SP4042 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

  • ESD, IEC61000-4-2, ±30kV contact, ±30kV air
  • Lightning, IEC61000- 4-5 2nd edition, 120A (tP=2/10μs)
  • EFT , IEC61000-4-4, 40A P=5/50ns)
  • Low capacitance of 11pF (TYP) per line
  • Low leakage current of 0.1μA (MAX) at 3.3V
  • Lead-free and RoHS compliant
  • 10/100/1000 Ethernet Interfaces
  • Customer Premise Equipment (CPE)
  • Carrier Class Equipment
  • PBX Systems Functional Block Diagram Pinout 13 5 GND 6810 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP4042 Series 3.3V Diode Array RoHS Pb GREEN

©2016 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/29/16 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SP4042 Series SP4061CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 95 A IPP Peak Current (tp=2/10μs) 120 A PPK Peak Pulse Power (tp=2/10µs) 2500 W TOP Operating Temperature -40 to 85 ºC TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR≤1μA, Line to Line 3.3 V Reverse Breakdown Voltage VBR IT=1mA, Line to Line 3.5 V Snap Back Voltage VSB ISB=50mA 2.8 V Reverse Leakage Current ILEAK VR=3.3V , Line to Line 0.1 µA Clamp Voltage, Line to GND1 VC IPP=100A, tp=2/10µs 17 22 V Clamp Voltage, Line to Line1 IPP=100A, tp=2/10µs 22 25 V ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) ±30 kV IEC61000-4-2 (Air) ±30 kV Dynamic Resistance, Line to GND2 RDYN TLP , tp=100ns 0.05 Ω Dynamic Resistance, Line to Line2 0.15 Ω Diode Capacitance1 CI/O-GND Line to GND, VR=0V , f=1MHz 11 25 pF CI/O-I/O Line to Line, VR=0V , f=1MHz 5.5 12 pF Note: 1 Parameter is guaranteed by design and/or device characterization. 2 Transmission Line Pulse (TLP) test setting : Std.TDR(50Ω),tp=100ns, tr=0.2ns ITLP and VTLP averaging window: star t1=70ns to end t2=80ns Thermal Information Parameter Rating Units Storage Temperature Range -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C 5.0 10.0 15.0 20.0 25.0 70 80 90 100 110 120 Clamp Voltage (VC) Peak Pulse Current-IPP (A) Capacitance vs. Reverse Bias(Line to GND) Capacitance (pF) Bias Voltage (V) Wave Form 2/10µs Clamping Voltage vs. Peak Pulse Crrent (Line to GND)

©2016 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/29/16 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SP4042 Series Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone T L to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters

Ordering Information

Part Number Package Marking Min. Order Qty. SP4042-02UTG µDFN-10 A2*2 3000 Part Numbering System Part Marking System SP 4042-02 U T G Series Package U= µDFN-10 T= Tape & Reel G= GreenTVS Diode Arrays (SPA® Diodes) Number of Channels -02= 2 channel A2 * 2 Product Series A2 = SP4042 Assembly Site Number of Channels Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.004 inches(0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 5. Package surface matte finish VDI 11-13. Positive T ransmission Line Pulsing (TLP) Plot (Line to GND) 0246 81 0 TLP Current (A) TLP Volts (V) Peak Pulse Power -PPP(kW) Peak Pulse Dura/g415on -tP(µs) 0.1 100 0.11 10 1001 000 Non-Repetitive Peak Pulse Power vs. Pulse Time

©2016 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/29/16 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SP4042 Series Package Dimensions — µDFN-10 Package µDFN-10 (2.6x2.6mm) JEDEC MO-229 Symbol Millimeters Inches Min Nom Max Min Nom Max A3 0.127Ref 0.005 Ref e 0.50 BSC 0.020 BSC D E B Top View A A Bottom View 0.10 C b C Seating Plane Side View

0.10 C BM A

0.05 C e C Embossed Carrier T ape & Reel Specification — µDFN-10 (2.6x2.6mm) T B0K0 P2 D0 E F W 5º MAX A0 5º MAX User Feeding Direction Pin 1 Location Reel Size:7 inches Symbol Millimeters A0 2.82 +/- 0.05 B0 2.82 +/- 0.05 D0 Ø1 .50 + 0.10 D1 Ø 0.50 + 0.05 E 1 .75 +/- 0.10 F 3.50 +/- 0.05 K0 0.76 +/- 0.05 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00 +/- 0.05 T 0.25 +/- 0.02 0.50 0.48 0.30 2.68 0.48 1 .32 2.23 2.30 Unit: mm RECOMMENDED SOLDER PAD