SP3050 LITTELFUSE | Alldatasheet
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Features
t&4% *&$ L7DPOUBDU L7BJS t&'5 *&$ (5/50ns) t-JHIUOJOH *&$ " çT t-PXDBQBDJUBODFPGQ' (TYP) per I/O t-PXMFBLBHFDVSSFOUPG ç" ."9 BU7 t4NBMM405 packaging t-$%1%157T t.POJUPST t/PUFCPPLT t&UIFSOFU t'JSFXJSF t4FU5PQ#PYFT t'MBU1BOFM%JTQMBZT t1PSUBCMF.FEJDBM Pinout I/O 1 GND I/O 2 I/O 4 VCC I/O 3 Functional Block Diagram 1 2 3 6 5 4
2 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance Diode Array for ESD and Surge Protection SP3050 Lead-Free/Green Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 1/POSFQFUJUJWFQVMTFQFSXBWFGPSNPOQBHF Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp çT 1 10.0 " TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -50 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range -65 to 150 °C .BYJNVN+VODUJPO5FNQFSBUVSF 150 °C .BYJNVN-FBE5FNQFSBUVSF 4PMEFSJOHT 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V 38. IRõ" 6.0 V 3FWFSTF-FBLBHF$VSSFOU I-&", VR=5V 0.1 0.5 " Clamp Voltage1 VC IPP Up IPP Up IPP Up ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) ±20 kV *&$ "JS ±30 kV Diode Capacitance1 C*0(/% 3FWFSTF#JBT 7 2.4 3.0 Q' 3FWFSTF#JBT 7 2.0 Q' Diode Capacitance1 CI/O-I/O 3FWFSTF#JBT 7 1. 2 Q' /PUFT1 Parameter is guaranteed by design and/or device characterization. 2 Repetitive pulse per waveform on page 3.
3©2009 Littelfuse, Inc. SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance Diode Array for ESD and Surge Protection SP3050 Lead-Free/Green Series Lead-Free/Green SP3050 Pulse WaveformCapacitance vs. Reverse Bias Clamping Voltage vs. IPP 0.0 0.5 1.0 1.5 2.0 2.5 3.0 DC Bias (V) Capacitance (pF) VCC=Float VCC =5V VCC =3.3V 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 1 2 3 4 5 6 7 8 9 10 Peak Pulse Current-IPP (A) Clamp Voltage (VC ) 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110%
4 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance Diode Array for ESD and Surge Protection SP3050 Lead-Free/Green Series Application Example VBUS VBUS VBUS VBUS GND GND CT RT RT RT RT CT CT CT USB Port USB Port USB Controller VBUS SP3050-04HTG Dual Port Protection VCC Ethernet PHY TX + TX - RX + RX - VCC GND SP3050-04HTG TX + TX - RX + RX - Unused Unused Unused RJ45 Unused To Twisted-Pair Network 75 75 75 75 10/100 Ethernet Differential Protection
5©2009 Littelfuse, Inc. SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance Diode Array for ESD and Surge Protection SP3050 Lead-Free/Green Series Lead-Free/Green SP3050 Pins 6 JEDEC MO-203 Issue A Millimeters Inches Notes Min Max Min Max A 0.900 1 .450 0.035 0.057 - A1 0.000 0.150 0.000 0.006 - A2 0.900 1 .300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1 .500 1 .750 0.06 0.069 3 e 0.95 Ref 0.037 4 ref - e1 1 .9 Ref 0.07 48 Ref - L 0.100 0.600 0.004 0.023 N 66 6 a 0º 10º 0º 10º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - O P R M Recommended Solder Pad Layout /PUFT %JNFOTJPOJOHBOEUPMFSBODFTQFS"/4*. 1BDLBHFDPOGPSNTUP&*"+4$ %JNFOTJPOT%BOE&BSFFYDMVTJWFPGNPMEnBTI QSPUSVTJPOT PSHBUFCVSST 'PPUMFOUI-NFBTVSFEBUSFGFSFODFUPTFBUJOHQMBOF i-wJTUIFMFOHUIPGnBUGPPUTVSGBDFGPSTPMEFSJOHUPTVCTUSBUF i/wJTUIFOVNCFSPGUFSNJOBMQPTJUJPOT $POUSPMJOHEJNFOTJPO.*--*.&5&3$POWFSUFEJODIEJNFOTJPOTBSFOPUOFDFTTBSJMZ FYBDU Reflow Condition 1Co'SFFBTTFNCMZ Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak ¡$TFDPOENBY TS(max) to TL - Ramp-up Rate ¡$TFDPOENBY Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate ¡$TFDPOENBY Time 25°C to peak Temperature (TP) NJOVUFT.BY Do not exceed 260°C Soldering Parameters
6 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance Diode Array for ESD and Surge Protection SP3050 Lead-Free/Green Series
Ordering Information
Part Number Package Marking Min. Order Qty. 41)5( SOT23-6 - 3000 Product Characteristics Lead Plating .BUUF5JO Lead Material $PQQFS"MMPZ Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material .PMEFE&QPYZ Flammability 6-7 /PUFT "MMEJNFOTJPOTBSFJONJMMJNFUFST 2. Dimensions include solder plating. %JNFOTJPOTBSFFYDMVTJWFPGNPMEnBTINFUBMCVSS "MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF" #MPJTGBDJOHVQGPSNPMEBOEGBDJOHEPXOGPSUSJNGPSN JFSFWFSTFUSJNGPSN 1BDLBHFTVSGBDFNBUUFmOJTI7%* Part Numbering System Part Marking System SP 3050 04 H T G Silicon Protection Array Series Number of Channels Package H: SOT23-6 T= Tape & Reel G= Green L*4 L * 4 Product Series L = SP3050 Number of Channels Assembly Site (Varies) L = SP3050 (Varies)
7©2009 Littelfuse, Inc. SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance Diode Array for ESD and Surge Protection SP3050 Lead-Free/Green Series Lead-Free/Green SP3050 Embossed Carrier T ape & Reel Specification -- SOT23-6 GENERAL INFORMA TION 1. 3000 PIECES PER REEL. 2. ORDER IN MUL TIPLES OF FULL REELS ONL Y. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 2.0mm 4.0mm CL 1.75mm1.5mm DIA. HOLE 8mm 4.0mm 8.4mm 180mm 14.4mm 13mm 60mm ACCESS HOLE COVER TAPE USER DIRECTION OF FEED PIN 1 SOT-23 (8mm POCKET PITCH)