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Document overview

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Technical content

Features

  • Lightning protection, IEC61000-4-5, 75A (8/20µs)
  • Low clamping voltage
  • Low insertion loss, log- linear capacitance
  • Combined longitudinal and metallic protection
  • Clamping speed of nanoseconds
  • MS-012 surface mount package (JEDEC SO-8)
  • UL 94V-0 epoxy molding
  • RoHS compliant
  • T1/E1 Line cards
  • 10/100/1000 BaseT Ethernet
  • T3/E3 and DS3 Interfaces
  • STS-1 Interfaces Functional Block Diagram Pinout Note: Pinout diagrams above shown as device footprint on circuit board. RoHS Pb GREENSP4040 Series 3.3V 75A Rail Clamp Array SO-8 (Top View) Pin 1 and 8 Pin 4 and 5 Pin 2, 3, 6, and 7 Line out Line outLine in Line in Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Application Example The schematic shows protection for a single differential pair as part of a larger high-speed data interface such as Ethernet. The SP4040 provides both metallic (differential) and longitudinal (common mode) protection from lightning induced surge events as specified by regulatory standards such as Telcordia’s GR-1089 CORE and ITU K.20 and 21 . The SP4040 protects against both positive and negative induced surge events while the TeleLink fuse provides overcurrent protection for the long term 50/60 Hz power fault events. to chipset (Ethernet PHY, T3/E3 PHY, etc.) TeleLink (0461 1.25) SP4040-02BTG

189©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: September 13, 2011 SP4040 Series SP4040 Lightning Surge Protection - SP4040 Series Absolute Maximum Ratings Parameter Rating Units Peak Pulse Current (8/20µs) 75 A Peak Pulse Power (8/20µs) 2100 W IEC 61000-4-2, Direct Discharge, (Level 4) 30 kV IEC 61000-4-2, Air Discharge, (Level 4) 30 kV Telcordia GR 1089 (Intra-Building) (2/10µs) 100 A ITU K.20 (5/310µs) 20 A Electrical Characteristics (TOP = 25°C) Thermal Information Parameter Rating Units Operating Temperature Range -55 to 125 °C Storage Temperature Range -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) (SOIC - Lead Tips Only) 260 °C Parameter Symbol Test Conditions Min Typ Max Units Reverse Stand-Off Voltage VRWM IT≤1µA - - 3.3 V Reverse Breakdown Voltage VBR IT= 2µA 3.3 - - V Snap Back Voltage VSB IT= 50mA 3.3 - - V Reverse Leakage Current IR VRWM= 3.3V - - 1 µA Clamping Voltage, Line-Ground1 VC IPP= 40A, tp=8/20 µs - - 14 V Clamping Voltage, Line-Ground1 VC IPP= 75A, tp=8/20 µs - - 20 V Clamping Voltage, Line-Ground1 VC IPP= 100A, tp=2/10 µs 20 V Dynamic Resistance, Line-Ground1 RDYN ( VC2-VC1)/(IPP2-IPP1) - 0.2 - Ω Clamping Voltage, Line-Line1 VC IPP= 40A, tp=8/20 µs - - 20 V Clamping Voltage, Line-Line1 VC IPP= 75A, tp=8/20 µs - - 30 V Clamping Voltage, Line-Line1 VC IPP= 100A, tp=2/10 µs 30 V Dynamic Resistance, Line-Line1 RDYN ( VC2-VC1)/(IPP2-IPP1) - 0.3 - Ω Junction Capacitance1 Cj Line to Ground VR=0V , f= 1MHz - 5 8 pF Line to Line, VR=0V , f= 1MHz - 2.5 5 pF CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 1 Parameter is guaranteed by design and/or device characterization.

©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 190 TVS Diode Arrays (SPA™ Family of Products) Revision: September 13, 2011 SP4040 Series Lightning Surge Protection - SP4040 Series Clamping Voltage vs. IPP Capacitance vs. Reverse Bias at 1MHz Pulse Waveform 01 02 03 04 05 06 07 0 Clamp Voltage-VC (V) Peak Pulse Current- IPP (A) Line-Line Line-Gound 0.0 1.0 2.0 3.0 4.0 5.0 Bias Voltage (V) Capacitance (pF) Line-Line Line-Gound 6.0 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP Non-Repetitive Peak Pulse Power vs. Pulse Time Current Derating Curve 0.1 11 01 00 1000 Peak Pulse Power (kW) Peak Pulse Dura/g415on -t P (µs) Ambient Temperature (ºC) Percentage of Rated Current (% IP) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 100 120

191©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: September 13, 2011 SP4040 Series SP4040 Lightning Surge Protection - SP4040 Series Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Product Characteristics Lead Plating Matte Tin plating Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Part Marking System Part number FLSP4040-02 CYYWW Date code Pin1

©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 192 TVS Diode Arrays (SPA™ Family of Products) Revision: September 13, 2011 SP4040 Series Lightning Surge Protection - SP4040 Series Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package MS-012 (SO-8) Pins 8 JEDEC MO-223 Issue A Millimetres Inches Min Max Min Max A 1 .35 1 .75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1 .25 1 .65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 1 .27 BSC 0.050 BSC L 0.40 1 .27 0.016 0.050 o Recommended Soldering Pad Outline (Reference Only) FL Embossed Carrier T ape & Reel Specification — SOIC Package Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1 .95 2.05 0.077 0.081 D 1. 5 1. 6 0.059 0.063 D1 1 .50 Min 0.059 Min P0 3.9 4.1 0.154 0.161 W 11. 9 12.1 0.468 0.476 P 7. 9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 User Feeding Direction Pin 1 Location

Ordering Information

Part Number Package Marking Min. Order Qty. SP4040-02BTG SOIC-8 SP4040-02 2500 Part Numbering System SP 4040 xx x T G Silicon Protection Array Series Number of Channels Package B = SOIC-8 T= Tape & Reel G= Green