SP6001 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

  • EMI filtering of frequencies from 800MHz to 3GHz
  • Greater than -30dB attenuation (TYP) at 1GHz
  • ESD, IEC61000-4-2, ±30kV contact, ±30kV air
  • Small, low-profile UDFN package (TYP 0.5mm height)
  • Keypad interface for portable electronics
  • LCD and camera display interfaces for handsets
  • Connector interfaces for portable electronics
  • Mobile phone
  • Smartphone
  • Portable navigation device Pinout 5 8 1 4 1 6 7 12 GND GND SP6001-04UTG-1 SP6001-06UTG-1 UDFN-08 UDFN-12 Functional Block Diagram Cd Cd 1 8 Cd Cd 2 7 Cd Cd 3 6 Cd Cd 4 5 Cd Cd 1 12 Cd Cd 2 11 Cd Cd 3 10 Cd Cd 4 9 Cd Cd 5 8 Cd Cd 6 7 SP6001-04UTG-1 SP6001-06UTG-1 HF

2 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection SP6001 Lead-Free/Green Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -60 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM 6.0 V Breakdown Voltage VBR IR=1mA 7 .0 7 .5 8.0 V Reverse Leakage Current ILEAK VRWM=5V 0.1 1 .0 µA Resistance RA IR=10mA 85 100 115 Ω Diode Capacitance1,2 CD VR=2.5V ,f=1MHz 12 pF Line Capacitance1,2 CL VR=2.5V ,f=1MHz 19 24 29 pF ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Cutoff Frequency3 F-3dB Above this frequency, appreciable attenutation occurs 115 MHz Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 Total line capacitance is two times the diode capacitance (CD). 3 50Ω source and 50Ω load termination

3©2009 Littelfuse, Inc. SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 12pF EMI Filter Array with ESD Protection SP6001 Lead-Free/Green Series Lead-Free/Green SP6001 Analog Crosstalk (S41)Insertion Loss (S21) Line Capacitance vs. DC Bias 3.000 000MHz Stop 6 000.000.000MHz Start 21 log MAG 5 dB/ REF 0 dB 1 _:-5.8807 dBCH1 S Cor Smo DC Bias (V) Capacitance (pF) START 3.000 000 MHz Stop 6 000.000 000 MHz CH1 S log MAG 1 0 dB/ REF 0 dB Smo Cor Del

4 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection SP6001 Lead-Free/Green Series Application Example Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Dx: SP6001-04 Silicon Protection Array Signal Ground Outside World SP6001-04UTG (µDFN) LCD Module Controller Input GND

5©2009 Littelfuse, Inc. SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 12pF EMI Filter Array with ESD Protection SP6001 Lead-Free/Green Series Lead-Free/Green SP6001 Package Dimensions - UDFN-08 Symbol UDFN-08 Millimeters Inches Min Max Min Max A 0.450 0.550 0.018 0.022 A1 0.000 0.050 0.000 0.002 A3 0.127 REF 0.005 REF b 0.150 0.250 0.006 0.010 D 1 .600 1 .800 0.063 0.071 D2 1 .100 1 .300 0.043 0.051 E 1 .250 1 .450 0.049 0.057 E2 0.300 0.500 0.012 0.020 e 0.400 BSC 0.016 BSC K 0.200 0.008 0.000 L 0.150 0.350 0.006 0.014 D E A L K be Package Dimensions - UDFN-12 Symbol UDFN-12 Millimeters Inches Min Max Min Max A 0.450 0.550 0.018 0.022 A1 0.000 0.050 0.000 0.002 A3 0.127 REF 0.005 REF b 0.150 0.250 0.006 0.010 D 2.400 2.600 0.094 0.102 D2 1 .900 2.100 0.075 0.083 E 1 .250 1 .450 0.049 0.057 E2 0.300 0.500 0.012 0.020 e 0.400 BSC 0.016 BSC K 0.200 0.008 0.000 L 0.150 0.350 0.006 0.014 D E A L K be

6 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection SP6001 Lead-Free/Green Series Embossed Carrier T ape & Reel Specification – UDFN-08 P2 D EF t W BO KO AO PD1

Ordering Information

Part Number Package Size Marking Min. Order Qty. SP6001-04UTG-1 uDFN-08 1 .7x1 .35mm JH4 3000 SP6001-06UTG-1 uDFN-12 2.5x1 .35mm JH6 3000 Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Part Numbering System Part Marking System SP 6001 0x U T G - 1 Silicon Protection Array Series Package UDFN-08 (1.7x1.35mm) UDFN-12 (2.5x1.35mm) T= Tape & Reel G= Green Number of Channels 04 = 4 Channel UDFN-08 06 = 6 Channel UDFN-12 JH4 JH6 J H x Product Series J = SP6001 Assembly Site 4 = UDFN-08 6 = UDFN-12 Symbol Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 1 .00 - 0.040 - D 1 .50 min 0.059 min P 3.90 4.10 0.154 0.161 W 7 .70 8.30 0.303 0.327 P2 1 .95 2.05 0.077 0.081 A0 1 .55 1 .75 0.061 0.069 B0 1 .90 2.1 0.075 0.083 K0 0.95 1 .15 0.037 0.045 t 0.30 max 0.012 max

7©2009 Littelfuse, Inc. SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 12pF EMI Filter Array with ESD Protection SP6001 Lead-Free/Green Series Lead-Free/Green SP6001 Embossed Carrier T ape & Reel Specification – UDFN-12 Symbol Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 0.55 0.65 0.021 0.025 D 1 .50 min 0.059 min P 3.90 4.10 0.154 0.161 W 7 .90 8.30 0.311 0.327 P2 1 .95 2.05 0.077 0.081 A0 1 .33 1 .53 0.052 0.060 B0 2.63 2.83 0.103 0.111 K0 0.58 0.78 0.023 0.031 t 0.22 max 0.009 max P2 t BO EF W oD/ oD/ P