SPG2336E-G

SPG2336E-G KODENSHI | Alldatasheet

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AUK CORP . SPG2336E-G The contents of this data sheet are subject to change without advance notice for the purpose of improvement. When using this product, would you please refer to the latest specifications. R ev .Odat e:0 8- A U G -1 1 A UK-L DM-0 01 (A) 1. Features ◆ Colorless transparency lens type ◆ Using a package with high heat dissipation properties, it can be driven with a large current ◆ Wide viewing angle ◆ Encapsulating Resin : Silicone Resin ◆ External dimensions : 3.5(L)×2.8(W)×1.9mm(T) surface mount type ◆ E ; ESD Protected (±2.0KV, 3 Times @100pF, 1.5KΩ) 2. Applications ◆ Backlighting ◆ Signal indicator ◆ Symbol backlighting ◆ Front panel indicator 3. Outline Dimensions unit : mm 1.60± 0.1 3.20± 0.05 2.40± 0.1 1.50± 0.1 20.80± 0.1 0.30± 0.1 1.00± 0.1 2.20± 0.05 0.80± 0.05 0.75± 0.1 3.5± 0.1 Recommended Soldering Pattern Anode Cathode PIN Connections 1. Anode 2. Cathode

AUK CORP . SPG2336E-G The contents of this data sheet are subject to change without advance notice for the purpose of improvement. When using this product, would you please refer to the latest specifications. R ev .Odat e:0 8- A U G -1 1 A UK-L DM-0 01 (A) 4. Absolute Maximum Ratings (Ta=25 oC) Characteristic Symbol Rating Unit Power dissipation PD 110 mW Forward current IF 30 mA *1 Peak forward current IFP 50 mA Operating temperature range Topr -40 ∼ 100 ℃ Storage temperature range Tstg -40 ∼ 110 ℃ *2 Soldering temperature Tsol 240 ℃ for 10 seconds *1.Duty ratio = 1/16, Pulse width = 0.1ms *2.Recommended reflow soldering temperature profile - Preheating 150 ℃ to 185 ℃ within 120 seconds soldering 240℃ within 10 seconds Gradual cooling (Avoid quenching) max. 10sec Temp ( ℃ ) Time (sec) 185 150 240 Peak Temp max. 240 Preheating area 150~185 ℃ , 90±30sec max. 3 ℃ /sec 25 Time from 25 ℃ to Peak Temperature max. 6min Solder area 220 ℃ , max. 60sec max. 4 ℃ /sec max. -6℃ /sec 240 180 150 60 0

AUK CORP . SPG2336E-G The contents of this data sheet are subject to change without advance notice for the purpose of improvement. When using this product, would you please refer to the latest specifications. R ev .Odat e:0 8- A U G -1 1 A UK-L DM-0 01 (A) 5. Electrical / Optical Characteristics (Ta=25 oC) Characteristic Symbol Test Condition Min Typ Max Unit Forward voltage VF I F= 20mA 2.75 - 3.6 V *3 Luminous intensity IV IF= 20mA 220 - 550 mcd Dominant wavelength λ D IF= 20mA 520 525 530 nm Spectrum bandwidth ∆λ IF= 20mA - 30 - nm *4 Half angle θ /2 IF= 20mA - ±60 - deg *3.The test result of I F=20mA is only for reference *4.θ /2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity ◆ VF / I V / λ D Grade Classification (Ta=25 ℃ ) Test Condition @ I F=20mA Forward Voltage [V] Luminous Intensity [mcd] Dominant Wavelangth [nm] 1 : 2.75~3.0 N : 220~310 a : 520~525 2 : 3.0~3.2 O : 310~410 3 : 3.2~3.4 b : 525~530 P : 410~550 4 : 3.4~3.6 (Each VF, IV, λ D range did not consider a margin. Please refer to ±0.1V of VF range, ±18% of IV range, ±1nm of λ D range as a permitted limit and do not use to combine grade classification. It must be used separately grade classification)

AUK CORP . SPG2336E-G The contents of this data sheet are subject to change without advance notice for the purpose of improvement. When using this product, would you please refer to the latest specifications. R ev .Odat e:0 8- A U G -1 1 A UK-L DM-0 01 (A) /uni25AA Precaution for handling Silicone Resin LED

• The encapsulated resin of the LEDs is silicone. So LEDs have a soft surface on the top of the package. The pressure to the top surface will be influence to the reliability of the LEDs. Precaution should be taken to avoid the strong pressure on the encapsulated part.
• Housings using a silicone resin attract dust more compared to standard encapsulation. It is recommended that a suitable cleaning solution must be applied to the surface after soldering. 1. Handling indications 1) When users handle the SMT LEDs, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 2) LED should only be handled from the side. Silicone resin is softer than generally used Epoxy resin. 3) When users operate the chip lifter, the picking up nozzle which does not affect the soft surface should be used. This is assured by choosing the picking up nozzle which is larger than the LED reflecting area. 2. Cleaning indication 1) It is strongly recommended that isopropyl alcohol be used as a solvent. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. 2) Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre- test should be done to confirm whether any damage to the LEDs will occur.

AUK CORP . SPG2336E-G The contents of this data sheet are subject to change without advance notice for the purpose of improvement. When using this product, would you please refer to the latest specifications. R ev .Odat e:0 8- A U G -1 1 A UK-L DM-0 01 (A) 6. Characteristic Diagrams Fig.4 Spectrum Distribution Fig. 3 I F – Ta Wavelength λ [nm] Fig. 1 I F - VF Fig. 2 I V - IF Forward Current I F [mA] Relative Intensity [%] Forward Voltage V F [V] Forward Current I F [mA] Forward Current I F [mA] Luminous Intensity I v [mcd] Fig. 5 Radiation Diagram 1 0 0 5 0 5 0 0 1 0 0 Relative Luminous Intensity Iv [%] Ambient Temperature Ta [ ℃ ]