SP4322 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

  • ESD, IEC 61000-4-2, ±18kV contact, ±30kV air
  • EFT , IEC 61000-4-4, 40A (5/50ns)
  • Lightning, 11A (8/20μs as defined in IEC 61000-4-5 2nd edition)
  • Low capacitance of 0.4pF (TYP @ VR=0V)
  • Low leakage current of 1nA (TYP) at 5V
  • Halogen free, lead free and RoHS compliant
  • Moisture Sensitivity Level (MSL -1)
  • AEC-Q101 Qualified
  • USB 3.1
  • DisplayPort
  • S-ATA
  • NFC
  • 1G/2.5G/10G Ethernet Pinout Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN

0201 Flipchip

SP4322 0.4pF 11A Bidirectional Diode Array SOD882 1 2 Note: This package image is for example and reference only. for detail package drawing, please refer to the package section in this datasheet.

©2020 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 04/14/20 Low Capacitance ESD Protection - SP4322 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 11 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Note: 1 . Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP) with 100ns width, 0.2ns rise time, and average window t1=70ns to t2= 90ns Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR=1μA 5 V Breakdown Voltage VBR IR=1mA 9 V Reverse Leakage Current ILEAK VR=5V 1 100 nA Holding Voltage VHOLD I/O to I/O 2.3 V Clamp Voltage1 VC IPP=1A, tp=8/20μs 4 V IPP=11A, tp=8/20μs 8 V Dynamic Resistance2 RDYN TLP , tP=100ns 0.2 Ω ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±18 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CIO-GND Reverse Bias=0V , f=1MHz 0.4 0.5 pF Capacitance vs. Reverse Bias Clamping voltage vs. IPP for 8/20μs waveshape 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Capacitance (pF) Bias Voltage (V) 0.0 2.0 4.0 6.0 8.0 10.0 1357 91 1 Clamp Voltage (VC) Peak Pulse Current-IPP (A)

©2020 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 04/14/20 Low Capacitance ESD Protection - SP4322 IEC 61000-4-2 -8 kV Contact ESD Clamping Voltage Negative T ransmission Line Pulsing (TLP) Plot Positive T ransmission Line Pulsing (TLP) Plot IEC 61000-4-2 +8 kV Contact ESD Clamping Voltage -24 -22 -20 -18 -16 -14 -12 -10 -20- 15 -10- 50 TLP Voltage (V) TLP Current (A) 05 10 15 20 TLP Voltage (V) TLP Current (A)TLP Current (A) 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP 8/20μs Pulse Waveform

©2020 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 04/14/20 Low Capacitance ESD Protection - SP4322 Part Numbering SystemPart Marking System SP 4322 01 T G Series Number of Channels Package E: SOD882 T= Tape & Reel G= Green TVS Diode Arrays (SPA Diodes) E Date code Part code

Ordering Information

Part Number Package Min. Order Qty. SP4322-01ETG SOD882 10,000 Product Characteristics Lead Plating Pre-Plated Frame, Tin Lead material Copper Alloy Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters

©2020 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 04/14/20 Low Capacitance ESD Protection - SP4322 Embossed Carrier T ape & Reel Specification — SOD882 Symbol Millimeters A0 0.70+/-0.045 B0 1 .10+/-0.045 K0 0.65+/-0.045 F 3.50+/-0.05 P1 2.00+/-0.10 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. ,Ref. ,Ref. ,Ref. 8mm TAPE AND REEL Drawing# : E03-B D E TOP VIEW BOTTOM VIEW-1 SIDE VIEW e A Recommended Soldering Pattern 0.30mm0.35mm 1.00mm 0.60mm BOTTOM VIEW-2 e PIN#1 ID. (OPTIONAL) Symbol SOD882 Millimeters Inches Min Typ Max Min Typ Max e 0.65 BSC 0.026 BSC