SP3003-08ATG LITTELFUSE | Alldatasheet

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Technical content

Features

Applications

The SP3003 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394.

  • ESD protection of ±8kV contact discharge, ±15kV air discharge, (IEC61000-4-2)
  • EFT protection, IEC61000-4-4, 40A (5/50ns)
  • Lightning Protection, IEC61000-4-5, 2.5A (8/20µs)
  • Low capacitance of 0.65pF (TYP) per I/O
  • Low leakage current of 0.5μA (MAX) at 5V
  • Complete line of small packaging helps save board space (SC70, SOT553, SOT563, MSOP10, µDFN-6L)
  • AEC-Q101 qualified (µDFN package)
  • LCD/ PDP TVs
  • DVD Players
  • Desktops
  • MP3/ PMP
  • Digital Cameras
  • Set Top Boxes
  • Mobile Phones
  • Notebooks
  • Computer Peripherals Pinout NC VCC I/O 1 GND I/O 2 I/O 4 VCC I/O 3 I/O 1 GND I/O 2 SP3003-04X/JSP3003-02X/J Functional Block Diagram SP3003-04J/XTG SP3003-04ATG SP3003-02J/XTG SP3003-08ATG 1 2 3 6 5 4 1 2 3 4 5 10 9 8 7 6 1 2 3 1 2 3 4 5 10 9 8 7 65 4 I/O 1 I/O 2 V NC GNDCC NC NC NC I/O 3 I/O 4 SP3003-04A I/O 1 I/O 2 NCI/O 3 I/O 4 SP3003-08A GND I/O 8 I/O 7 I/O 6 I/O 5 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example IC *Package is shown as transparentDVI/ HDMI Port Vcc/NC Vcc/NC Signal GNDGNDGND D2+ GND GND GND GND D2- D1+ D1- D0+ D0- CLK+ CLK- A single, 4 channel SP3003-04 device can be used to protect four (4) of the data lines in a HDMI/DVI interface so two (2) SP3003-04 devices provide protection for all eight (8) TMDS lines. SP3003-02UTG (AEC-Q101 qualified) SP3003-02UTG SP3003 Series 0.65pF Diode Array Additional Information Datasheet SamplesResources

© 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 2.5 A TOP Operating Temperature –40 to 125 °C TSTOR Storage Temperature –55 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR ≤ 1µA 6 V Reverse Leakage Current ILEAK VR=5V 0.5 µA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Fwd 10.0 12.0 V IPP=2A, tp=8/20µs, Fwd 11. 8 15.0 V ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V 0.7 0.8 0.95 pF Reverse Bias=1 .65V 0.55 0.65 0.8 pF Diode Capacitance1 CI/O-I/O Reverse Bias=0V 0.35 pF Note: 1 . Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias VoltageInsertion Loss (S21) I/O to GND -10 Frequency [Hz] Insertion Loss [dB] 1.00 0.95 0.90 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0.50 I/O Capacitance (pF) I/O DC Bias (V) VCC = 3.3V VCC = Float VCC = 5V

© 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Capacitance vs. Frequency 2E-13 4E-13 6E-13 8E-13 1E-12 1.2E-12 1.4E-12 Frequency [Hz] Capacitance [F] Product Characteristics Lead Plating Matte Tin (SC70-x, MSOP-10) Pre-Plated Frame (SOT5x3, µDFN-6) Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters

© 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series D A2 A C L E HE 21 3 6 5 4 e e B Pins 6 JEDEC MO-203 Millimeters Inches Min Max Min Max A 0.80 1. 10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1. 0 0 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1 .85 2.25 0.073 0.089 E 1. 15 1 .35 0.045 0.053 e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Recommended Solder Pad Layout D A2 A C L E HE 21 3 6 5not used 4 e e B Pins 5 JEDEC MO-203 Millimeters Inches Min Max Min Max A 0.80 1. 10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1. 0 0 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1 .85 2.25 0.073 0.089 E 1. 15 1 .35 0.045 0.053 e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Recommended Solder Pad Layout Package SOT 553 Pins 5 Millimeters Inches Min Max Min Max A 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1 .50 1 .70 0.059 0.067 E 1. 10 1 .30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1 .50 1 .70 0.059 0.067 c HE L AD 6 4 2 3 E e B 5(not used) Recommended Solder Pad Layout

© 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Package SOT 563 Pins 6 Millimeters Inches Min Max Min Max A 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1 .50 1 .70 0.059 0.067 E 1. 10 1 .30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1 .50 1 .70 0.059 0.067 c HE L AD 6 4 2 3 E e B

5 Recommended

Recommanded Solder Pad Layout Package Dimensions —µDFN-6L Package µDFN-6L JEDEC MO-229 Pins 6 Millimeters Inches Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 A3 0.125REF 0.005REF b 0.35 0.45 0.014 0.018 b1 0.15 0.25 0.006 0.010 D 1 .55 1 .65 0.062 0.065 D2 - - - - E 0.95 1 .05 0.038 0.042 E2 - - - - e 0.50REF 0.020REF L 0.33 0.43 0.013 0.017 Recommended Solder Pad Layout Recommended Solder Pad Layout JEDEC MO-187 Pins 10 Millimeters Inches Min Max Min Max A - 1. 10 - 0.043 A1 0.00 0.15 0.000 0.006 B 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 E 4.67 5.10 0.184 0.200 E1 2.90 3.10 0.114 0.122 e 0.50 BSC 0.020 BSC HE 0.40 0.80 0.016 0.031

© 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Embossed Carrier T ape & Reel Specification — MSOP-10 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 5.40 5.60 0.213 0.220 D 1 .50 1 .60 0.059 0.063 D1 1 .50 Min 0.059 Min P0 3.90 4.10 0.154 0.161 10P0 40.0± 0.20 1 .57 4±0.008 W 11 .90 12.10 0.469 0.476 P 7 .90 8.10 0.311 0.319 A0 5.20 5.40 0.205 0.213 B0 3.20 3.40 0.126 0.134 K0 1 .20 1 .40 0.047 0.055 t 0.30 ± 0.05 0.012± 0.002 User Feeding Direction Pin 1 Location Embossed Carrier T ape & Reel Specifications — SOT553 and SOT563 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.076 0.081 D 1 .40 1 .60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 10P0 40.0± 0.20 1 .57 4±0.008 W 7 .70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1 .73 1 .83 0.068 0.072 B0 1 .73 1 .83 0.068 0.072 K0 0.64 0.7 4 0.025 0.029 t 0.22 max 0.009 max User Feeding Direction Pin 1 Location Embossed Carrier T ape & Reel Specifications — SC70-5 and SC70-6 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.077 0.081 D 1 .40 1 .60 0.055 0.063 D1 1. 0 0 1 .25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0± 0.20 1 .57 4±0.008 W 7 .70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.960 K0 1. 12 1 .32 0.044 0.052 t 0.27 max 0.010 max User Feeding Direction Pin 1 Location

© 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Part Numbering System SP3003-0x x TG Series Number of Channels -02 = 2 channel (SC70-5, SOT553, µDFN-6L packages) -04 = 4 channel (SC70-6, SOT563, MSOP-10 packages) -08 = 8 channel (MSOP-10 packages) Package A = MSOP-10, 4000 quantity J = SC70-5 or SC70-6, 3000 quantity X = SOT553 or SOT563, 5000 quantity U= µDFN-6L, 3000 quantity T= Tape & Reel G= GreenTVS Diode Arrays (SPA® Diodes) Part Marking System F * * F * * Product Series F=SP3003 series Assembly Site (varies) Number of Channels (varies)

Ordering Information

Part Number Package Marking Min. Order Qty. SP3003-02JTG SC70-5 F*2 3000 SP3003-02UTG µDFN-6L FH2 3000 SP3003-02XTG SOT553 F*2 3000 SP3003-04ATG MSOP-10 F*4 4000 SP3003-04JTG SC70-6 F*4 3000 SP3003-04XTG SOT563 F*4 3000 SP3003-08ATG MSOP-10 F*8 4000 Embossed Carrier T ape & Reel Specification — µDFN-6L Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.076 0.081 D 1 .40 1 .60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 10P0 40.0±0.20 1 .57 4±0.008 W 7 .90 8.30 0.311 0.319 P0 3.90 4.10 0.154 0.161 A0 1. 15 1 .25 0.045 0.049 B0 1 .75 1 .85 0.069 0.073 K0 0.65 0.75 0.026 0.03 t 0.22 max 0.009 max