SP3010-04UTG

SP3010 LITTELFUSE | Alldatasheet

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Technical content

Features

t&4% *&$ ±8kV contact, ±15kV air t&'5 *&$ (5/50ns) t-JHIUOJOH *&$ " UP=8/20μs) t-PXDBQBDJUBODFPG Q' 5:1 QFS*0 t-PXMFBLBHFDVSSFOUPG ç" 5:1 BU7 t4NBMMGPSNGBDUPSV%'/ package saves board space t-$%1%157T t%7%1MBZFST t%FTLUPQT t.11.1 t4FU5PQ#PYFT t.PCJMF1IPOFT t/PUFCPPLT t%JHJUBM$BNFSBT Pinout 5 4 3 2 1 6 7 8 9 10 Functional Block Diagram GND (Pins 3,8) Pin 5 Pin 2 Pin 1 Pin 4 GND (Pins 3,8) Pin 5 Pin 2 Pin 1 Pin 4 *Pins 6, 7 , 9, 10 are not internally connected but should be connected to the trace. SP3010 Lead-Free/Green SeriesRoHS Pb GREENHF -JGF4VQQPSU/PUF Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

Revised: February 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for ESD Protection SP3010 Lead-Free/Green Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 3.0 " T01 0QFSBUJOH5FNQFSBUVSF -40 to 85 °C T4503 Storage Temperature -60 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units 3FWFSTF4UBOEPGG7PMUBHF V38. I3õ˜" 6.0 V 3FWFSTF-FBLBHF$VSSFOU I-&", V3 Clamp Voltage1 VC IPP Up 'XE 10.8 V IPP Up 'XE 12.3 V %ZOBNJD3FTJTUBODF 3 %:/ (VC2 - VC1) / (IPP2 - IPP1) 1 .5 Ω &4%8JUITUBOE7PMUBHF1 VESD IEC61000-4-2 (Contact) ±8 kV *&$ "JS ±15 kV Diode Capacitance1 C*0(/% 3FWFSTF#JBT 7 0.45 Q' /PUFT1 Parameter is guaranteed by design and/or device characterization.

69©2010 Littelfuse, Inc. Revised: February 25, 2010 SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Ultra-Low Capacitance Diode Array for ESD Protection SP3010 Lead-Free/Green Series Lead-Free/Green SP3010 Insertion Loss (S21) I/O to GNDCapacitance vs. Bias Voltage Clamping Voltage vs. IPP 0.0 0.1 0.2 0.3 0.4 0.5 0.6 I/O Bias Voltage (V) I/O Capacitance (pF) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 Peak Pulse Current-IPP (A) Clamp Voltage (VC) -30 -25 -20 -15 -10 10 100 1000 10000 Frequency (MHz) Attenuation (dB) Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110%

Revised: February 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for ESD Protection SP3010 Lead-Free/Green Series Reflow Condition 1Co'SFFBTTFNCMZ Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Product Characteristics Lead Plating 1SF1MBUFE'SBNF Lead Material $PQQFS"MMPZ Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 /PUFT "MMEJNFOTJPOTBSFJONJMMJNFUFST 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. "MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF" 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Part Numbering System Part Marking System SP 3010 0x U T G Silicon Protection Array Series Package UDFN-10 (2.5x1.0mm) T= Tape & Reel G= Green Number of Channels -04 = 4 Channel Q H 4 Product Series Q = SP3010 Assembly Site Number of Channels Part Number Package Marking Min. Order Qty. 4165( V%'/ QH4 3000

Ordering Information

71©2010 Littelfuse, Inc. Revised: February 25, 2010 SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Ultra-Low Capacitance Diode Array for ESD Protection SP3010 Lead-Free/Green Series Lead-Free/Green SP3010 Embossed Carrier T ape & Reel Specification – UDFN-10 Package Dimensions - uDFN-10 (2.5x1.0x0.5mm) Package uDFN-10 (2. 5x1.0x0.5mm) Symbol Millimeters A0 1 .30 +/- 0.10 B0 2.83 +/- 0.10 D0 Ø 1 .50 + 0.10 D1 Ø 1 .00 + 0.25 E 1 .75 +/- 0.10 F 3.50 +/- 0.05 K0 0.65 +/- 0.10 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00 +/- 0.05 T 0.254 +/- 0.02 T F E W 5º Max 5º Max uDFN-10 (2.5x1.0x0.5mm) Symbol Millimeters Inches Min Nom Max Min Nom Max A1 0.00 -- 0.05 0.000 0.022 A3 3FG 3FG e 0.50 BSC 0.020 BSC D E B Top View A A Bottom View 0.05 C b C Seating Plane Side View

0.10 C AM B

0.05 CM L e 2xR0.075mm (7x) R0.125 0.05 C X P Z (C) G Y (Y1) Soldering Pad Layout Soldering Pad Layout Dimensions Inch Millimeter C (0.034) (0.875) G 0.008 0.20 P 0.020 0.50 P1 0.039 1 .00 X 0.008 0.20 X1 0.016 0.40 Y 0.027 0.675 Y1 (0.061) (1 .55) Z 0.061 1 .55