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Surface mountable lead-free soldering push switch. Surface Mount Type Push Switch SPEF Series Push Switch 1A 14.5V DC 3N,5N 100NЊ NBY Rating (max) (Resistive load) Items Specifications Initial contact resistance Operating force 30,000cyclesOperating lifeʢWithout loadʣ 1-pole,2-positionsPoles-Positions Typical Specifications Taping Specifications (Taping Packaging) Reel Size ø380 33.5 Unit:mm 165 660 1,320 32 Number of packagesʢpcs.ʣ Tape width ʢmmʣ1 reel 1 case /Japan 1 case /export packing Please place purchase orders per minimum order unit (integer). Note Non shorting Latching SPEF210101 SPEF110100 SPEF210200 SPEF110200 Operating force 1.5 Travel ʢmmʣ Changeover timing Reflow Dip Reflow Dip Terminal typeOperating Product No. Product Line PC board Mounting method Total travel ʢmmʣ 2.7 Drawing No. 1,320 2,100 1,320 2,100 Minimum order unit ʢpcs.ʣ

3.5 9.4 2.5 ø 1.4 ø 0.9 14.6 1.3 9.8 12.2 3.2 3.5 13.1 6.9 11.86 1.2 3.5 2.5 2.52.5 5.7 6.7 A Terminal No. C Terminal No.1 Terminal No.2 PC board mounting face Lock position Full stroke position 106 Horizontal Type Vertical Type Detector Push Slide Rotary Encoders Power Dual-in-line Package Type TACT Switch TM Custom- Products Circuit DiagramʢViewed from Direction Aʣ C /K39/K2E/K38 /K36 /K36/K2E/K37 /K35/K2E/K37 /K31/K32/K2E/K32 /KBF/K31/K2E/K36 ʢ/K68/K6F/K6C/K65 ʣ /KBF/K31/K2E/K31 ʢ/K68/K6F/K6C/K65 ʣ /K34/K2D/KBF/K31/K2E/K33 ʢ/K68/K6F/K6C/K65 ʣ /K32/K2D/KBF/K31/K2E/K35 ʢ/K68/K6F/K6C/K65 ʣ /K31/K2E/K32 /K31/K2E/K32 /K32/K2E/K31 /K32/K2E/K31 /K32 /K34/K2E/K36 /K32/K2E/K35 /K31/K33/K2E/K36 /K39/K2E/K34 /K33/K2E/K35 /KBF/K31/K2E/K34 /K31/K34/K2E/K36/K31/K2E/K33 /K36/K2E/K39 /K31/K33/K2E/K31 /K31/K31/K2E/K38/K36 /K36 /K32/K2E/K35/K32/K2E/K35 /K32/K2E/K35 /K31/K31/K2E/K33 /K33/K2E/K35 /K39 /K36/K2E/K37 /K54 /K65/K72/K6D/K69/K6E/K61/K6C /K4E/K6F/K2E 1 /K54 /K65/K72/K6D/K69/K6E/K61/K6C /K4E/K6F/K2E 2 /K54 /K65/K72/K6D/K69/K6E/K61/K6C /K4E/K6F/K2E C /K41 /KBF/K30/K2E/K39 /K46/K75/K6C/K6C /K73/K74/K72/K6F/K6B/K65 /K70/K6F/K73/K69/K74/K69/K6F/K6E /K4C/K6F/K63/K6B /K70/K6F/K73/K69/K74/K69/K6F/K6E No. Reflow Soldering Type Dimensions Unit:mm Style PC board mounting hole dimensions Dip Soldering Type /KBF/K31/K2E/K31 ʢ/K68/K6F/K6C/K65 ʣ /KBF/K31/K2E/K36 ʢ /K68/K6F/K6C/K65 ʣ /K31/K2E/K38 /K37/K2E/K34 /K38/K2E/K38/K35 /K31/K32 /K30/K2E/K33 /K33/K2E/K37 /K39/K2E/K35 /K31/K34/K2E/K33 /K36 /K36/K2E/K37 Surface MountType Push Switch SPEF Series Push Switch

10,000cycles 100mЊ max. Operating life without load 10,000cycles 40mЊ max. 10,000cycles 50mЊ max. 30,000cycles 100mЊ max.Operating life without load Load:as rating List of Varieties 10199 SPECSPPH1SPPH4 14 13.5 16.8 26.7 20.7 18 18.2 ʕ 4.5 3.8 1.5 2.7 9.4 6.912.5 2.5 3.4 1210 1.5 2.5 8.5 6.5 8.5 ʵ10˚C to ʴ60˚C 102 103 105 SPED2 SPED3 SPED4 SPED5 SPEF 2.2 1. ˞3. Applicable to SPED220200ʢPC board typeʣonly. 2. ˞4. Applicable to SPEF110100 only. Notes ˔ 1VTI4XJUDIFT"UUBDIFE1BSUT ʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜ ˔ 1VTI4XJUDIFT1SPEVDUT$BVUJPO ʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜ 260ˆ max. 5s max. 260ʶ5ˆ 10ʶ1s 350ʶ10ˆ 3ʶ0.5s ˞ ʕ 350ʶ10ˆ 3ʶ0.5s ʕ 260ʶ5ˆ 10ʶ1s ˞ ʕ 260ʶ5ˆ 10ʶ1s 350ʶ5ˆ 3s max. 260ʶ5ˆ10ʶ1s ˞ʕ 350ʶ10ˆ 260ʶ5ˆ 5ʶ1s Please see P.108 100MЊ min. 500V DC 3N for 1minute 500V AC for 1minute 50N –20ʶ2ˆ for 96h 85ʶ2ˆ for 96h 40ʶ2ˆ, 90 to 95%RH for 96h ʕ 50N 10N 30N 5N for 1minute 20mЊ max. 30mЊ max. 100mЊ max. ʵ40˚C to ʴ85˚C 3MЊ min. 500V DC 3MЊmin. 100VDC 100V AC for 1minute 90N 30N –40ʶ2ˆ for 96h 100mЊ max. Series Photo Travelʢmmʣ Total travel ʢmmʣ Number of poles Dimensions ʢmmʣ Page W D H Dip soldering Reflow soldering Manual soldering Soldering Operating temperature rangeMechanical performanceEnvironmental performance Initial contact resistance Insulation resistance Voltage proof Terminal strength Operating direction Pulling direction Cold Dry heat Damp heat Actuator strength Electrical performance 1A 14.5V DC 0.1A 30V DC 50BA 3V DC Ratingʢmax.ʣʢResistive loadʣ Ratingʢmin.ʣʢResistive loadʣ

Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 П CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement. 3. Temperature profile 300 200 100 A max. B E D Time (s) C Pre-heating F max. Room temperature Temperature (˚C ) 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Notes SeriesʢReflow typeʣ SPEE SPEF, SPEG 230 40 180 150 120260 Aʢˆʣ 3s max. Bʢˆʣ Cʢsʣ Dʢˆʣ Eʢˆʣ Fʢsʣ Push Switches