SP3213

SP3213 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

• ESD, IEC 61000-4-2, ±12kV contact, ±18kV air
• EFT , IEC 61000-4-4, 40A (5/50ns)
• Lightning, 2A (8/20 as defined in IEC 61000-4-5 2nd Edition)
• Low leakage current of 0.02μA(TYP) at 5V
• Space efficient 0201 footprint
• AEC-Q101 qualified
• Halogen free, lead free and RoHS compliant
• Moisture Sensitivity Level(MSL -1)
• Ultra-high speed data lines
• DisplayPort(TM)
• Thunderbolt (Light Peak)
• V-by-One®
• LVDS interfaces
• Consumer, mobile and portable electronics
• Tablet PC and external storage with high speed interfaces Pinout Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP3213 0.09pF 12kV Bidirectional Discrete TVS Ultra Low Capacitance ESD Protection - SP3213 RoHS Pb GREEN

©2019 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 03/21/19 TVS Diode Arrays(SPA® Diodes) General Purpose ESD Protection - SP1026 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Pulse Current (tp=8/20μs) 2 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR=1μA, I/O to I/O 5 V Breakdown Voltage VBR IR=1mA, I/O to I/O 6.2 7. 5 V Reverse Leakage Current ILEAK VR=5V 0.02 0.1 μA Clamp Voltage1 VC Ipp=1A, tp=8/20µs, I/O to I/O 12 15 V Ipp=2A, tp=8/20µs, I/O to I/O 14.5 18 V Dynamic Resistance 2 RDYN TLP , tP=100ns, I/O to I/O 1. 2 Ω ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±12 kV IEC 61000-4-2 (Air Discharge) ±18 kV Diode Capacitance1 CCI/O-I/O Reverse Bias=0V , f=1MHz, I/O to I/O 0.09 pF Note: 1 Parameter is guaranteed by design and/or component characterization. 2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns Capacitance vs. Reverse Bias AQ1026 SeriesUltra Low Capacitance ESD Protection - SP3213 Clamping Voltage vs. IPP 0.0 0.1 0.2 0.3 Capacitance (pF) Bias Voltage (V) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 Clamp Voltage- Vc (V) Peak Pulse Current-IPP (A)

©2019 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 03/21/19 TVS Diode Arrays(SPA® Diodes) General Purpose ESD Protection - SP1026 AQ1026 SeriesUltra Low Capacitance ESD Protection - SP3213 Positive T ransmission Line Pulsing(TLP) Plot IEC 61000-4-2 +8kV Contact ESD Clamping Voltage 05 10 15 20 25 30 35 40 TLP Current (A) TLP Voltage (V) Negative T ransmission Line Pulsing(TLP) Plot IEC 61000-4-2 -8kV Contact ESD Clamping Voltage -25 -20 -15 -10 TLP Current (A) TLP Voltage (V) Insertion Loss (S21) I/O to GND Attenuation (dB) -15 -12 10 100 1000 10000 Frequency (MHz) -15 -12 Attenuation (dB) 10 100 1000 10000 Frequency (MHz)

©2019 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 03/21/19 TVS Diode Arrays(SPA® Diodes) General Purpose ESD Protection - SP1026

3.4 Gbps, High Speed Display interfaces

6 Gbps, SATA, HDMI 2.x interfaces 10 Gbps, USB 3.1 Gen 2, Thunderbolt Ultra Low Capacitance ESD Protection - SP3213

©2019 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 03/21/19 TVS Diode Arrays(SPA® Diodes) General Purpose ESD Protection - SP1026

Ordering Information

Part Number Package Min. Order Qty. SP3213-01UTG μDFN-2 15000 Part Numbering System Part Marking System U: /uni03BCDFN-2 SP 3213 01 U T G Series Packag e T= Tape & Reel G= Green Number of Channels TVS Diode Arrays (SPA Diodes) AQ1026 SeriesUltra Low Capacitance ESD Protection - SP3213 Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Soldering Parameters

©2019 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 03/21/19 TVS Diode Arrays(SPA® Diodes) General Purpose ESD Protection - SP1026 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. ,Ref. ,Ref. ,Ref. 8mm TAPE AND REEL Embossed Carrier T ape & Reel Specification — μDFN-2 Symbol Millimeters Inches Min Max Min Max A0 0.33 0.40 0.013 0.016 B0 0.63 0.70 0.025 0.028 D0 1 .40 1 .60 0.055 0.063 E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.136 0.140 K0 0.30 0.39 0.012 0.015 P0 1 .90 2.10 0.075 0.083 P1 1 .95 2.05 0.077 0.081 P2 3.90 4.10 0.154 0.161 T 0.13 0.25 0.005 0.010 W 7 .90 8.30 0.311 0.327 0º MAX 0º MAX T W P2 P1 D0 E F 0.20 ± 0.05 Ultra Low Capacitance ESD Protection - SP3213 Package Dimensions — μDFN-2 (0201) D E PIN1 Top View Bottom View Side View b A Side View 1L1 e optional Recommended soldering pad layout 1 0.24mm 0.14mm 0.62mm 0.30mm 0.24mm Package μDFN-2 (0201) JEDEC MO-236 Symbol Millimeters Inches Min Max Min Max A 0.25 0.33 0.010 0.013 b 0.18 0.28 0.007 0.011 L1 0.12 0.22 0.005 0.009 L2 0.13 0.23 0.005 0.009 D 0.60 BSC 0.024 BSC E 0.30 BSC 0.012 BSC e 0.35 REF 0.014 REF