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The SP3004 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. SP3004 Lead-Free/Green SeriesRoHS Pb GREEN t-PXDBQBDJUBODFPG 0.85pF (TYP) per I/O t&4%QSPUFDUJPOPGL7 contact discharge, L7BJSEJTDIBSHF (IEC61000-4-2) t&'5QSPUFDUJPO IEC61000-4-4, 40A (5/50ns) t-PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t4NBMM405QBDLBHF saves board space t-JHIUOJOH1SPUFDUJPO IEC61000-4-5, 4A (8/20μs) t$PNQVUFS1FSJQIFSBMT t.PCJMF1IPOFT t1%"T t%JHJUBM$BNFSBT t/FUXPSL)BSEXBSF1PSUT t5FTU&RVJQNFOU t.FEJDBM&RVJQNFOU Pinout Functional Block Diagram I/O2 I/O1 GND I/O3 VCC I/O4 I/O 1 I/O 2 VCC I/O 3 I/O 4 GND HF -JGF4VQQPSU/PUF Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
Revised: August 19, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array SP3004 Lead-Free/Green Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 4 A TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -50 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V RWM IR ≤ 1μA 6 V Reverse Leakage Current I LEAK VR=5V 0.5 μA Clamp Voltage1 VC IPP=1A, tp=8/20μs, Fwd 10.0 12.0 V IPP=2A, tp=8/20μs, Fwd 11 .8 15.0 V ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) kV IEC61000-4-2 (Air) kV Diode Capacitance1 C*0(/% Reverse Bias=0V 0.95 1 .1 1 .25 pF Reverse Bias=1 .65V 0.7 0.85 1 pF Diode Capacitance1 CI/O-I/O Reverse Bias=0V 0.5 pF /PUF1 Parameter is guaranteed by design and/or device characterization.
75©2010 Littelfuse, Inc. Revised: August 19, 2010 SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3004 Lead-Free/Green Series Lead-Free/Green SP3004 Capacitance vs. Bias VoltageInsertion Loss (S21) I/O to GND Capacitance vs. Frequency -20 -15 -10 Frequency [Hz] Insertion Loss [dB] 2E-13 4E-13 6E-13 8E-13 1E-12 1.2E-12 1.4E-12 1.6E-12 1.8E-12 2E-12 Frequency [Hz] Capacitance [F] I/O Capacitance (pF) I/O DC Bias (V) VCC = 5V VCC = 3.3V VCC = Float 1.50 1.40 1.30 1.20 1.10 1.0 0 0.90 0.80 0.70 0.60 0.50
Revised: August 19, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array SP3004 Lead-Free/Green Series Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Application Example Clk+ Gnd Clk- D2+ Gnd D2- D1+ Gnd D1- D0+ Gnd D0- HDMI or DVI Connector HDMI or DVI Interface IC D0+ D0- D1+ D1- D2+ D2- Clk+ Clk- 6 5 4 SP300x-04 1 2 3 +5V Gnd 6 5 4 SP300x-04 1 2 3 HDMI or DVI application example for the Littelfuse SP300x-04 protection devices. A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +V CC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +V CC of the SP300x-04 can be nPBUFEPS/$
77©2010 Littelfuse, Inc. Revised: August 19, 2010 SPA™ Silicon Pr otection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3004 Lead-Free/Green Series Lead-Free/Green SP3004 Product Characteristics
Ordering Information
.ytQ redrO .niMgnikraMegakcaPrebmuN traP G365TOSGTX40-4003PS X4 5000 Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. TOSegakcaP 563 6sniP Millimeters Inches Min Max Min Max A 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 c HE L AD 6 4 2 3 E e B Part Numbering System Part Marking System SP3004-04XTG Silicon Protection Array Series Number of Channels -04 = 4 channel Package X = SOT563, 5000 quantity T= Tape & Reel G= Green GX4 G X 4 Product Series G = SP3004 series Assembly Site (varies) Number of Channels Solder Pad Layout
Revised: August 19, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array SP3004 Lead-Free/Green Series Embossed Carrier T ape & Reel Specification - SOT563 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.077 0.081 D 1 .40 1 .60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 W 7 .70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1 .73 1 .83 0.068 0.072 B0 1 .73 1 .83 0.068 0.072 K0 0.64 0.7 4 0.025 0.029 t 0.22 max 0.009 max