DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

Features

Applications

The SP3030 includes low capacitance rail to rail diodes with an additional Zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±20kV contact discharge) without performance degradation. The low loading capacitance makes it ideal for protecting high speed data lines such as HDMI, DVI, USB2.0, USB3.0 and eSATA.

  • ESD protection of ±20kV contact discharge, ±30kV air discharge, (IEC61000-4-2)
  • EFT protection, IEC61000-4-4, 40A p=5/50ns)
  • Lightning Protection, IEC61000-4-5, 3A p=8/20µs)
  • Low capacitance of 0.5pF @ VR=0V
  • Low leakage current of 0.1μA at 5V
  • Small SOD882 packaging helps save board space
  • AEC-Q101 qualified (SOD882 package)
  • Tablets
  • Ultrabook
  • eReader
  • Smart Phones
  • Digital Cameras
  • MP3/ PMP
  • Set Top Boxes
  • Portable Medical Pinout Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN USB3.0 Application Example SP3030 Series 0.5pF 20kV Unidirectional Discrete TVS (AEC-Q101 qualified) USB Port USB Controller Signal Ground IC *Packages are shown as transparent SP1003 SP3030 (x6) SSTX+ SSTX- SSRX+ SSRX- VBUS HDMI Port HDMI Chipset D2+ D2- *Packages are shown as transparent CEC SCL IC SP3030 (x8) SP3002 D1+ D1- D0+ D0- CLK+ CLK- HPD PWR SDA Additional Information Datasheet SamplesResources

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3030 Series SP3030 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 3.0 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM 5 V Reverse Leakage Current ILEAK VR=5V with 1pin at GND 0.1 0.5 µA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Fwd 9.2 V IPP=2A, tp=8/20µs, Fwd 10.0 V ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) ±20 kV IEC61000-4-2 (Air) ±30 kV Dynamic Resistance RDYN (VC2-VC1)/(IPP2-IPP1) 0.55 Ω Diode Capacitance1 CI/O-I/O Reverse Bias=0V , f=1 MHz 0.5 pF Note: 1 . Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND 10 1001 000 Frequency (MHz) -10 Attenuation (dB) Normalized Capacitance vs. Reverse Voltage Bias Voltage (V) Normalized Capacitance (pF) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 HDMI 1.4 Eye Diagram USB3.0 Eye Diagram

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3030 Series Soldering Parameters Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Numbering System SP 3030 01 E T G Series Number of Channels Package T= Tape & Reel G= Green TVS Diode Arrays (SPA Diodes) E: SOD882 Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (μs ) Percent of IPP T ransmission Line Pulsing(TLP) Plot TLP Voltage (V) TLP Cu rrent (A) 05 10 15 20 25 Part Marking System X Product IDPin 1 “T” or “W”

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3030 Series Embossed Carrier T ape & Reel Specification — SOD882 Recommended Soldering Pad Layout Symbol JEDEC MO-236 Millimeters Inches Min Typ Max Min Typ Max D 0.45 0.018 W P0 P2 Φ2: 1.55±0.05 E FA0 T Top Cover Tape 3° RE F Φ: 0.40±0.05 Pin1 Device Orientationi nT ape R W MN S H K

Ordering Information

Part Number Package Marking Packaging Options P0/P1 Packaging Specifications Min. Order Qty. SP3030-01ETG SOD882 “T” or “W” Tape & Reel - 8mm tape/7” reel 4mm/2mm EIA-481 10,000 Symbol Tape Dimensions Millimeters Min Max A0 0.65 0.75 B0 1. 10 1 .20 K0 0.50 0.60 E 1 .65 1 .85 F 3.45 3.55 P0 3.90 4.10 P1 1 .90 2.10 P2 1 .95 2.05 T 1 .95 2.05 W 7 .90 8.10 Symbol Reel Dimensions (Size Ø 178) Millimeters Min Max M 177 .0 179.0 N 59.0 61 .0 W 11. 0 12.0 W1 8.5 9.5 H 12.5 13.5 S 1. 9 2.1 K 10.8 11. 2 R 0.95 1 .05 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.