SPF6001 SANKEN | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 1
Technical content
■Features
- 150V breakdown voltage bootstrap circuit drive system
- Charge pump circuit/ Auxiliary power mounted
- Sanken original power surface mount ■Absolute maximum ratings Item Symbol Ratings Unit Remark DC input voltage VBB -0.6 ～ 35 V 40V T<400mS VREG Power supply voltage for gate pin control VREG -0.6 ～ 18 V Power supply voltage for logic circuit VDD -0.3 ～ 6 V Input pin control voltage HI,LO,EN -0.3 ～ 6 V L/S LS pin breakdown voltage LS -4 ～ 4 V L/S GL pin breakdown voltage GL -4 ～ 18 V H/S S pin breakdown voltage S -4 ～ 110 V H/S GH pin breakdown voltage GH -4 ～ 110 V H/S C pin breakdown voltage C -0.3 ～ 110 V FLT pin breakdown voltage VFLT -0.3 ～ 6 V CP1 pin breakdown voltage CP1 -0.3 ～ 18 V CP2 pin breakdown voltage CP2 -0.3 ～ 18 V Power dissipation PD1 18.6 W With infinite heat sink PD2 2.97 W *1 Junction temperature Tj -40 ～ 150 ℃ Operating ambient temperature Top -40 ～ 105 ℃ Storage temperature Tstg -40 ～ 150 ℃ Thermal resistance (Junction to Case) Θj-ｃ 6.7 ℃/W Thermal resistance (Junction to Ambient) Θj-ａ 42 ℃/W *1 When use glass epoxy + copper foil board (Size: 5.0×7.4cm, t: glass epoxy=1.6mm, copper foil=18μm) ■Electrical characteristics (Tj=25℃) ■Package ■Circuit block diagram ■Typical connection diagram ■Timing chart 150V breakdown voltage half bridge pre-driver IC SPF6001 (Auxiliary power mounted) Exclude gate remain dimension Fin thickness From backside to lead roots