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The SP3003 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. SP3003 Lead-Free/Green SeriesRoHS Pb GREEN t-PXDBQBDJUBODFPG 0.65pF (TYP) per I/O t&4%QSPUFDUJPOPGœL7 contact discharge, ±15kV air discharge, (IEC61000-4-2) t&'5QSPUFDUJPO IEC61000-4-4, 40A (5/50ns) t-PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t4NBMMQBDLBHFTTBWF board space (SC70, SOT553, SOT563, MSOP10) t-JHIUOJOH1SPUFDUJPO IEC61000-4-5, 2.5A (8/20μs) t$PNQVUFS1FSJQIFSBMT t.PCJMF1IPOFT t1%"T t%JHJUBM$BNFSBT t/FUXPSL)BSEXBSF1PSUT t5FTU&RVJQNFOU t.FEJDBM&RVJQNFOU Pinout NC VCC I/O 1 GND I/O 2 I/O 4 VCC I/O 3 I/O 1 GND I/O 2 SP3003-04X/JSP3003-02X/J Functional Block Diagram I/O2 I/O1 GND I/O3 VCC I/O4 I/O1 GND I/O2 VCC SP3003-04SP3003-02 I/O 1 I/O 2 V NC GNDCC NC NC NC I/O 3 I/O 4 SP3003-04A HF -JGF4VQQPSU/PUF Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

Revised: August 19, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array SP3003 Lead-Free/Green Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 2.5 A TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -50 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V RWM IR ≤ 1μA 6 V Reverse Leakage Current I LEAK VR=5V 0.5 μA Clamp Voltage1 VC IPP=1A, tp=8/20μs, Fwd 10.0 12.0 V IPP=2A, tp=8/20μs, Fwd 11 .8 15.0 V ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 kV Diode Capacitance1 C*0(/% Reverse Bias=0V 0.7 0.8 0.95 pF Reverse Bias=1 .65V 0.55 0.65 0.8 pF Diode Capacitance1 CI/O-I/O Reverse Bias=0V 0.35 pF /PUF1BSBNFUFSJTHVBSBOUFFECZEFTJHOBOEPSEFWJDFDIBSBDUFSJ[BUJPO

67©2010 Littelfuse, Inc. Revised: August 19, 2010 SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3003 Lead-Free/Green Series Lead-Free/Green SP3003 Capacitance vs. Bias VoltageInsertion Loss (S21) I/O to GND Capacitance vs. Frequency -10 Frequency [Hz] Insertion Loss [dB] 2E-13 4E-13 6E-13 8E-13 1E-12 1.2E-12 1.4E-12 Frequency [Hz] Capacitance [F] 1.00 0.95 0.90 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0.50 I/O Capacitance (pF) I/O DC Bias (V) VCC = 3.3V VCC = Float VCC = 5V

Revised: August 19, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array SP3003 Lead-Free/Green Series Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Application Example Clk+ Gnd Clk- D2+ Gnd D2- D1+ Gnd D1- D0+ Gnd D0- HDMI or DVI Connector HDMI or DVI Interface IC D0+ D0- D1+ D1- D2+ D2- Clk+ Clk- 6 5 4 SP300x-04 1 2 3 +5V Gnd 6 5 4 SP300x-04 1 2 3 HDMI or DVI application example for the Littelfuse SP300x-04 protection devices. A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +V CC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +V CC of the SP300x-04 can be nPBUFEPS/$

69©2010 Littelfuse, Inc. Revised: August 19, 2010 SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3003 Lead-Free/Green Series Lead-Free/Green SP3003 D A2 A C L E HE 21 3 6 5 4 e e B Pins 6 JEDEC MO-203 Issue A Millimeters Inches Min Max Min Max A 0.80 1 .10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1 .00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1 .85 2.25 0.073 0.089 E 1 .15 1 .35 0.045 0.053 e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Solder Pad Layout D A2 A C L E HE 21 3 6 5not used 4 e e B Pins 5 JEDEC MO-203 Issue A Millimeters Inches Min Max Min Max A 0.80 1 .10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1 .00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1 .85 2.25 0.073 0.089 E 1 .15 1 .35 0.045 0.053 e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Solder Pad Layout Package SOT 553 Pins 5 Millimeters Inches Min Max Min Max A 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1 .50 1 .70 0.059 0.067 E 1 .10 1 .30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1 .50 1 .70 0.059 0.067 c HE L AD 6 4 2 3 E e B 5(not used) Solder Pad Layout

Revised: August 19, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Pr otection Array Products Low Capacitance ESD Protection Array SP3003 Lead-Free/Green Series Product Characteristics Lead Plating Matte Tin (SC70-x, MSOP-10), Pre-Plated Frame (SOT5x3) Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Part Numbering System Part Marking System SP3003-04XTG Silicon Protection Array Series Number of Channels -02 = 2 channel (SC70-5, SOT553 packages) -04 = 4 channel (SC70-6, SOT563, MSOP-10 packages) Package A = MSOP-10, 3000 quantity J = SC70-5 or SC70-6, 3000 quantity X = SOT553 or SOT563, 5000 quantity T= Tape & Reel G= Green XXX X X X Product Series (varies) F, H or P = SP3003 series Assembly Site (varies) Number of Channels (varies) 2 or 4 TOSegakcaP 563 6sniP Millimeters Inches Min Max Min Max A 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 c HE L AD 6 4 2 3 E e B Solder Pad Layout 01POSMegakcaP 01sniP Millimeters Inches Min Max Min Max A - 1.10 - 0.043 A1 0.00 0.15 0.000 0.006 B 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 E 4.67 5.10 0.184 0.200 E1 2.90 3.10 0.114 0.122 e 0.50 BSC 0.020 BSC HE 0.40 0.80 0.016 0.031 Solder Pad Layout

71©2010 Littelfuse, Inc. Revised: August 19, 2010 SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3003 Lead-Free/Green Series Lead-Free/Green SP3003 Embossed Carrier T ape & Reel Specifications - SOT553 and SOT563 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.076 0.081 D 1 .40 1 .60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 W 7 .70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1 .73 1 .83 0.068 0.072 B0 1 .73 1 .83 0.068 0.072 K0 0.64 0.7 4 0.025 0.029 t 0.22 max 0.009 max

Ordering Information

Part Number Package Marking Min. Order Qty. SP3003-02JTG SC70-5 F X2 3000 SP3003-02XTG SOT553 F X2 5000 SP3003-04ATG MSOP-10 F X4 4000 SP3003-04JTG SC70-6 F X4 3000 SP3003-04XTG SOT563 F X4 5000 Embossed Carrier T ape & Reel Specifications - SC70-5 and SC70-6 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.077 0.081 D 1 .40 1 .60 0.055 0.063 D1 1 .00 1 .25 0.039 0.049 P0 3.90 4.10 0.154 0.161 W 7 .70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.960 K0 1 .12 1 .32 0.044 0.052 t 0.27 max 0.010 max

Revised: August 19, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array SP3003 Lead-Free/Green Series Embossed Carrier T ape & Reel Specification - MSOP-10 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 5.40 5.60 0.213 0.220 D 1 .50 1 .60 0.059 0.063 D1 1 .50 Min 0.059 Min P0 3.90 4.10 0.154 0.161 W 11 .90 12.10 0.469 0.476 P 7 .90 8.10 0.311 0.319 A0 5.20 5.40 0.205 0.213 B0 3.20 3.40 0.126 0.134 K0 1 .20 1 .40 0.047 0.055