SP3374NUTG LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

  • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air
  • EFT , IEC 61000-4-4, 40A (5/50ns)
  • Lightning, 40A (8/20μs as defined in IEC 61000-4-5 2nd Edition)
  • Low capacitance of 3.5pF@0V (TYP) per I/O
  • Low leakage current of 0.1μA (TYP) at 3.3V
  • μDFN-10 package is optimized for high-speed data line routing
  • Provides protection for two differential data pairs (4 channels) up to 40A
  • Low operating and clamping voltage
  • AEC-Q101 qualified
  • Halogen free, Lead free and RoHS compliant Pinout Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example SP3374NUTG 3.3V 40A Diode Array
  • 10/100/1000 Ethernet
  • WAN/LAN Equipment
  • Desktops, Servers and Notebooks
  • LVDS Interfaces
  • Integrated Magnetics
  • Smart TV 10 9 8 7 6 1 2 3 4 5 GND GND GND 10 9 8 7 6 1 2 3 4 5 GND GND GND Bottom ViewTop View GND LINE1 IN (Pin 1) LINE1 OUT (Pin 10) LINE2 IN (Pin 2) LINE2 OUT (Pin 9) LINE3 IN (Pin 4) LINE3 OUT (Pin 7) LINE4_IN (Pin 5) LINE4_OUT (Pin 6) GND NOTE: PIN3, PIN8 are same potential with GND RJ -45 Connector Ethernet PHY SP2574N TP0+ TP0- TP1+ TP1- TP2+ TP2- TP3+ TP3- SP3374

TVS Diode Array (SPA ® Diodes) Lightning Surge Protection - SP3374NUTG © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/13/19 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 40 A PPk Peak Pulse Power (tp=8/20μs) 1000 W TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol T est Conditions Min Ty p Max Units Reverse Standoff Voltage VRWM IR ≤ 1µA 3.3 V Reverse Leakage Current IR VRWM = 3.3V , T = 25°C 0.1 0.5 µA Snap Back Voltage VSB ISB = 50mA 2.8 V Clamp Voltage VC IPP = 1A, tp = 8/20μs Any I/O to Ground 5.5 V IPP = 10A, tp = 8/20μs Any I/O to Ground 10.5 IPP = 25A, tp = 8/20μs Any I/O to Ground 18.0 IPP = 40A, tp = 8/20μs Line-to-Line1, two I/O Pins connected together on each line 25.0 Dynamic Resistance2 RDYN TLP , tp=100ns, Any I/O to Ground 0.15 Ω ESD Withstand Voltage VESD IEC 61000-4-2 (Contact) ±30 kV IEC 61000-4-2 (Air) ±30 kV Diode Capacitance CI/O to GND Between I/O Pins and Ground VR = 0V , f = 1MHz 3.5 5.0 pF CI/O to I/O Between I/O Pins VR = 0V , f = 1MHz 1. 7 pF Notes: 1. Rating with 2 pins connected together per sugguested diagram ( For example, pin1 is connected to pin 10, pin 2 is connected to Pin 9, Pin 4 is connected to pin 7 and pin 5 is connected to pin 6) 2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns

TVS Diode Array (SPA ® Diodes) Lightning Surge Protection - SP3374NUTG © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/13/19 Capacitance vs. Reverse Bias 0.0 3.0 6.0 9.0 12.0 15.0 00 .5 11 .5 22 .5 33 .5 Capacitance (pF) Bias Voltage (V) 05 10 15 20 25 Clamp Voltage (VC) Peak Pulse Current-IPP (A) Clamping Voltage vs. IPP (I/O to GND) 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Pe rcen t of IPP 8/20μS Pulse Waveform 0 5 10 15 20 25 30 35 40 Clamp Voltage (VC) Peak Pulse Current-IPP (A) Clamping Voltage vs. IPP (Line-to-Line) 0 2 4 6 8 10 TLP Voltage (V) TLP Current (A) T ransmission Line Pulsing(TLP) Plot

TVS Diode Array (SPA ® Diodes) Lightning Surge Protection - SP3374NUTG © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/13/19 Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Substrate material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 Part Number Package Min. Order Qty. SP337 4NUTG µDFN-10 (3.0x2.0mm) 3000

Ordering Information

TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-dow Critical Zone TL to TP Critical Zone TL to TP Soldering Parameters Part Numbering System SP 3374N U T G Package /uni03BCDFN-10 (3.0x2.0mm) T= Tape & Reel G= Green TVS Diode Arrays (SPA Diodes) ® Series Part Marking System bG4 Reflow Condition Pb – Free assembly Pre Heat - T emperature Min (Ts(min)) 150°C - T emperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) T emp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - T emperature (TL) (Liquidus) 217°C - T emperature (tL) 60 – 150 seconds Peak T emperature (TP) 260+0/-5 °C Time within 5°C of actual peak T emperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak T emperature (TP) 8 minutes Max. Do not exceed 260°C

TVS Diode Array (SPA ® Diodes) Lightning Surge Protection - SP3374NUTG © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/13/19 T ape & Reel Specification — µDFN-10 (3.0x2.0mm) Package µDFN-10 (3.0x2.0mm) Symbol Millimeters A0 2.30 +/- 0.10 B0 3.20 +/- 0.10 E 1 .75 +/- 0.10 F 3.50 +/- 0.05 K0 1 .0 +/- 0.10 P 4.00 +/- 0.10 P0 4.00 +/- 0.10 P2 2.00 +/- 0.10 T 0.3 +/- 0.05 W P P0 P2 ø1.55±0.05 E FA0 T Top Cover Tape 5° Max Pin1 Location Device Orientation in Tape ø1.0±0.1 Package Dimensions — µDFN-10 (3.0x2.0mm) PIN1 INDICATOR D E A A1A3 be L 1.40mm 1.00mm 0.60mm 0.65mm 0.65mm 0.60mm 0.60mm 0.95mm 0.95mm 0.25mm 1.98mm 0.40mm 1.40mm 0.85mm 0.60mm 0.65mm 0.65mm 0.60mm 0.60mm 0.95mm 0.95mm 0.25mm 1.98mm Recommended Soldering Pads Layout Recommended Stencil Apertures 0.40mm Recommended Stencil thickness 5mils Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Package µDFN-10 (3.0x2.0mm) JEDEC MO-229 Symbol Millimeters Inches Min Nom Max Min Nom Max A3 0.15 Ref 0.006 Ref e 0.60 BSC 0.024 BSC e1 0.65 BSC 0.026 BSC e2 0.95 BSC 0.037 W P P0 P2 ø1.55±0.05 E FA0 T Top Cover Tape 5° Max Pin1 Location Device Orientation in Tape ø1.0±0.1 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.