SPF7302

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SANKEN ELECTRIC CO., LTD. http://www.sanken-ele.co.jp/en/ SPF7302

Description

The SPF7302 is a fully protected, single chip full-bridge driver IC for DC brush motor applications. The various protection c i r c u i t s i n t e g r a t e d a r e : o v e r v o l t a g e p r o t e c t i o n ( O V P ) ; overcurrent protection (OCP) with latch, which is adapted to the DMOSFETs in each full bridge; undervoltage lockout (UVLO); open load detection; and overcurrent limitation. The package is a thermally enhanced 16-pin HSOP power package with an exposed thermal pad on the bottom side of the package. Features and Benefits ▪ Supply voltage, VBB , 36 V maximum ▪ Maximum DC current 3 A continuous, 6 A pulsed (1 kHz, duty cycle < 1%, pulse width < 10 μs) ▪ RDS(on) = 300 mΩ maximum, at TJ = 125ºC ▪ Operation modes: forward, reverse, brake (high- or low- side freewheeling current circulation) ▪ Output disable pin (DI pin) ▪ Protections: ▫ Overvoltage protection (OVP), 36 V minimum ▫ Overcurrent protection (OCP), 3 A typical ▫ Overcurrent limitation (OCL), 6 A typical ▫ Externally adjustable delay timer to halt OCL ▫ Thermal shutdown protection (TSD), 151°C minimum ▫ Undervoltage lockout on VBB (UVLO), 4.2 V minimum ▫ Open load detection at startup ▪ Diagnosis output linked to OVP, OCP, TSD, UVLO, and open load detection, at startup and in operation Full Bridge DC Motor Driver Functional Block Diagram Package: 16 pin HSOP with exposed thermal pad and tabs Not to scale Open Circuit Detection Diag OUT1 VBB VBB VBB OUT2 Open Circuit Detection Low-Side Gate Driver High-Side Gate Driver with OVPLow-Side Gate Driver Low-Side OCP Low-Side OCL High-Side OCP High-Side OCL Pre- Regulator IN1 IN2 DI Diagnostics OVP UVLO TSD IN1 IN2 DI High-Side Gate Driver with OVP Diag Diag VREF Diag Diag Diag Diag Diag CP HS1 HS2 LS1 LS2 VBB VBB PGND PGNDLGNDDLY DIAG SPF7302

SANKEN ELECTRIC CO., LTD. SPF7302DS Full Bridge DC Motor DriverSPF7302 Selection Guide Part Number Package Packing SPF7302 Thermally enhanced surface mount (HSOP), 16-pin Minimum quantity 1400 pieces All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature, T A, of 25°C, unless oth er wise stated. Number Name Description

1 LGND Logic GND

2 IN2 Input pin 2

3 IN1 Input pin 1

4 DI Disable pin

5 VBB Supply input voltage

6 VBB Supply input voltage

7 OUT2 Output 2

8 PGND Power GND

9 PGND Power GND

10 OUT1 Output 1

11 VBB Supply input voltage

12 VBB Supply input voltage

13 CP Charge pump capacitor pin

14 DLY Overcurrent limitation delay setting input pin

15 DIAG Diagnostics output pin

16 LGND Logic GND

Absolute Maximum Ratings at TA = 25°C Characteristic Symbol Notes Rating Unit Supply Voltage V BB –0.3 to 36 V IN1, IN2, DI, and DLY Pin Input Voltage V x –0.3 to 6 V Output Current IO ±3 A IOpeak Continuous: 1 kHz, duty cycle <1%; pulse: < 10 μs± 6 A DIAG Pin Output Voltage V DIAG –0.3 to 6 V DIAG Pin Input Current I DIAG DIAG pin sink current –2 mA CP Pin Voltage V CP –0.3 to 36 V Power Dissipation PD1 With infinite heatsink 39 WPD2 Mounted on glass epoxy PCB, 50 mm × 74 mm × 1.6 mm; 0.5 oz copper (18 μm thick) exposed copper area 4 Junction Temperature T J –40 to 150 ºC Operating Ambient Temperature T A –40 to 105 ºC Storage Temperature T stg 40 to 150 ºC Thermal Resistance, Junction to Case R θJC Mounted on glass epoxy PCB, 50 mm × 74 mm × 1.6 mm; 0.5 oz copper (18 μm thick) exposed copper area 3.2 °C/W Thermal Resistance, Junction to Ambient R θJA 31 °C/W

SANKEN ELECTRIC CO., LTD. SPF7302DS Full Bridge DC Motor DriverSPF7302 ELECTRICAL CHARACTERISTICS1 valid at TJ = –30°C to 125°C, VBB = 14 V, VDI = 5 V, CCP = 47 nF, RDIAG = 5.1 kΩ, unless otherwise specified Characteristic Symbol Test Conditions Min. Typ. Max. Unit Supply Voltage V BB 6 – 18 V OUTx Pin Leakage Current IleakHS –1 – – mA IleakLS ––1m A DMOSFET On Resistance RDS(ON_1H IOUT = 1 A – – 300 m Ω RDS(ON)_2H IOUT = 3 A – – 300 m Ω RDS(ON)_1L IOUT = 1 A – – 300 m Ω RDS(ON)_2L IOUT = 3 A – – 300 m Ω DMOSFET Body Diode Forward Voltage VF_H1 IOUT1 = 1 A – 1.0 2.0 V VF_H2 IOUT2 = 1 A – 1.0 2.0 V VF_L1 IOUT1 = –1 A – 1.0 2.0 V VF_L2 IOUT2 = –1 A – 1.0 2.0 V Quiescent Current I BB –7–m A Overcurrent Limit (OCL) IOCL_H1 TJ = –40°C to 150°C, IOCL < IOCP ; guaranteed by design 2.0 3.0 4.5 A IOCL_H2 2.0 3.0 4.5 A IOCL_L1 2.0 3.0 4.5 A IOCL_L2 2.0 3.0 4.5 A Overcurrent Protection (OCP) IOCP_H1 TJ = –40°C to 150°C, IOCL < IOCP ; guaranteed by design 4.5 6.0 8.0 A IOCP_H2 4.5 6.0 8.0 A IOCP_L1 4.5 6.0 8.0 A IOCP_L2 4.5 6.0 8.0 A IN1, IN2, DI, and DLY Pin Input Voltage Vx_H 3.0 – 5.3 V Vx_L –0.3 – 1.5 V IN1, IN2, DI, and DLY Pin Input Current Ix_H VDLY = 5 V – 100 200 μA Ix_L VDLY = 0 V –1 – 1 μA DIAG Pin Output Voltage VDIAG_H VCC = 5 V 4.0 – – V VDIAG_L Isink = 2 mA – – 0.4 V DIAG Pin Output Current IDIAG_H VCC = 5 V, DIAG pin source current –250 – – μA IDIAG_L VCC = 5 V, DIAG pin sink current, VDIAG = 2 V – – 3 mA IN1 and IN2 Pin Input Propagation Time tINx_ON Delay from VINx = 2 V→VOUTx × 0.2 – 7 15 μs tINx_OFF Delay from VINx = 1.5 V→VOUTx × 0.8 – 7 15 μs Output Rise Time t rx Delay from VOUTx = 20%→80% points, at IOUTx = 1 A – 0.5 2 μs Output Fall Time t fx Delay from VOUTx = 20%→80% points, at IOUTx = 1 A – 0.5 2 μs Continued on the next page…

SANKEN ELECTRIC CO., LTD. SPF7302DS Full Bridge DC Motor DriverSPF7302 DLY Pin Threshold Voltage V DLY(th) Overcurrent limitation (OCL) activating voltage 1.4 1.6 1.8 V DLY Pin Sourcing Current2 IDLY 15 30 60 μA UVLO Releasing Voltage V UVLO_OFF – – 5.2 V UVLO Activating Voltage V UVLO_ON 4.2 – – V UVLO Hysteresis V UVLOhys – 0.2 – V OVP Protection Activating Voltage V OVP_ON 36 – 42 V OVP Protection Releasing Voltage V OVP_OFF 32 – 38 V OVP Hysteresis V OVPhys –5– V Thermal Shutdown Activating Temperature3 TTSD_ON Starts at 165°C typical; guaranteed by design 151 165 – ºC Thermal Shutdown Releasing Temperature3 TTSD_OFF Guaranteed by design 136 150 – ºC Thermal Shutdown Hysteresis3 TTSDhys Guaranteed by design – 15 – ºC 1The parameters at TJ = –40ºC to 150ºC are specified by design. The actual production tests are done at 25ºC and 125ºC. 2The individual overcurrent limitation of each DMOSFET is masked during the delay period. Therefore, ensure proper thermal design for dissipating transient temperature increase caused by current during this period. 3TSD (thermal shutdown protection starts at 165ºC typical, and it is specified by design. ELECTRICAL CHARACTERISTICS1 (continued) valid at TJ = –30°C to 125°C, VBB = 14 V, VDI = 5 V, CCP = 47 nF, RDIAG = 5.1 kΩ, unless otherwise specified Characteristic Symbol Test Conditions Min. Typ. Max. Unit Motor Control Truth Table1 Reference Number Status Input Output DMOSFET status DI IN1 IN2 OUT1 OUT2 DIAG HS1 LS1 HS2 LS2

1 Forward rotation 2 H H L H L H ON OFF OFF ON

2 Reverse rotation 2 H L H L H H OFF ON ON OFF

3 Low-side freewheeling H L L L L H OFF ON OFF ON

4 High-side freewheeling H H H H H H ON OFF ON OFF

5 Output disabled L X X Z Z H OFF OFF OFF OFF

6 Overcurrent limitation (OCL) active (HS1) H H X H X H ON OFF X X

7 Overcurrent limitation (OCL) active (HS2) H XHXHHX X O N O F F

8 Overcurrent limitation (OCL) active (LS1) H L X L X H OFF ON X X

9 Overcurrent limitation (OCL) active (LS2) H X L X L H X X OFF ON

10 Overcurrent protection with latch (OCP) active (HS1) H H X Z Z L OFF OFF OFF OFF

11 Overcurrent protection with latch (OCP) active (HS2) H X H Z Z L OFF OFF OFF OFF

12 Overcurrent protection with latch (OCP) active (LS1) H L X Z Z L OFF OFF OFF OFF

13 Overcurrent protection with latch (OCP) active (LS2) H X L Z Z L OFF OFF OFF OFF

14 Undervoltage lockout (UVLO) protection active X X X Z Z L OFF OFF OFF OFF

15 Overvoltage protection (OVP) active X X X X X L XXXX

16 Open load detected at startup L X X X X L OFF OFF OFF OFF

17 Open load detected in operation H X X X X L XXXX

18 Thermal shutdown protection (TSD) active X X X Z Z L OFF OFF OFF OFF

1X is "don't care," Z is high impedance. 2"Forward" and "reverse" only indicate opposite relative direction.

SANKEN ELECTRIC CO., LTD. SPF7302DS Full Bridge DC Motor DriverSPF7302 1.0 0.8 0.6 0.4 0.2 0123 0123 VBB to OUTx (V) 01 0 2 0 3 0 4 0 High-side DMOSFET RDS(on) Low-side DMOSFET R DS(on) High-side DMOSFET R DS(on) Low-side DMOSFET R DS(on) Quiescent Current versus Supply Voltage CP Pin Voltage versus Supply Voltage TA= –40°C 25°C 150°C TA= –40°C 25°C 150°C VCC= 14 V 6 V 5.5 V TA= –40°C 25°C 150°C 1.0 0.8 0.6 0.4 0.2 0123 0123 1.0 0.8 0.6 0.4 0.2 1.0 0.8 0.6 0.4 0.2 IQ (mA) VBB (V) IOUT (A) VBB to OUTx (V) IOUT (A) OUTx to PGND (V) IOUT (A) OUTx to PGND (V) IOUT (A) 01 0 2 0 3 0 4 0 VBB (V) VCP (V) VCC= 14 V 6 V 5.5 V Characteristic Performance TA = 25°C unless otherwise specified

SANKEN ELECTRIC CO., LTD. SPF7302DS Full Bridge DC Motor DriverSPF7302 01 3 25 4 01 3 25 4 VOUT1 (V) 0.6 0.5 0.4 0.3 0.2 0.1 0123 DI Pin Threshold Characteristics DIAG Output versus DI SInk Current UVLO Voltage versus Supply Voltage TA= –40°C 25°C 150°C TA= –40°C 25°C 150°C 02 8 641 0 200 100 02 8 641 0 200 100 VDIAG (V) IDI(SINK) (mA) VDI (V) VOUT1 (V) INx Pin Threshold Characteristics DI Pin Current Characteristics INx Pin Current Characteristics VIN (V) VDI (V) VIN (V) IDI(SINK) (μA) IIN(SINK) (μA) 0246 VBB (V) VUVLO (V) TA= –40°C 25°C 150°C

SANKEN ELECTRIC CO., LTD. SPF7302DS Full Bridge DC Motor DriverSPF7302 25 30 35 45 40 100 140 120 180 160 VDIAG (V) VDIAG (V) DIAG Output Voltage with OVP Activated (IC continues operation) DIAG Output Voltage with TSD Activated (IC stops operation) Output Rise Time, t RX Output Fall Time, tFX VINX = 2 V/div t = 2 μs/div VOUTX = 2 V/div 160 ns VBB (V) Input to Output On Propagation Delay, t INx_ON VINX = 2 V/div t = 2 μs/div VOUTX = 2 V/div VINX = 2 V/div t = 50 ns/div VOUTX = 2 V/div VINX = 2 V/div t = 100 ns/div VOUTX = 2 V/div Input to Output Off Propagation Delay, t INx_OFF TJ (C°) 140 ns 7.9 μs7.8 μs

SANKEN ELECTRIC CO., LTD. SPF7302DS Full Bridge DC Motor DriverSPF7302 DLY Voltage versus INx Pin Voltage IOUTX = 1 A/div t = 100 μs/div VOUTX = 10 V/div High-side DMOSFET OCL Operation Example Low-side DMOSFET OCL Operation Example High-side DMOSFET OCP Operation Example Low-side DMOSFET OCP Operation Example t = 100 μs/div VOUTX = 10 V/div IOUTX = 2 A/div VINX = 5 V/div t = 10 μs/div VDLY = 0.5 V/div 1.6 V 3.4 A 6.9 A t = 100 μs/div VOUTX = 10 V/div IOUTX = 2 A/div 7.1 A IOUTX = 1 A/div t = 100 μs/div VOUTX = 10 V/div 4.0 A

SANKEN ELECTRIC CO., LTD. SPF7302DS Full Bridge DC Motor DriverSPF7302 Package Outline Drawing, 16 Pin HSOP Branding codes (exact appearance at manufacturer discretion): 1st line, type: SPF7302 2nd line, lot: YMDD Where: Y is the last digit of the year of manufacture M is the month ( 1 to 9, O, N, D) DD is the date Package: HSOP-16 Dimensions in millimeters 10.5 ±0.2 12.2 ±0.2 7.50 ±0.2 2 ±0.2 1 ±0.3 1.35 ±0.2 10.5 ±0.3 2.5 ±0.2 0.25 +0.15 –0.05 0.1 0.4 +0.15 –0.05 (3.05) (4.7) 1.27±0.25 Branding Area Exposed thermal pad Tab from exposed thermal pad XXXXXXXX XXXXXXXX View A Enlargement View A(8.89) 0.8) A Leadframe plating Pb-free. Device composition complies with the RoHS directive.

SANKEN ELECTRIC CO., LTD. SPF7302DS Full Bridge DC Motor DriverSPF7302 90 to 120s 30s 60s 245 230 200 150 Temperature (ºC) Duration (s) 4 ºC/s Solder Reflow Profile Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage

• Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40% to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
• Avoid locations where dust or harmful gases are present and avoid direct sunlight.
• Reinspect for rust on leads and solderability of the products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are within the ratings specified by Sanken for the products. Soldering
• When soldering the products, please be sure to minimize the working time, and any soldering iron should be kept at a distance from the body of the product.
• The number of reflow procedures is restricted to two only. Device reliability and appearance are guaranteed within the temperature profile below, after storage conditions of up to 168 hours at T A = 85ºC and RH = 85%. Electrostatic Discharge
• When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
• Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats.
• When using measuring equipment such as a curve tracer, the equipment should be grounded.
• When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products.
• The products should always be stored and transported in Sanken shipping containers or conductive containers, or be wrapped in aluminum foil.

SANKEN ELECTRIC CO., LTD. SPF7302DS Full Bridge DC Motor DriverSPF7302

• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod- ucts herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semicon- ductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equip- ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is requi red (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the de gree of derating of junction temperature affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribu- tion network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.