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DetectorSlidePushRotaryPowerDual-in-line Package Type SPPH1 1.5mm-travel Vertical Type Vertical push switch with two types of knob available Snap-in 4,000 Japan Export Poles Non shorting Changeover timing PC board Mounting method 2 N 3 N Operating force Latching Momentary Latching Momentary Latching Latching Latching Momentary Momentary Operation Product Line Straight Snap-in Straight Terminal type 100 Minimum order unit （pcs.） 1.5 Standard Standard Standard Short Short Short Travel （mm） knob style 2.5 Total travel （mm） SPPH110800 SPPH110300 SPPH120400 SPPH120100 SPPH130400 SPPH130100 SPPH140300 SPPH140100 Product No. SPPH110900 SPPH130500 SPPH140400 Drawing No. ■ Typical Specifications Items Specifications Rating （max.） / （min.） （Resistive load） 0.1A 30V DC / 50BA 3V DC Contact resistance （Initial/After operating life） 20mΩ max. / 40mΩ max. Operating force Refer to the products line Operating life Without load 10,000 cycles With load 10,000 cycles （0.1A 30V DC） Refer to P.138 for soldering conditions. Number of packages （pcs.） Export package measurements （mm）1 case / Japan 1 case / export packing 800 4,000 400×270×290 Packing Specifications Bulk Horizontal Type Vertical Type ＋1 −0.7 −0.7

DetectorSlidePushRotaryPower Dual-in-line Package Type SPPH1／1.5mm-travel Vertical Type Style 0.35 13.5 (0.2) 8.5 3.5 0.6 1.5 2.5 2.2 2 0.4 Travel Total travel Terminal No.4 A 2.5 2.55 (1.5) Travel 3.5 0.6 17.5 98.5 2.52.5 3.3 2.5 1.5 2.5 Total travel A 2-R0.5 Terminal No.4 0.35 (0.2) 2.5 3.3 (1.8) 2-R0.5 ø0.9 hole (5) 2.5 2.5 4.1 Thickness of PC board t=1.6mm ø0.9 hole 2.5 2.5 Straight terminal Snap-in terminal Dimensions Unit:mm PC board mounting hole dimensions （Viewed from the direction A）No. ø0.9 hole (5) 2.5 2.5 4.1 Thickness of PC board t=1.6mm ø0.9 hole 2.5 2.5 Straight terminal Snap-in terminal 0.35 (3.5) 3.9 0.35 0.8 1.9 2.8 (3.5) 12 3 45 6 Circuit Diagram （Viewed from Direction A） Straight terminal Snap-in terminal Terminal Configuration Unit:mm Horizontal Type Vertical Type

DetectorSlidePushRotaryPowerDual-in-line Package Type List of Varieties Push Switches Vertical Type Series Vertical SPEH SPEG SPEJ SPPH2 SPPH4 SPPH1 Photo Dimensions （mm） W 6 7.19 7 6 6.5 10 D 6 8.39 7 6.5 8.5 10 H 5 3.5 5.95 6.5 8.5 Travel （mm） — — 1.7 1 2.2 1.5 Number of poles 1 1 2 2 Operating Life cycle Rating （max.） （Resistive load） 50mA 16V D C 1m A 5V DC 0.2A 14V DC 0.1A 12V D C 0.1A 30V DC Rating （min.） （Resistive load） 10μA 1V DC 50μA 3V DC — 50μA 3V DC Durability Operating life without load 100,000 cycles 400mΩ max. 30,000 cycles 500mΩ max. 10,000 cycles 15 0mΩ ma x . 10,000 cycles 50mΩ max. 10,000 cycles 100mΩ ma x . 10,000 cycles 40mΩ max. Operating life with load （at max. rated load） 100,000 cycles 400mΩ max. 30,000 cycles 500mΩ max. 10,000 cycles 15 0mΩ ma x . 10,000 cycles 50mΩ max. 10,000 cycles 100mΩ ma x . 10,000 cycles 40mΩ max. Electrical performance Initial contact Insulation resistance 100MΩ min. 100V DC 3MΩ min. 100V DC 100MΩ min. 500V DC 100MΩ min. 500V DC Voltage proof 250V AC f or 1minute 100V AC for 1minute 500V AC for 1minute 5 0 0V A C f or 1minute Mechanical performance Terminal strength — 0.5N for 1minute — 5N f or 1minute Actuator strength Operating direction 50N 49N 30N 50N Pulling Environmental performance Cold −40℃ 1 ,000h −20℃ 96h −40℃ 500h −20℃ 96h Dry heat 90℃ 1 ,000h 85℃ 96h 85℃ 500h 85℃ 96h Damp heat 60℃, 9 0 to 95% RH 1 ,000h 40℃, 9 0 to 95% RH 60℃, 9 0 to 95% RH 00h 40℃, 9 0 to 95%RH 96h Page 124 125 126 127 129 13 0 Push Switches Cautions Note

  • Indicates applicability to all products in the series.

DetectorSlidePushRotaryPowerDual-in-line Package Type Horizontal Type Vertical Type Soldering time SPEH Series Series Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement. 3. Temperature profile 300 200 100 A max. B E D Time (s) C Pre-heating F max. Room temperature Temperature (˚C ) 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Notes 260 Series（Reflow type） 230 40 180 15 0 120 SPEG SPEJ SPEF A（℃） 10 ±1s Soldering temperature Duration of immersionPreheating temperature Preheating time SPPJ2, SPPH1, SPED2, SPED4, SPEF SPUJ, SPPH2, SPPH4 SPUN SPPJ3 100℃ ma x . 60s max. 260±5℃ 5±1s 100℃ ma x . 60s max. 260±5℃ 10 ±1s — 260±5℃ 5±1s — 260±5℃ Items Dip soldering Reference for Dip Soldering (For PC board terminal types) 3 0 0 ±10 ℃SPUJ 3+1/0s 350℃ max.SPEH, SPPH2 SPEG, SPEF SPEJ SPED2, SPED4 SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 3 5 0 ±10 ℃ 3+1/0s 3 5 0 ±10 ℃ 3±0.5s 3 5 0 ±10 ℃ 4s max. 350±5℃ 3s max. 3s max. Soldering temperature Reference for Hand Soldering For PC board 端子タイプに適用 Push Switches Soldering Conditions