SPI20N60C3 ISC | Alldatasheet

Document overview

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  • PDF pages: 3

Technical content

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark1 IscN-ChannelMOSFETTransistor SPI20N60C3

  • FEATURES
  • WithTO-262(I2PAK)package
  • Lowinputcapacitanceandgate charge
  • Highpeak current capability
  • Improvedtransconductance
  • 100% avalanchetested
  • MinimumLot-to-Lotvariations forrobustdevice performanceandreliable operation
  • APPLICATIONS
  • Switching applications
  • ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL PARAMETER VALUE UNIT VDSS Drain-SourceVoltage 600 V VGSS Gate-SourceVoltage ±30 V ID DrainCurrent-Continuous@TC=25℃ TC=100℃ 20.7 13.1 A IDM DrainCurrent-SinglePulsed 62.1 A PD TotalDissipation 208 W Tj OperatingJunctionTemperature -55~150 ℃ Tstg StorageTemperature -55~150 ℃
  • THERMALCHARACTERISTICS SYMBOL PARAMETER MAX UNIT Rth(ch-c) Channel-to-casethermalresistance 0.6 ℃/W Rth(ch-a) Channel-to-ambientthermalresistance 62 ℃/W

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark2 IscN-ChannelMOSFETTransistor SPI20N60C3 ELECTRICALCHARACTERISTICS TC=25℃ unlessotherwisespecified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT BVDSS Drain-SourceBreakdownVoltage VGS=0V;ID=0.25mA 600 V VGS(th) GateThresholdVoltage VDS=±30V;ID=1mA 3 3.9 V RDS(on) Drain-SourceOn-Resistance VGS=10V;ID=13.1A 160 190 mΩ IGSS Gate-SourceLeakageCurrent VGS= ±30V;VDS=0V ±0.1 μA IDSS Drain-SourceLeakageCurrent VDS=600V;VGS=0V;TJ=25℃ TJ=125℃ 100 μA VSDF Diodeforwardvoltage ISD=20.7A,VGS =0V 1.2 V

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark3 IscN-ChannelMOSFETTransistor SPI20N60C3 DIMENSIONALDRAWING