SP3522 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

  • ESD, IEC 61000-4-2, ±22kV contact, ±22kV air
  • EFT , IEC 61000-4-4, 40A (tP=5/50ns)
  • Lightning, IEC 61000- 4-5, 2nd edition, 2.5A (tP=8/20μs)
  • Low capacitance of 0.15pF (TYP) at 3GHz
  • Low profile 0201 DFN packages and SOD882 packages
  • Facilitates excellent signal integrity
  • ELV Compliant
  • AEC-Q101 qualified
  • Halogen free, Lead free and RoHS compliant
  • Moisture Sensitivity Level(MSL -1) SP3522 Pinout Bottom View Bottom View SOD882 SOD882

0201 DFN

Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

©2017 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/04/18 TVS Diode Arrays (SPA® Diodes) Enhanced ESD Discrete TVS Series - SP3530 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 2.5 A TOP Operating Temperature -45 to 125 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics - (TOP=25°C) Parameter Test Conditions Min Typ Max Units Input Capacitance @ VR = 0V , f = 3GHz 0.15 pF Breakdown Voltage VBR @ IT=1mA 9.2 V Reverse Working Voltage IR≤1μA 7. 0 V Reverse Leakage Current IL @ VRWM=5.0V 0.02 1 μA Dynamic Resistance2 TLP , tP=100ns, I/O to GND 0.96 Ω Clamping Voltage1 VCL @ IPP=2.5A 14.5 V ESD Withstand Voltage1 IEC 61000-4-2 (Contact) ±22 kV IEC 61000-4-2 (Air) ±22 Note: 1 . Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns Clamping Voltage vs IPP Clamp Voltage (VC) Peak Pulse Current-IPP (A) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 11 .5 22 .5 SP3522 Series 8/20μs Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP SP3522

©2017 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/04/18 TVS Diode Arrays (SPA® Diodes) Enhanced ESD Discrete TVS Series - SP3530 Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters IEC 61000−4−2 +8 kV Contact ESD Clamping Voltage IEC 61000−4−2 -8 kV Contact ESD Clamping Voltage Positive T ransmission Line Pulsing (TLP) Plot 0 5 10 15 20 25 30 35 40 45 50 55 TLP Voltage (V) TLP Current (A) Negative T ransmission Line Pulsing (TLP) Plot -40 -35 -30 -25 -20 -15 -10 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 TLP Voltage (V) TLP Current (A) SP3522

©2017 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/04/18 TVS Diode Arrays (SPA® Diodes) Enhanced ESD Discrete TVS Series - SP3530 SP3522 Package Dimensions — 0201 DFN Symbol Millimeters Inches Min Max Max Min Min Max e 0.35 (BSC) 0.014 (BSC) h 0.05 ( x 45° ) 0.002 ( x 45° ) D E PIN1 Top View Bottom View Side View e A Side View Recommended soldering pad layout Package outline 0.14mm 0.32mm 0.24mm Symbol Millimeters Inches Min Max Max Min Min Max e 0.65 (BSC) 0.026 (BSC) h 0.125 ( x 45° ) 0.005 ( x 45° ) D E PIN1 Top View Bottom View Side View e A h Recommended soldering pad layout 0.30mm0.40mm 1.10mm 0.65mm Package outline Part Numbering System Part Marking System +SP 3522 01 U T G Series Number of Channels Package T= Tape & Reel G= Green TVS Diode Arrays (SPA Diodes) U: 0201 DFN E: SOD882

Ordering Information

Part Number Package Marking Min. Order Qty. SP3522-01UTG 0201 DFN 15000 SP3522-01ETG SOD882 10000

©2017 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/04/18 TVS Diode Arrays (SPA® Diodes) Enhanced ESD Discrete TVS Series - SP3530 Embossed Carrier T ape & Reel Specification — 0201 DFN T W P0 P2 D0 F Symbol Millimeters A0 0.33 min/0.41 max B0 0.63 min/0.71 max D0 ø 1 .50 +0.10/ -0 D1 ø 0.20 +/- 0.05 E1 1 .75+/-0.10 F 3.50+/-0.05 K0 0.30 min/0.39 max P0 4.00+/-0.10 P1 2.00+/-0.10 P2 2.00+/-0.05 W 8.00+0.30/-0.10 T 0.13 min/0.25 max Embossed Carrier T ape & Reel Specification — SOD882 Symbol Millimeters A0 0.70+/-0.045 B0 1 .10+/-0.045 K0 0.65+/-0.045 F 3.50+/-0.05 P1 2.00+/-0.10 8mm TAPE AND REEL SP3522 8mm TAPE AND REEL Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimier-electronics. Pin1 Location Device Orientationi nT ape Pin1 Location Device Orientationi nT ape