SP5003 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

  • Large differential bandwidth > 4.0 GHz
  • High Common Mode Stop Band Attenuation: > 16 dB at 900 MHz
  • Common Mode Imped ance: Zc: 32Ω at 100 MHz
  • TDFN-10 2.50mm × 2.00mm × 0.75mm package with 0.50mm lead pitch
  • ±15kV ESD protection per channel (IEC 61000- 4-2 Level 4, contact discharge)
  • RoHS-compliant, Lead- free packaging
  • AEC-Q101 qualified
  • Moisture Sensitivity Level (MSL -1)
  • HDMI/DVI Display in Mobile Phones
  • MIPI D-PHY (CSI-2, DSI, etc) in Mobile Phones and Digital Still Cameras Pinout GN D In 1+ In 1- In 2+ In 2- GN D Out 1+ Out 1- Out 2+ Out 2- Note :This drawing is not to scale. Functional Block Diagram Pin1 Pin2 Pin4 Pin5 Pin3 Pin8 Pin10 Pin9 Pin7 Pin6 External (Connector) Internal (ASIC) RoHS Pb GREENSP5003 Series 4 Channel Common Mode Filter

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/30/17 TVS Diode Arrays (SPA® Diodes) SP5003 Low Capacitance ESD Protection - SP5003 Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IDC DC Current Per Line 100 mA TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Channel Resistance RCH Pins 1−10, 2−9, 4−7 and 5−6 3.5 5.0 Ω Total Channel Capacitance CTOTAL VI/O = 1 .65VDC Reverse Bias; f=1MHz, 30mVAC 0.8 1. 3 pF Reverse Standoff Voltage VRWM 5.0 V Breakdown Voltage VBR IT=1mA 6.0 8.0 10.0 V Forward Voltage at IF VF IF=1mA 0.4 0.7 1. 5 V Reverse Leakage Current ILEAK VLeak=+3.3V 0.01 0.10 µA Dynamic Resistance2 3 RDYN Positive (tp=8/20µs) 1 .36 ΩNegative (tp=8/20µs) 0.6 TLP , tp=100ns, I/O to GND 0.42 ESD Withstand Voltage1 2 VESD IEC 61000-4-2 (Contact Discharge) ±15 kV IEC 61000-4-2 (Air Discharge) ±30 kV Differential Mode Cutoff Frequency2 F3dB ZSOURCE=50 Ω, ZLOAD50 Ω 4.0 GHz Common Mode Impedance ZC @100MHz 32 Ω Common Mode Stop Band Attenuation

2 Fatten f=900MHz 16 dB

Notes: 1 ESD zapping at I/O pins (1,2,4,5) with respect to GND. 2 Guaranteed by design. 3 Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. −10 1 10 100 1000 10000 Frequency (MHz) Inser/g415on Loss(dB ) −9 −35 −30 −25 −20 −15 −10 −40 Frequency (MHz) 1 10 100 1000 10000 Inser/g415on Loss(dB ) Differential Mode Attenuation vs. Frequency Common Mode Attenuation vs. Frequency

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/30/17 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5003 Series Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters

Ordering Information

Part Number Package Size Marking Min. Order Qty. SP5003-04TTG TDFN-10 2.5x2.0mm 42* 3000 Part Numbering System SP 5003 T T G Series Package TDFN-10 (2.5x2.0mm) T= Tape & Reel G= Green Number of Channels 04 = 4 Channel TDFN-10 TVS Diode Arrays (SPA Diodes Part Marking System 42 * Product Series 42 = SP5003 Date Code (Year / Week) 024681 01 21 41 61 82 0 TLP Voltage (V) TLP Current (A) T ransmission Line Pulsing (TLP) Plot

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/30/17 TVS Diode Arrays (SPA® Diodes) SP5003 Low Capacitance ESD Protection - SP5003 Series T ape & Reel Specification –TDFN-10 Symbol Dimensions Millimetres E 1 .75+/- 0.10 F 3.5 +/- 0.05 P 4.0 +/- 0.10 P0 4.0 +/- 0.10 P2 2.0 +/- 0.05 A0 2.19 +/- 0.05 B0 2.77 +/- 0.05 K0 1 .05 +/- 0.05 T 0.25+/- 0.02 W P P0 P2 扑 1.50 +0.10 E F T Top Cover Tape 5° Max Pin1 Location Device Orientation in Tape ͅ 1.00 ±0.05 D A E B

0.10 C2 X

0.10 MIN e 9X b 8X L 0.05 C

0.05 C A3

A A1 C TOP VIEW SIDE VIEW BOTTOM VIEW

0.10 C A B

0.05 C DETAIL B DETAIL A L L DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS EXPOSED Cu MOLD CMPD DETAIL B ALTERNATE CONSTRUCTIONS M M PIN 1 MARKING 1.07 0.45 0.50PITCH 2.30 0.30 PACKAGE OUTLIN E Recommended Soldering Footprint Package Dimensions — TDFN-10 TDFN-10 JEDEC MO-229 Millimeters Inches Min Max Min Max A 0.70 0.80 0.028 0.031 A1 0.00 0.05 0.000 0.002 A3 0.2 REF 0.008 REF b 0.15 0.25 0.006 0.010 D 2.50 BSC 0.098 BSC E 2.00 BSC 0.079 BSC e 0.50 BSC 0.020 BSC L 0.70 0.90 0.028 0.035 L1 0.05 0.15 0.002 0.006 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.