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Technical content

Features

  • EMI filtering of frequencies from 800MHz to 3GHz
  • Greater than -30dB attenuation (TYP) at 1GHz
  • ESD, IEC61000-4-2, ±30kV contact, ±30kV air
  • Small, low-profile UDFN package (TYP 0.5mm height)
  • Keypad interface for portable electronics
  • LCD and camera display interfaces for handsets
  • Connector interfaces for portable electronics
  • Mobile phone
  • Smartphone
  • Portable navigation device Pinout 5 8 1 4 1 6 7 12 GND GND SP6002-04UTG-1 SP6002-06UTG-1 UDFN-08 UDFN-12 Functional Block Diagram Cd Cd Cd Cd Cd Cd Cd Cd Cd Cd 1 12 Cd Cd 2 11 Cd Cd 3 10 Cd Cd 4 9 Cd Cd 5 8 Cd Cd SP6002-04UTG-1 SP6002-06UTG-1 RoHS Pb GREEN Signal Ground Outside World SP6002-04UTG (µDFN) LCD Module Controller Input GND SP6002 Series 15pF 30kV EMI Filter Array

©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 142 TVS Diode Arrays (SPA™ Family of Products) Revision: June 27, 2011 SP6002 Series ESD and EMI Filter Devices - SP6002 Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -60 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM 6.0 V Breakdown Voltage VBR IR=1mA 7. 0 7. 8 8.5 V Reverse Leakage Current I LEAK VRWM=5V 0.1 1. 0 µA Resistance RA IR=10mA 85 100 115 Ω Diode Capacitance1,2 CD VR=2.5V ,f=1MHz 15 pF Line Capacitance1,2 CL VR=2.5V ,f=1MHz 24 30 36 pF ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Cutoff Frequency3 F-3dB Above this frequency, appreciable attenutation occurs 100 MHz Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 Total line capacitance is two times the diode capacitance (CD). 3 50Ω source and 50Ω load termination Analog Crosstalk (S41)Insertion Loss (S21) 3.000 000MHz Stop 6 000.000.000MHz Start 21 log MA G5 dB/ REF 0 dB 1 _:-613 dBCH1 S Cor Smo START 3.000 000 MHz STOP 6 000.000 000 MHz Smo Cor Del CH1 S log MAG 10 dB/ REF 0 dB

143©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: June 27, 2011 SP6002 Series SP6002 ESD and EMI Filter Devices - SP6002 Series Line Capacitance vs. DC Bias DC Bias (V) Capacitance (pF) Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13.

Ordering Information

Part Number Package Size Marking Min. Order Qty. SP6002-04UTG-1 uDFN-08 1 .7x1 .35mm KH4 3000 SP6002-06UTG-1 uDFN-12 2.5x1 .35mm KH6 3000 Part Numbering System Part Marking System SP 6002 0x U T G -1 Series Package UDFN-08 (1.7x1.35mm) UDFN-12 (2.5x1.35mm) T= Tape & Reel G= Green Number of Channels 04 = 4 Channel UDFN-08 06 = 6 Channel UDFN-12 Silicon Protection Array (SPA TM Family of TVS Diode Arrays KH4 KH6 J H x Product Series K = SP6002 Assembly Site 4 = UDFN-08 6 = UDFN-12

©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 144 TVS Diode Arrays (SPA™ Family of Products) Revision: June 27, 2011 SP6002 Series ESD and EMI Filter Devices - SP6002 Series Package Dimensions — UDFN-08 UDFN-08 Millimeters Inches Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 A3 0.127 REF 0.005 REF b 0.15 0.25 0.006 0.010 D 1 .60 1 .80 0.063 0.071 D2 1. 10 1 .30 0.043 0.051 E 1 .25 1 .45 0.049 0.057 E2 0.30 0.50 0.012 0.020 e 0.400 BSC 0.016 BSC K 0.20 0.008 0.000 L 0.15 0.35 0.006 0.014 D E A L K be Package Dimensions — UDFN-12 UDFN-12 Millimeters Inches Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 A3 0.127 REF 0.005 REF b 0.15 0.25 0.006 0.010 D 2.40 2.60 0.094 0.102 D2 1 .90 2.10 0.075 0.083 E 1 .25 1 .45 0.049 0.057 E2 0.30 0.50 0.012 0.020 e 0.400 BSC 0.016 BSC K 0.20 0.008 0.000 L 0.15 0.35 0.006 0.014 D E A E2L K be Embossed Carrier T ape & Reel Specification – UDFN-08 P2 D EF t W BO KO AO PD1 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 1. 0 0 - 0.040 - D 1 .50 min 0.059 min P 3.90 4.10 0.154 0.161 W 7 .70 8.30 0.303 0.327 P2 1 .95 2.05 0.077 0.081 A0 1 .55 1 .75 0.061 0.069 B0 1 .90 2.1 0.075 0.083 K0 0.95 1. 15 0.037 0.045 t 0.30 max 0.012 max Embossed Carrier T ape & Reel Specification – UDFN-12 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 0.55 0.65 0.021 0.025 D 1 .50 min 0.059 min P 3.90 4.10 0.154 0.161 W 7 .90 8.30 0.311 0.327 P2 1 .95 2.05 0.077 0.081 A0 1 .33 1 .53 0.052 0.060 B0 2.63 2.83 0.103 0.111 K0 0.58 0.78 0.023 0.031 t 0.22 max 0.009 max P2 t BO EF W oD/ oD/ P