SP4065 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

  • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air
  • EFT , IEC 61000-4-4, 40A (5/50ns)
  • Lightning, IEC 61000-4-5, 2nd Edition 20A (8/20µs)
  • Low capacitance of 4.4pF (TYP) per I/O
  • Low leakage current of 1µA (MAX) at 3.3V
  • AEC-Q101 qualified
  • Halogen free, Lead-free and RoHS compliant
  • Moisture Sensitivity Level (MSL - Level 1)
  • LCD/LED TVs
  • Desktops
  • Game Consoles
  • Set Top Boxes
  • Notebooks
  • 1Gb Ethernet
  • Network Hardware
  • Small Cells Functional Block Diagram I/O 8 I/O 7 I/O 6 I/O 5 I/O 1 I/O 2 GND I/O 3 I/O 4 Pinout I/O 1 I/O 2 GND I/O 3 I/O 4 NC I/O 8 I/O 7 I/O 6 I/O 5 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example LVDS Controller Outside World CLK+ Shield GND CLK- A0+ A0- A1+ A1- A2+ A2- Signal Shield GND SP4065-08ATG LVDS Interface SP4065 Series 3.3V 20A Diode Array Additional Information Datasheet SamplesResources

TVS Diode Arrays (SPA ® Diodes) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/29/16 Lightning Surge Protection - SP4065 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 20.0 A PPK Peak Pulse Power (tp=8/20µs) 300 W TOP Operating Temperature -40 to 125 ºC TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM 3.3 V Snap Back Voltage VSB ISB=50mA 2.8 V Reverse Leakage Current ILEAK VR=3.3V , I/O to GND 0.5 1. 0 µA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Fwd 5.5 V IPP=5A, tp=8/20µs, Fwd 7. 0 V IPP=10A, tp=8/20µs, Fwd 9.0 V IPP=20A, tp=8/20µs, Fwd 13.5 V Dynamic Resistance RDYN (VC2 - VC1) / (IPP2 - IPP1) 0.4 Ω ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) ±30 kV IEC61000-4-2 (Air) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V 4.4 5.0 pF Diode Capacitance1 CI/O-I/O Reverse Bias=0V 2.2 pF Note: 1. Parameter is guaranteed by design and/or device characterization. Thermal Information Parameter Rating Units Storage Temperature Range -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Clamping Voltage vs. IPP 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 Peak Pulse Current-IPP (A) Clamp Voltage (VC) Capacitance vs. Bias 0.0 1.0 2.0 3.0 4.0 5.0 00 .5 11 .5 22 .5 3 Bias Voltage (V) Capacitance (pF)

TVS Diode Arrays (SPA ® Diodes) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/29/16 Lightning Surge Protection - SP4065 Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material Molded Epoxy, rated UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Numbering System Part Marking System SP 4065 08 A T G Series Number of Channels Package A = MSOP10 T= Tape & Reel G= Green TVS Diode Arrays (SPA Diodes) YYWW = Date code FL YYWWD AA*8Product Series AA= SP4065 Number of Channels Assembly Site

Ordering Information

Part Number Package Marking Min. Order Qty. SP4065-08ATG MSOP-10 AAH8 4000 8/20µs Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP

TVS Diode Arrays (SPA ® Diodes) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/29/16 Lightning Surge Protection - SP4065 Embossed Carrier T ape & Reel Specification — MSOP-10 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 e 0.5 0.02 F 5.40 5.60 0.213 0.220 D 1 .50 1 .60 0.059 0.063 D1 1 .50 Min 0.059 Min P0 3.90 4.10 0.154 0.161 W 11 .70 12.30 0.460 0.484 P 7 .90 8.10 0.311 0.319 A0 5.20 5.40 0.205 0.213 B0 3.20 3.50 0.126 0.138 K0 1 .20 1 .50 0.047 0.059 User Feeding Direction Pin 1 Location Package Dimensions — MSOP-10 B e A1 A E1 E D L C 0.32 [0.0126] 4.24 [0.1669] 1.04 [0.0409] 5.28 [0.2079] 3.20 [0.1260] 0.50 [0.0197] 2.00 [0.0787] Solder Pad Layout Package MSOP Pins 10 JEDEC MO-187 Millimeters Inches DIM Min Max Min Max A - 1. 10 - 0.043 A1 0.00 0.15 0.000 0.006 B 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 E 4.67 5.10 0.184 0.200 E1 2.90 3.10 0.114 0.122 e 0.50 BSC 0.020 BSC L 0.40 0.80 0.016 0.032