nsec or faster). In the event in which the clock is driven from a high current source (greater than 400 mA), use a 100 Ω resistor in series to current limit to roughly 45 mA. 2) D1 is a Schottkey or hot carrier diode (Motorola, 1N5817 or eq.) installed between VEE and AGND (reverse bias). 3) Both VCC (pin 18 & 25) and DVCC (pin 14 and 28) are driven from the same analog +5 V supply. 4) Mount the ferrite beads (FB1 and FB2) as closely to the device as possible. The bead to ADC connections should not be shared with any other device.

Figure 11: Recommended Interfacing Circuit -5.2V .01mF .01mF .01mF IC1 (REF-03) +5V Vout TrimGND Vin 1mF .01mF 10K 10K 30K 30K 1mF +5V .01mF .01mF 1mF .01mF IC2 OP-07 CLK VIN (–2V) +2.5V -2.5V CLK VIN VFT VST VRM VSB VFB (ORB) (MSB) VEE VCC DVCC VEE VCC DVCC AGND DGND DGND AGND .1mF .1mF 10 mF 10 mF D1 .01mF +5VAGND DGND-5.2V (Analog) FB2 FB1 16 27 17 26 18 25 14 28 1 13 .1mF .1mF .01mF DIGITAL OUTPUT LOGIC INTERFACE FB3 +5V LOGIC FAST TTL BUFFER LIMITER D10 (LSB) VSS VCC SPT7820/24 C10 C11 R1=100 W 5) Bypass all reference and power supply pinsas closely to the device pin as possible (chip caps C1-11 are preferred): 0.1 µF for VCC and VEE, and 0.01µF for DVCC and Vref.

6 The top reference (VFT) driver must be current limited to

20 mA maximum if a different reference driver circuit is used in place of the recommended circuit shown in fig- ure 11. 7) The limiter is required if the maximum peak-to-peak volt- age of the analog input exceeds ±2.5 V. Incorporate the limiter within the analog input driver or use the circuit shown in figure 12. Another option is to add a 100 Ω resistor in series to current limited the input. This last option adds another LSB error to both ± full scale com- pared to only 1/2 LSB when using the circuit shown in figure 12. Figure 12 : An Example of an Input Limiter - + LIMITER SK1,2 = Fast recovery Schottkey diode: RCA, P/N SK9091 or equivalent

47 W To ADC

-5.2 V VIN +5 V SK1 SK2 10 kW 10 kW +2 V -2 V

Figure 15: Three-Bit Reconstruction DAC Waveform Using Analog Input Ramp contain n conversions Theoretical Actual Non- MonotonicLSB DLE » -1/2 LSB 111 110 101 100 011 010 001 000 (A) (B) Last 3-LSB codes 1LSB Ramp Input Missing Code (MC) (A) is the actual bit weight for the output code multiple of 011 (B) is the major transition noise. This noise level shown is greater than ± 1/2 LSB Disadvantages: 1) The accuracy depends on human judgement and can be very difficult if the person is not familiar with it. 2) The exact code is not shown in the transfer curve, but in a multiple of the last three bits of the LSB. To overcome this problem, probe every bit using an oscilloscope or install LEDs at each output (P3 connector) to signal the state of each output bit. Advantages: 1) Many tests (as stated above) can be extracted from this one, simple test set-up. 2) The missing code and the transition noise can be more accurately identified than with any other standard test methods. 3) Set-up is quick and relatively accurate.

Figure 16: Dynamic Testing Test Set-up GENERATOR # 1REF OUT OUT GENERATOR # 2REF IN GENERATOR # 3 REF IN BP FIN EB7820/24 CLK VINCCLK HIGH SPEE D MEMORY CPU / DSP DB792 SCOPE OR SPECTRUM ANALYSER DAC OUT OUT OUT OUT P2/P3 Figure 16 is the recommended block diagram for dynamic testing of the SPT7820 or SPT7824 using the EB7820/24 evaluation board. In earlier tests, the DAC OUT signal was used to analyze the ADC’s dynamic performances (SNR and THD) through a spectrum analyzer. This method of testing presented some uncertainties. The DAC had to be near perfect and free from glitches, and its dynamic accuracy (DLE and ILE) had to be far better than the ADC under test. Any errors in the DAC wereadded to the total SNR and/or THD. Today, it is preferable to perform these tests by means of digital signal processing (DSP). There are currently numer- ous standard software packages on the market to service this application. The EB7820/24 provides the data outputs through P2. (See table 5 for detail.) The reconstruction DAC can be obtained from DB792 daughter board. Both set-ups are very important in characterizing the dynamic perfor- mance of the SPT7820 or SPT7824. In many cases, the speed of the capture memory is much slower than the available output valid data of the ADC under test. In this case, it is necessary to decimate the capture clock at a rate of Fs/N, where N is a power of 2. The beat frequency can be achieved by slightly changing the analog input frequency by an amount of Δfin. For a 4096-point FFT, the beat frequency of Δfin = Fc/4096 is added (or subtracted) to the analog input frequency. 4096 data points are filled in one test period where the input is at Fin ± (Fc/4096) and the output is updated at 1/Fc interval. Select Fin as the multiple (integer) of Fc to achieve a complete system synchroniza- tion. Both capture memory and the DAC run at a relatively low update rate (Fs/N). The daughter board, DB972, is capable of updating to 80 MSPS. EB7820/24 CALIBRATION This section is a guide for the DC calibration of the EB7820/ 24 if needed. Note that this board was fully calibrated before shipment. VST and VSB voltages require new calibration on each new SPT7820 or 7824. Check for installation of jumpers SJ2B, SJ2C and SJ3. 1.0 Equipment Needed 1.1 Four DC power supplies: analog +5 V, analog -5.2 V, digital +5 V and digital -5.2 V.

1.2 One Hewlett Packard, HP3325A, function generator or

equivalent. 1.3 One DVM with 5 and 1/2 digit precision. 1.4 One Oscilloscope. 2.0 Equipment Set-Up / Hook-Up

2.1 Ensure that socket U1 does not haveSPT7820 or

SPT7824 in it.

2.2 Connect all four power supplies as shown in table 1,

and figures 2 and figure 3. 2.3 Connect the function generator to CLK BNC. 2.4 Set the CLK to 3 MHz, sine wave , ±2 V. 2.5 Connect VIN to AGND. 3.0 References Calibration 3.1 Monitor TP1 with respect to AGND test point with DVM. 3.2 Adjust R1 for +2.500 V at TP1. 3.3 Monitor TP2 with respect to AGND test point with DVM. 3.4 Adjust R2 for -2.500 V at TP2. 3.5 Turn all power to off. 3.6 Install SPT7820 or SPT7824 into U1 socket. (Fepeat from this procedure for all new devices.) 3.7 Turn all power back to on.

3.8 Monitor U1, pin 22 (VST) with respect to AGND test

point with DVM. 3.9 Adjust R1 for +2.000 V at VST.

3.10 Monitor U1, pin 27 (VSB) with respect to AGND test

point with DVM. 3.11 Adjust R2 for -2.000 V at VSB. 3.12 Repeat the procedure from paragraph 3.8 until VST and VSB reach the desired voltages (±2.000 V respec- tively). 4.0 Clock Circuit Calibration

4.1 Monitor PJ1 with scope on channel 1 (externally sync

to the generator).

4.2 Observe the TTL clock and adjust R3 for approximately

50% of duty cycle.

5.0 Latches (U7 and U8) Test

5.1 Remove R10. 5.2 Connect VIN to TP1.

5.3 Monitor P2, odd number pins (7-25), with scope and

observe TTL-logic high on all pins. 5.4 Connect VIN to TP2 .

5.5 Monitor P2, odd number pins (7-25), with scope and

observe TTL logic low on all pins. End of calibration Procedure

EB7820/24 PARTS LIST, Rev B # Ref. Des. Description Vendor Part Number Qty 1 C1-7,10 Capacitor, Tant., 10 µF, 25V, .10" Sprague/199D106X0025B A1, or eq. 8 2 C20,22-28,30-32 Capacitor, 0.01 µF, Chip Sprague/11C1206X7R103J050AB, or eq. 11 3 C21,29 Capacitor, 0.1 µF, Chip Sprague/11C1206X7R104J050AB, or eq. 2 4 C50-58 Capacitor, 0.01 µF, 10%, Ceramic MURATA/RPE110X7R103K050V or eq. 9 5 D1 Lead Mounted Hot Carrier Rectifier MOT/IN5817, or eq. 1

6 FB1-3 Ferrite Bead, Lead Mounted Fair Rite/2743001111 3

7 P2,3 Ribbon Plug Connector T & B Ansley/622-2627, or eq. 2 8 P1 Power Connector, 9 Pins Molex/09-18-5094, or eq. 1

9 P1/Recept Power Connector, 9 Pins, Recept Molex/03-09-1093, or eq 1

10 PJ1-2 Probe Connector (25 sets/bag) Tektronix /131-4353-00 2

11 R3 Potentiometer, 2k , 12 Turns Bourns/44F3531, or eq. 1 12 R1,2 Potentiometer, 10k , 12 Turns Bourns/44F3533, or eq. 2 13 R10-12 Resistor, 51 Ω , 5%, 1/8 W Allen-Bradley/BB-510-5, or eq. 3 14 R20,21 Resistor, 820 Ω , 5%, 1/8 W Allen-Bradley/BB-821-5, or eq. 2 15 R26,27,30 Resistor, 20 k Ω , 5%, 1/8 W Allen-Bradley/BB-203-5, or eq. 3 16 R28 Resistor, 1 M Ω , 5%, 1/8 W Allen-Bradley/BB-105-5, or eq. 1 17 R32 Resistor, 5.1 k Ω , 5%, 1/8 W Allen-Bradley/BB-512-5, or eq 1 18 R33 Resistor, 10 k Ω , 5%, 1/8 W Allen-Bradley/BB-103-5, or eq. 1 19 RN1,2 8 pin SIP Resistor, 10K, 708A Type Newark stock 81F9599, or eq. 2 20 TP1-3,AG,DG,STEP Test Point Terminal. 76 Mil Hole Dia Cambion/160-2044—02-01-00, or eq. 6

21 U1 Device Under Test, 10 Bit ADC SPT7820 or SPT7824 1

22 U2 +2.5 V Precision Voltage Reference PMI/REF-03GP, or eq. 1

23 U3 OP-AMP, Low Noise PMI/ OP-07EP 1

24 U5 Single, Fast TTL comparator, 8 DIP MAXIM/MAX9686CPA 1

25 U7,8 HEX D Flip-Flop, TTL, Fast Series Fairchild/74F174, or eq. 2 26 N/A BNC Connector, Receptacle Amphenol/31-5329, or eq. 3 27 N/A 28-Pin DIP Socket, .600" (U1) AMP/M528-611D, or eq. 1 28 N/A SIP Socket Strip, 20, Break-Away Adv. Intercon./SS-020-51-TG 1, or eq. 1 29 N/A Nylon Standoff, 1", Round Plastic Component Corp/C34005, or eq. 4 30 N/A Nylon Screw, 4-40, 3/16", Round Head Plastic Component Corp/S120040, or eq. 4

31 N/A Crimp Male Terminal for P3 Molex, 02-09-2103 1

32 N/A Crimp Female Terminal for P3 Molex, 02-09-1104 8

33 EB7820/24,PCB Printed Circuit Board Fairchild/ EB7820/24 Drawing, Rev: B 1

DB792 PARTS LIST, Rev A # Ref. Des. Description Vendor Part Number Qty 1 C1-2 Capacitor, Tant., 10 µF, 25 V, .10" Sprague/199D106X0025B A 1, or eq. 2 2 C10-16 Capacitor, 0.01 µF, Chip Sprague/11C1206X7R103J050AB, or eq. 7 3 C21-25 Capacitor, 0.1 µF, 10%, Ceramic MURATA/RPE110X7R104K050V or eq. 5 4 D1 2 Terminal IC, 1.2 V Reference Maxim/ ICL8069CCSQ2, or eq. 1 5 P2,3 26 Pin Dual Row Vert PCB Mount Conn Molex 15-44-3213, or eq. 2 6 R1 Potentiometer, 10k , 12 Turns Bourns/44F3533, or eq. 1 7 R2 Resistor, 7.5 k Ω , 5%, 1/8 W Allen-Bradley/BB-752-5, or eq. 1 8 R3 Resistor, 22 Ω , 5%, 1/8 W Allen-Bradley/BB-220-5, or eq. 1 9 R4 Resistor, 10 k Ω , 5%, 1/8 W Allen-Bradley/BB-103-5, or eq. 1 10 R5 Resistor, 15 k Ω , 5%, 1/8 W Allen-Bradley/BB-153-5, or eq. 1 11 R6 Resistor, 20 k Ω , 5%, 1/8 W Allen-Bradley/BB-203-5, or eq. 1 12 R7 Resistor, 1k Ω , 5%, 1/8 W Allen-Bradley/BB-102-5, or eq. 1 13 R8 Resistor, 1 k Ω , 5%, 1/8 W Allen-Bradley/BB-102-5, or eq. 1 14 R11,12 Resistor, 150 Ω , 5%, 1/8 W Allen-Bradley/BB-151-5, or eq. 2 15 R20,21 Resistor, 820 Ω , 5%, 1/8 W Allen-Bradley/BB-821-5, or eq. 2 16 R22 Resistor, 200 Ω , 5%, 1/8 W Allen-Bradley/BB-221-5, or eq. 1 17 TP1,AG,DG Test Point Terminal. 76 Mil Hole Dia Cambion/160-2044—02-01-00, or eq. 3

18 U9 DAC/TTL, 100 MHz, 12 Bits AD9713 1

19 U10 OP-AMP, Low Noise PMI/ OP-07EP 1

20 U11 OP-AMP, Low Distortion AD9617JN 1

21 N/A BNC Connector, Receptacle Amphenol/31-5329, or eq. 1

22 N/A Crimp Male Terminal for P3 Molex, 02-09-2103 1

23 DB792,PCB Printed Circuit Board Fairchild/DB792,PCB Drawing, Rev: A1 1

24 FB1-2 Ferrite Bead, Lead Mounted Fair Rite/2743001111 2

+A5 RTN SJ 5SJ 3 D V C C 11121314 TP2 D V C C TP3 12345678910 2827262524232221201918171615 C32 TP1 VIN R10 R110 k Ω C5+ 2 U2 RE F-0 3 +2.5 V 2 3 20 k Ω 20 k Ω C10 +5A AGN D TP D GND TP -5.2A R27 R281 M Ω C53 C54 C55 C56 820 Ω CLK +D 5-D 5.2 4+ -3 5,67 +5D -D 5.2 (±3 V R11 R20 R21 C50 C51 C52 MAX9686 2 k Ω 820 SJ 4 74F174 1,161,16 74F174 RN1 10 k Ω 10 k Ω RN2 C58 C57 Figure 17 - EB7820/24 Detail Schematic, Rev B -2.5 V SPT7820/24 C20 C21 C22 C23 C25 C27 C28 C29 C30 C31C24 -A5.2+A5+A5-A5.2 +A5 +D 5 +D 5 STEPSJ 9 SJ 10 SJ 11 R30 R31 R32 R33 R14 D A D V C C FemaleTerminal P1 (Top View) 3 2 -A5.2 RTN -D 5.2 +A5 -A5.2 +D 5789 +A5 RTN +D 5 RTN - D 5.2 RTN -A5.2 RTN -A5.2 RTN AGND Plane D GND Plane +D 5 RTN +D 5 -D 5.2 -D 5.2 RTN +A5 -A5.2 -A5.2 RTN POWER CONNECTOR Analog Digital CCLK Ω R12 51Ω FB2 FB1 D V C C FB3 SJ 2B SJ 2C 25 23 21 19 17 15 13 11 9 7 5 3 1 9 915 12 10 2 5 7 15 12 10 2 5 7 14 13 11 3 4 6 14 13 11 3 4 6 26 24 22 20 18 16 14 12 10 8 6 4 2 PJ2 123 54 7869 -A5.2+A5 R210 k Ω PJ1 NOTES = AGND= DGND= Probe Jac k= BNC= Solder Jumper Option= Test Point /LiteDiagLines MAX) VIN VRM VF BVS B D V C CVCCVEE AGN DVCC VF TVS T VEEAGN D 26 24 22 20 18 16 14 12 10 8 6 4 2 25 23 21 19 17 15 13 11 9 7 5 3 1

/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines /LiteDiagLines/LiteDiagLines/LiteDiagLines -1.2V MSB LSB -A5.2 ICL8069CCSQ2 CIN RS 18 17 COUT REFIN -A5.2 DAC OUT 13,2212 15 +A5 -A5.2 U11U10 7 +A5 -A5.2 C15 +A5-A5.2 TP1 AD9617 OP-07 200 150 150 1 k 20 k 2 3 10K C16 C13 D1C11 C10 10 k R5 15 k R2 R6 R7 R10 R9(TBD) C22 C21 2 3 C12 C23 C14 R11 R12 C24.1 µF .1 µF GND GND +D5 D11 D12 AD9713BAN EB7920/22EB7820/24 LE FB1 FB2 200R22 -A5.2 +A5 2 6 2 4 2 2 2 0 1 8 1 6 1 4 1 2 1 08642 25 23 21 19 17 15 13 11 9 7 5 3 1 2 5 2 3 2 1 1 9 1 7 1 5 1 3 1 1 97531 2 6 2 4 2 2 2 0 1 8 1 6 1 4 1 2 1 0 8642 28 1 2 3 4 5 6 7 8 9 10 11 C24.1 µF 21 25 7.5 k

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