SP3400

SP3400 LITTELFUSE | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 5

Technical content

TVS Diode Arrays (SPA® Diodes) Datasheet © 2022 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/03/22 SP3400 1pF, ±30kV Diode Array

Description

Applications

The SP3400 integrates 2 channels of low capacitance steering diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). The SP3400 can safely absorb repetitive ESD strikes above the maximum contact level specified in IEC 61000- 4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The low off-state capacitance makes it ideal for protecting high- speed signal lines such as USB2.0 or USB 3.0 and 1Gb Ethernet with an extremely low dynamic resistance to protect the most sensitive, state of the art chipsets against ESD transients. Features and Benefits ■ ESD, IEC 61000-4-2, ±30kV contact, ±30kV air ■ EFT , IEC 61000-4-4, 80A (tP=5/50ns) ■ Lightning, 8A (8/20 as defined in IEC 61000-4-5 2nd edition) ■ Low capacitance of 1pF (TYP) per I/O ■ Low leakage current of 0.01μA (TYP) at 5V ■ Small form factor μDFN (JEDEC MO-229) package provides flow through routing to simplify PCB layout ■ AEC-Q101 qualified ■ Moisture Sensitivity Level(MSL -1) ■ Halogen free, lead free and RoHS compliant ■ LCD/PDP TVs ■ External Storages ■ DVD/Blu-ray Players ■ Set Top Boxes ■ Smartphones ■ Ultrabooks/Notebooks ■ Digital Cameras ■ Portable Medical ■ Automotive Electronics ■ Wearable Technology Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN USB 2.0 Protection Application Example GND USB Port V BUS IC USBC ontroller*Package is showna s tra nsparent SP3400 SP1003 Pinout

TVS Diode Arrays (SPA® Diodes) Datasheet © 2022 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/03/22 SP3400 1pF, ±30kV Diode Array SP3012 Caution: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 8 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol T est Conditions Min Ty p Max Units Reverse Standoff Voltage VRWM - 5.0 V Breakdown Voltage VBR IR = 1mA 6.5 7. 8 V Reverse Leakage Current ILEAK VR=5V , Any I/O to GND 0.01 0.5 µA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Fwd 9.2 12 V IPP=8A, tp=8/20µs, Fwd 13 16 V Dynamic Resistance2 RDYN TLP , tp=100ns, I/O to GND 0.24 Ω ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact) ±30 kV IEC 61000-4-2 (Air) ±30 kV Diode Capacitance3 CI/O-GND Reverse Bias=0V , f= 3 GHz pF CI/O-I/O 0.5 Note: 1 Parameter is guaranteed by design and/or component characterization. 2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns. 3. Package sizes larger than 0201 can add parasitic capacitance, inductance and resistance. 8/20μs Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Pe rcen t of IPP Clamping voltage vs. IPP for 8/20μs waveshape 0246 8 Clamp Voltage (VC ) Peak Pulse Current- IPP (A)

TVS Diode Arrays (SPA® Diodes) Datasheet © 2022 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/03/22 SP3400 1pF, ±30kV Diode Array Positive T ransmission Line Pulsing (TLP) Plot Negative T ransmission Line Pulsing (TLP) Plot IEC 61000-4-2 +8 kV Contact ESD Clamping Voltage IEC 61000-4-2 -8 kV Contact ESD Clamping Voltage 05 10 15 TLP Voltage (V) TLP Current (A) -40 -35 -30 -25 -20 -15 -10 -10- 6- 4- 20 TLP Voltage (V) TLP Current (A)

TVS Diode Arrays (SPA® Diodes) Datasheet © 2022 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/03/22 SP3400 1pF, ±30kV Diode Array Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-dow Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - T emperature Min (Ts(min)) 150°C - T emperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 120 secs Average ramp up rate (Liquidus) T emp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - T emperature (TL) (Liquidus) 217°C - T emperature (tL) 60 – 150 seconds Peak T emperature (TP) 260+0/-5 °C Time within 5°C of actual peak T emperature (tp) 30 seconds Ramp-down Rate 6°C/second max Time 25°C to peak T emperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Part Numbering System Part Marking System SP 3400 XX T G Series Package T= Tape & Reel G= Green Number of Channels TVS Diode Arrays (SPA Diodes) 02 = 2 channel X µDFN-6LU= AKKD AK : Part code K : Assembly code D : Date code 12 3 456Part Number Package Min. Order Qty. SP3400-02UTG µDFN-6L 3000

Ordering Information

Lead Plating Pre-Plated Frame Lead Material Copper Alloy Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0

TVS Diode Arrays (SPA® Diodes) Datasheet © 2022 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/03/22 SP3400 1pF, ±30kV Diode Array Package Dimensions —µDFN-6L Package µDFN-6L JEDEC MO-229 Pins 6 Millimeters Inches Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 A3 0.125 REF 0.005 REF b 0.35 0.45 0.014 0.018 b1 0.15 0.25 0.006 0.010 c 0.05 REF 0.002 REF D 1 .55 1 .65 0.062 0.065 E 0.95 1 .05 0.038 0.042 F 0.80 REF 0.031 REF e 0.50 REF 0.020 REF R 0.125 REF 0.005 REF L 0.33 0.43 0.013 0.017 D E A e e R Pin1 13 2 1 Top View Bottom View Side View 6 45 F c b x 2 b1 x 4 Drawing# : U03-A Package outline Recommended soldering pad layout (Unit : mm) Package center line 0.400.300.30 0.420.55 1.10 0.480.48 0.50 0.50 0.05 0.20 0.15 1.35 L Embossed Carrier T ape & Reel Specification — µDFN-6L Symbol Millimeters Inches Min Max Min Max E 1 .65 1 .85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.076 0.081 D 1 .40 1 .60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P 3.90 4.10 0.154 0.161 W 7 .90 8.30 0.311 0.319 P0 3.90 4.10 0.154 0.161 A0 1. 15 1 .25 0.045 0.049 B0 1 .75 1 .85 0.069 0.073 K0 0.65 0.75 0.026 0.03 t 0.22 max 0.009 max User Feeding Direction Pin 1 Location ,Ref. ,Ref. ,Ref. 8mm TAPE AND REEL Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.