SP1326 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

  • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air
  • EFT , IEC 61000-4-4, 40A (5/50ns)
  • Lightning, 4A (8/20µs as defined in IEC 61000-4-5 2nd edition)
  • Low leakage current of 0.02μA (TYP) at 5V
  • Space efficient
  • Halogen free, Lead free and RoHS compliant
  • Moisture Sensitivity Level (MSL -1)
  • Mobile phones
  • Smart phones
  • Smart watches
  • Tablets
  • Portable navigation components
  • Portable medical components Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example I/O Controller Outside World Case GND Keypads IC P3 SP1026 (x4) SP1326 15pF 30kV Bidirectional Discrete TVS Pinout and Functional Block Diagram SP1326 SP1326 (x4)

©2017 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/08/18 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1026 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Pulse Current (tp=8/20μs) 4 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM 6.0 V Breakdown Voltage VBR IR=1mA 7. 8 V Leakage Current ILEAK VR=5V 0.02 0.5 μA Clamp Voltage1 VC Ipp=1A, tp=8/20µs 12.0 V Ipp=4A, tp=8/20µs 15.5 V Dynamic Resistance2 RDYN TLP , tP=100ns, I/O to GND 0.35 Ω ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CD Reverse Bias=0V 15 pF Reverse Bias=2.5V 12 pF Note: 1 Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns Capacitance vs. Reverse Bias 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 012345 Capacitance (pF) Bias Voltage (V) 8/20μs Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP SP1326

©2017 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/08/18 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1026 Clamping voltage vs. IPP for 8/20μS waveshape 1234 Clamp Voltage (VC) Peak Pulse Current-IPP (A) Positive T ransmission Line Pulsing (TLP) Plot IEC 61000−4−2 +8 kV Contact ESD Clamping Voltage 02468 10 12 14 16 18 20 22 TLP Voltage (V) TLP Current (A) Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Soldering Parameters SP1326

©2017 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/08/18 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1026

Ordering Information

Part Number Package Marking Min. Order Qty. SP1326-01LTG SOD-523 I I 5000 Part Numbering System SOD-523 SP 1326 01 L T G Series Package T= Tape & Reel G= Green Number of Channels TVS Diode Arrays (SPA® Diodes) Part Marking System Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.004 inches(0.102mm) Substrate material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0. Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Package Dimensions — SOD-523 EE2 b D A L c θ θ Top View Side View Side View 0.60mm 0.70mm 1.42mm Recommended Soldering pad layout Symbol Millimeters Inches Min Max Min Max A 0.51 0.77 0.020 0.030 A1 0.50 0.70 0.020 0.028 b 0.25 0.35 0.010 0.014 c 0.08 0.15 0.003 0.006 D 0.75 0.85 0.030 0.033 E 1. 10 1 .30 0.043 0.051 E1 1 .50 1 .70 0.059 0.067 E2 0.20 REF 0.001 REF L 0.01 0.07 0.000 0.003 θ 7O REF 7O REF SP1326

©2017 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 01/08/18 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1026 Embossed Carrier T ape & Reel Specification — SOD-523 Symbol Millimetres Inches Min Max Min Max A0 0.91 1. 01 0.036 0.040 B0 1 .89 1 .99 0.07 4 0.078 D0 1 .50 1 .60 0.059 0.063 D1 0.40 0.60 0.016 0.024 E1 1 .65 1 .85 0.065 0.073 F 3.40 3.60 0.134 0.142 P0 3.90 4.10 0.154 0.161 P 1 .90 2.10 0.075 0.083 P1 1 .95 2.05 0.077 0.081 K0 0.68 0.78 0.027 0.031 T 0.17 0.23 0.007 0.009 W 7 .90 8.30 0.311 0.327 8mm TAPE AND REEL Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. SP1326