SP3002-04HTG

SP3002_10 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

0.85 pF (TYP) per I/O t&4%QSPUFDUJPOPG ±12kV contact discharge, ±15kV air discharge, (IEC61000-4-2) t&'5QSPUFDUJPO IEC61000-4-4, 40A (5/50ns) t-PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t4NBMMQBDLBHJOHPQUJPOT saves board space t-JHIUOJOH1SPUFDUJPO IEC61000-4-5, 4.5A (8/20μs) t$PNQVUFS1FSJQIFSBMT t.PCJMF1IPOFT t1%"T t%JHJUBM$BNFSBT t/FUXPSL)BSEXBSF1PSUT t5FTU&RVJQNFOU t.FEJDBM&RVJQNFOU Functional Block Diagram I/O2 I/O1 GND I/O3 VCC I/O4 Pinout I/O 1 I/O 2 SC70-6 and SOT23-6 VCC I/O 3 I/O 4 GND Gnd I/O 1 NC I/O 4 I/O 2 I/O 3 VCC uDFN-6 (1.6x1.6x0.5mm) HF -JGF4VQQPSU/PUF Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array SP3002 Lead-Free/Green Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 4.5 A TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -50 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V RWM IR ≤ 1μA 6.0 V Reverse Leakage Current I LEAK VR=5V 0.5 μA Clamp Voltage1 VC IPP=1A, tp=8/20μs, Fwd 9.5 11 .0 V IPP=2A, tp=8/20μs, Fwd 10.6 13.0 V ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) ±12 kV IEC61000-4-2 (Air) ±15 kV Diode Capacitance1 C*0(/% Reverse Bias=0V 0.95 1 .1 1 .25 pF Reverse Bias=1 .65V 0.7 0.85 1 .0 pF Diode Capacitance1 CI/O-I/O Reverse Bias=0V 0.5 pF /PUF1BSBNFUFSJTHVBSBOUFFECZEFTJHOBOEPSEFWJDFDIBSBDUFSJ[BUJPO

47©2010 Littelfuse, Inc. Revised: February 9, 2010 SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3002 Lead-Free/Green Series Lead-Free/Green SP3002 Capacitance vs. Bias VoltageInsertion Loss (S21) I/O to GND Capacitance vs. Frequency -20 -15 -10 Frequency [Hz] Insertion Loss [dB] 2E-13 4E-13 6E-13 8E-13 1E-12 1.2E-12 1.4E-12 1.6E-12 1.8E-12 2E-12 Frequency [Hz] Capacitance [F] 1.50 1.40 1.30 1.20 1.10 1.0 0 0.90 0.80 0.70 0.60 0.50 I/O Capacitance (pF) I/O DC Bias (V) VCC = 5V VCC = 3.3V VCC = Float

Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array SP3002 Lead-Free/Green Series Application Example Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Clk+ Gnd Clk- D2+ Gnd D2- D1+ Gnd D1- D0+ Gnd D0- HDMI or DVI Connector HDMI or DVI Interface IC D0+ D0- D1+ D1- D2+ D2- Clk+ Clk- 6 5 4 SP300x-04 1 2 3 +5V Gnd 6 5 4 SP300x-04 1 2 3 HDMI or DVI application example for the Littelfuse SP300x-04 protection devices. A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +V CC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +V CC of the SP300x-04 can be nPBUFEPS/$

49©2010 Littelfuse, Inc. Revised: February 9, 2010 SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3002 Lead-Free/Green Series Lead-Free/Green SP3002 Pins 6 JEDEC MO-203 Issue A Millimeters Inches Min Max Min Max A 0.80 1 .10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1 .00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1 .85 2.25 0.073 0.089 E 1 .15 1 .35 0.045 0.053 e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 D A2 A C L E HE 21 3 6 5 4 e e B Solder Pad Layout Pins 6 JEDEC MO-203 Issue A Millimeters Inches Notes Min Max Min Max A 0.900 1 .450 0.035 0.057 - A1 0.000 0.150 0.000 0.006 - A2 0.900 1 .300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1 .500 1 .750 0.06 0.069 3 e 0.95 Ref 0.037 4 Ref - e1 1 .9 Ref 0.07 48 Ref - L 0.100 0.600 0.004 0.023 4,5 N 66 6 a 0º 10º 0º 10º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - O P R M Recommended Solder Pad Layout /PUFT %JNFOTJPOJOHBOEUPMFSBODFTQFS"/4*. 2. Package conforms to EIAJ SC-7 4 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. 5. “L ” is the length of flat foot surface for soldering to substrate. i/wJTUIFOVNCFSPGUFSNJOBMQPTJUJPOT $POUSPMJOHEJNFOTJPO.*--*.&5&3$POWFSUFEJODIEJNFOTJPOTBSFOPUOFDFTTBSJMZ exact.

Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array SP3002 Lead-Free/Green Series Package Dimensions - uDFN (1.6x1.6x0.5mm) uDFN (1.6x1.6x0.5mm) Symbol Millimeters Inches Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 A3 0.127 Ref 0.005 Ref b 0.20 0.30 0.008 0.012 D 1 .50 1 .70 0.060 0.067 D2 1 .05 1 .30 0.042 0.052 E 1 .50 1 .70 0.060 0.067 E2 0.40 0.65 0.016 0.026 e 0.50 Ref 0.020 Ref L 0.25 0.40 0.010 0.016 D E B 1 2 3 6 5 4 Top View Pin 1 Index Area A A 123 54 6 L Pin 1 chamfer 0.10 x 45’ 0.05 C Bottom View 0.05 C 0.05 C b A1 A3 C Seating plane Side View

0.10 C AM B

0.05 CM

51©2010 Littelfuse, Inc. Revised: February 9, 2010 SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3002 Lead-Free/Green Series Lead-Free/Green SP3002 Embossed Carrier T ape & Reel Specification - SC70-6 Symbol Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.077 0.081 D 1 .40 1 .60 0.055 0.063 D1 1 .00 1 .25 0.039 0.049 P0 3.90 4.10 0.154 0.161 W 7 .70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1 .12 1 .32 0.044 0.052 t 0.27 Max 0.010 Max

Ordering Information

Part Number Package Marking Min. Order Qty. SP3002-04HTG SOT23-6 EX4 3000 SP3002-04JTG SC70-6 EX4 3000 SP3002-04UTG V%'/ YYNN EX4 3000 Product Characteristics Lead Plating 4$405.BUUF5JO V%'/1SF1MBUFE'SBNF Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 /PUFT 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Part Numbering System Part Marking System SP3002-04XTG Series Package H = SOT23-6 J = SC70-6 U = uDFN-6 T= Tape & Reel G= GreenSilicon Protection Array Number of Channels -04 = 4 channel EX4 E X 4 Product Series E = SP3002 series Assembly Site (varies) Number of Channels

Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array SP3002 Lead-Free/Green Series Embossed Carrier T ape & Reel Specification -- SOT23-6 Embossed Carrier T ape & Reel Specification -- uDFN-6 (1.6x1.6x0.5mm) GENERAL INFORMA TION 1. 3000 PIECES PER REEL. 2. ORDER IN MUL TIPLES OF FULL REELS ONL Y. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 2.0mm 4.0mm CL 1.75mm1.5mm DIA. HOLE 8mm 4.0mm 8.4mm 180mm 14.4mm 13mm 60mm ACCESS HOLE COVER TAPE USER DIRECTION OF FEED PIN 1 SOT-23 (8mm POCKET PITCH) D1 P0 t F E W D Symbol Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.06 0.07 F 3.45 3.55 0.14 0.14 D1 1 .00 1 .25 0.04 0.05 D .*/ .*/ P0 3.90 4.10 0.15 0.16 W 7 .90 8.30 0.31 0.33 P2 1 .95 2.05 0.08 0.08 A0 1 .78 1 .88 0.07 0.07 B0 1 .78 1 .88 0.07 0.07 K0 0.84 0.94 0.03 0.04 t 0.25 TYP 0.01 TYP