SP3001 | DigiCamel IC Datasheet

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SP3001 LITTELFUSE | Alldatasheet

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PDF pages: 6

Technical content

Features

Applications

The SP3001 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level speciﬁed in the IEC 61000-4-2 international standard (Level 4, 8KV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. SP3001 Lead-Free/Green SeriesRoHS Pb GREEN t-PXDBQBDJUBODFPG 0.65pF (TYP) per I/O t&4%QSPUFDUJPOPGL7 contact discharge, ±15kV air discharge, (IEC61000-4-2) t&'5QSPUFDUJPO IEC61000-4-4, 40A (5/50 ns) t-PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t4NBMM4$QBDLBHF saves board space t$PNQVUFS1FSJQIFSBMT t.PCJMF1IPOFT t1%"T t%JHJUBM$BNFSBT t/FUXPSL)BSEXBSF1PSUT t5FTU&RVJQNFOU t.FEJDBM&RVJQNFOU Pinout I/O 1 I/O 2 VCC I/O 3 I/O 4 GND Functional Block Diagram I/O2 I/O1 GND I/O3 VCC I/O4

24 ©2008 Littelfuse, Inc. Silicon Protection Arrays TM Speciﬁcations are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3001 Lead-Free/Green Series Electrical Characteristics (TOP=25ºC) Thermal Information Parameter Rating Units Storage Temperature Range -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 300 °C Parameter Symbol Test Conditions Min Typ Max Units Zener Breakdown Voltage V BR IR=10μA 6.0 V Reverse Leakage Current I LEAK VR=5V 0.5 μA Clamp Voltage1 VC IPP=1A, tp=8/20μs, Fwd 9.5 V IPP=2A, tp=8/20μs, Fwd 10.6 V ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V 0.80 pF Reverse Bias=1 .65V 0.65 pF Diode Capacitance1 CI/O-I/O Reverse Bias=0V 0.35 pF Note 1: Parameter is guaranteed by device characterization CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IP Peak Current (tp=8/20μs) 2.5 A TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -50 to 150 °C

25©2008 Littelfuse, Inc. Silicon Protection Arrays TM Speciﬁcations are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3001 Lead-Free/Green Series Lead-Free/Green SP3001 Capacitance vs. Bias VoltageInsertion Loss (S21) I/O to GND -10 Frequency [Hz] Insertion Loss [dB] 1.0 0 0.95 0.90 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0.50 I/O Capacitance (pF) I/O DC Bias (V) VCC = 5V VCC = Float VCC = 3.3V Capacitance vs. Frequency 2E-13 4E-13 6E-13 8E-13 1E-12 1.2E-12 1.4E-12 Frequency [Hz] Capacitance [F]

26 ©2008 Littelfuse, Inc. Silicon Protection Arrays TM Speciﬁcations are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3001 Lead-Free/Green Series Application Example Reﬂow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reﬂow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tP) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Clk+ Gnd Clk- D2+ Gnd D2- D1+ Gnd D1- D0+ Gnd D0- HDMI or DVI Connector HDMI or DVI Interface IC D0+ D0- D1+ D1- D2+ D2- Clk+ Clk- 6 5 4 SP300x-04 1 2 3 +5V Gnd 6 5 4 SP300x-04 1 2 3 HDMI or DVI application example for the Littelfuse SP300x-04 protection devices. A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +V CC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +V CC of the SP300x-04 can be ﬂoated or NC.

27©2008 Littelfuse, Inc. Silicon Protection Arrays TM Speciﬁcations are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3001 Lead-Free/Green Series Lead-Free/Green SP3001 Pins 6 JEDEC MO-203 Issue A Millimeters Inches Min Max Min Max A 0.80 1 .10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1 .00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1 .85 2.25 0.073 0.089 E 1 .15 1 .35 0.045 0.053 e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 D A2 A C L E HE 21 3 6 5 4 e e B Part Numbering System Product Characteristics

Ordering Information

Part Number Package Marking Min. Order Qty. SP3001-04JTG SC70-6 D X4 3000 Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Part Marking System Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold ﬂash & metal burr. 4. All speciﬁcations comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte ﬁnish VDI 11-13. SP3001-04JTG Silicon Protection Array Series Number of Channels -04 = 4 channel Package J = SC70-6, 3000 quantity T= Tape & Reel G= Green DX4 D X 4 Product Series D = SP3001 series Assembly Site (varies) Number of Channels Solder Pad Layout

28 ©2008 Littelfuse, Inc. Silicon Protection Arrays TM Speciﬁcations are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance ESD Protection Array SP3001 Lead-Free/Green Series Embossed Carrier T ape & Reel Speciﬁcation - SC70-6 Symbol Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.064 0.072 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.076 0.080 D 1 .40 1 .60 0.055 0.062 D1 1 .00 1 .25 0.039 0.049 P0 3.90 4.10 0.153 0.161 W 7 .70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.960 K0 1 .12 1 .32 0.044 0.052 t 0.27 max 0.010 max

Product Information

SP3001 specifications and overview.

Summary

Low Capacitance ESD Protection Array

Description

The SP3001 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394.

Source title SP3001 Datasheet(PDF) - Littelfuse

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