SP33R6 LITTELFUSE | Alldatasheet

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Note: This package image is for example and reference only. for detail package drawing, please refer to the package section in this datasheet. Pinout Functional Block Diagram ■ USB 3.2, USB 4.0 ■ Thunderbolt 3.0 ■ PCIE Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ■ ESD, IEC 61000-4-2, ±12kV contact, ±15kV air ■ EFT , IEC 61000-4-4, 40A (5/50ns) ■ Lightning, IEC 61000-4-5, 2nd Edition, 3A (8/20us) ■ Low capacitance of 0.2pF (TYP) per I/O ■ Halogen-free, lead-free and RoHS compliant5 4 3 2 1 6 7 8 9 10 3,8 Note: pin6,7,9,10 are N.C

TVS Diode Arrays (SPA® Diodes) Datasheet © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/08/21 SP33R6 0.2pF, 12kV, 0.6V Breakdown Avalanche Diode for Ultra High Speed Interfaces Absolute Maximum Ratings CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 3 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (T OP=25ºC) Note 1: Parameter is guaranteed by design and/or component characterization. Note 2: Test equipment accuracy ±50fF. Note 3: Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns Parameter Symbol T est Conditions Min Ty p Max Units Reverse Standoff Voltage VRWM IR=1μA 0.3 V Breakdown Voltage VBR IR=1mA 0.6 0.9 V Reverse Leakage Current ILEAK VR=0.3V , Any I/O to GND 100 nA Clamp Voltage1 VC IPP=1A, tp=8/20μs 2.5 V IPP=2A, tp=8/20μs 3.3 Dynamic Resistance3 RDYN TLP , tP=100ns 0.3 Ω ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±12 kV IEC 61000-4-2 (Air Discharge) ±15 kV Line Capacitance1, 2 CL Reverse Bias=0V , f=3GHz 0.2 pF 8/20μs Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP Clamping Voltage vs IPP 0.0 1.0 2.0 3.0 4.0 5.0 12 3 Clamp Voltage (VC) Peak Pulse Current - IPP (A)

TVS Diode Arrays (SPA® Diodes) Datasheet © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/08/21 SP33R6 0.2pF, 12kV, 0.6V Breakdown Avalanche Diode for Ultra High Speed Interfaces IEC 61000-4-2 +8 kV Contact ESD Clamping Voltage IEC 61000-4-2 -8 kV Contact ESD Clamping Voltage Positive T ransmission Line Pulsing (TLP) Plot 0123456789 10 TLP Voltage (V) TLP Current (A)TLP Current (A) Negative T ransmission Line Pulsing (TLP) Plot -24 -22 -20 -18 -16 -14 -12 -10 TLP Voltage (V) TLP Current (A)

TVS Diode Arrays (SPA® Diodes) Datasheet © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/08/21 SP33R6 0.2pF, 12kV, 0.6V Breakdown Avalanche Diode for Ultra High Speed Interfaces Part Number Package Min. Order Qty. SP33R6-04UTG μDFN-10 3000 Lead Plating PPF or Tin Lead material Copper Alloy Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - T emperature Min (Ts(min)) 150°C - T emperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 120 secs Average ramp up rate (Liquidus) T emp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - T emperature (TL) (Liquidus) 217°C - T emperature (tL) 60 – 150 seconds Peak T emperature (TP) 260+0/-5 °C Time within 5°C of actual peak T emperature (t p) 30 seconds Ramp-down Rate 6°C/second max Time 25°C to peak T emperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Perameters

Ordering Information

µDFN-10 (2.5x1.0mm) Tape & Reel Number of Channels -04 = 4 Channel TVS Diode Arrays (SPA Diodes)® AUG* AU= Product code G=Assembly code * : Date code PIN1 Part Marking System Part Numbering System

TVS Diode Arrays (SPA® Diodes) Datasheet © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 10/08/21 SP33R6 0.2pF, 12kV, 0.6V Breakdown Avalanche Diode for Ultra High Speed Interfaces Symbol Millimeters Inches Min Max Min Max A 0.50 0.60 0.020 0.024 A1 0.00 0.05 0.000 0.002 A3 0.125 0.175 0.005 0.007 b 0.15 0.25 0.006 0.010 b1 0.35 0.45 0.014 0.018 b2 0.20 0.30 0.008 0.012 D 2.45 2.55 0.096 0.100 E 0.95 1 .05 0.037 0.041 L1 0.28 0.48 0.011 0.019 L2 0.05 0.15 0.002 0.006 e 0.500 BASIC 0.020 BASIC R 0.125 REF 0.005 REF h 0.08 0.16 0.003 0.006 Package Dimensions — µDFN-10 (2.5x1.0x0.5mm) Embossed Carrier Tape & Reel Specification — µDFN-10 Top View D E Bottom View b b1 e

10 X L1

A Side View 2X L2 R 1.40mm 0.600mm0.200mm 0.50mm 0.50mm 0.50mm 0.50mm 0.200mm 0.400mm Recommended Soldering Layout Symbol Millimeters A0 1 .30 +/- 0.10 B0 2.83 +/- 0.10 D0 Ø 1 .50 + 0.10 D1 Ø 1 .00 + 0.25 E 1 .75 +/- 0.10 F 3.50 +/- 0.05 K0 0.65 +/- 0.10 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00 +/- 0.05 T 0.254 +/- 0.02 ,Ref. ,Ref. ,Ref. T F E W 5º Max 5º Max User Feeding Direction Pin 1 Location Product Disclaimer: Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to