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DetectorSlidePushRotaryPower Dual-in-line Package Type Easy to use mid-size vertical type push switch 2.2mm-travel Medium-sized Vertical TypeSPPH4 Style PC board mounting hole dimensions （Viewed from the direction A） SPPH430200 Japan Export With Without With 2Non shorting Latching Momentary Latching Momentary SPPH410100 SPPH410200 SPPH420100 SPPH430100 Location lug 100 6,000 Minimum order unit （pcs.）PolesChangeover timing Straight Snap-in Terminal typeOperation Product No. Product Line PC board Mounting method 2.2 Travel （mm） Total travel （mm） Dimensions drawing is for type with location lugs.Note 2.5 2.5 5.4 ø1.2 hole 6-ø0.9 hole For location lug Thickness of PC board t=1.6mm 2.5 6.5 3.3 11 2 0.8 8.5 (9.5) 183.5 0.3

5.4 PC board mounting

(0.2) 3.3 2.5 8.5 0.5 2.5 2.5 Terminal No. Terminal No. Terminal No. 2.2(Travel) 3(Total travel) A Unit:mm 12 3 4 5 6 ʢCommonʣ ʢCommonʣ Circuit Diagram （Viewed from Direction A） 0.3 (3.5) 5.4 Straight terminal 0.3 5.4 (3.5) Snap-in terminal Terminal Configuration Unit:mm ■ Typical Specifications Items Specifications Rating （max.） / （min.） （Resistive load） 0.1A 30V DC / 50BA 3V DC Contact resistance （Initial performance） 100mΩ max. Operating force 2±1N Operating life with load 10,000 cycles （0.1A 30V DC） Dimensions Refer to P.138 for soldering conditions. Number of packages （pcs.） Export package measurements （mm）1 case / Japan 1 case / export packing 1,20 0 6,000 400×270×290 Packing Specifications Bulk Horizontal Type Vertical Type With boss

DetectorSlidePushRotaryPowerDual-in-line Package Type List of Varieties Push Switches Vertical Type Series Vertical SPEH SPEG SPEJ SPPH2 SPPH4 SPPH1 Photo Dimensions （mm） W 6 7.19 7 6 6.5 10 D 6 8.39 7 6.5 8.5 10 H 5 3.5 5.95 6.5 8.5 Travel （mm） — — 1.7 1 2.2 1.5 Number of poles 1 1 2 2 Operating Life cycle Rating （max.） （Resistive load） 50mA 16V D C 1m A 5V DC 0.2A 14V DC 0.1A 12V D C 0.1A 30V DC Rating （min.） （Resistive load） 10μA 1V DC 50μA 3V DC — 50μA 3V DC Durability Operating life without load 100,000 cycles 400mΩ max. 30,000 cycles 500mΩ max. 10,000 cycles 15 0mΩ ma x . 10,000 cycles 50mΩ max. 10,000 cycles 100mΩ ma x . 10,000 cycles 40mΩ max. Operating life with load （at max. rated load） 100,000 cycles 400mΩ max. 30,000 cycles 500mΩ max. 10,000 cycles 15 0mΩ ma x . 10,000 cycles 50mΩ max. 10,000 cycles 100mΩ ma x . 10,000 cycles 40mΩ max. Electrical performance Initial contact Insulation resistance 100MΩ min. 100V DC 3MΩ min. 100V DC 100MΩ min. 500V DC 100MΩ min. 500V DC Voltage proof 250V AC f or 1minute 100V AC for 1minute 500V AC for 1minute 5 0 0V A C f or 1minute Mechanical performance Terminal strength — 0.5N for 1minute — 5N f or 1minute Actuator strength Operating direction 50N 49N 30N 50N Pulling Environmental performance Cold −40℃ 1 ,000h −20℃ 96h −40℃ 500h −20℃ 96h Dry heat 90℃ 1 ,000h 85℃ 96h 85℃ 500h 85℃ 96h Damp heat 60℃, 9 0 to 95% RH 1 ,000h 40℃, 9 0 to 95% RH 60℃, 9 0 to 95% RH 00h 40℃, 9 0 to 95%RH 96h Page 124 125 126 127 129 13 0 Push Switches Cautions Note

  • Indicates applicability to all products in the series.

DetectorSlidePushRotaryPowerDual-in-line Package Type Horizontal Type Vertical Type Soldering time SPEH Series Series Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement. 3. Temperature profile 300 200 100 A max. B E D Time (s) C Pre-heating F max. Room temperature Temperature (˚C ) 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Notes 260 Series（Reflow type） 230 40 180 15 0 120 SPEG SPEJ SPEF A（℃） 10 ±1s Soldering temperature Duration of immersionPreheating temperature Preheating time SPPJ2, SPPH1, SPED2, SPED4, SPEF SPUJ, SPPH2, SPPH4 SPUN SPPJ3 100℃ ma x . 60s max. 260±5℃ 5±1s 100℃ ma x . 60s max. 260±5℃ 10 ±1s — 260±5℃ 5±1s — 260±5℃ Items Dip soldering Reference for Dip Soldering (For PC board terminal types) 3 0 0 ±10 ℃SPUJ 3+1/0s 350℃ max.SPEH, SPPH2 SPEG, SPEF SPEJ SPED2, SPED4 SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 3 5 0 ±10 ℃ 3+1/0s 3 5 0 ±10 ℃ 3±0.5s 3 5 0 ±10 ℃ 4s max. 350±5℃ 3s max. 3s max. Soldering temperature Reference for Hand Soldering For PC board 端子タイプに適用 Push Switches Soldering Conditions