SP1312 LITTELFUSE | Alldatasheet

Document overview

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  • PDF pages: 5

Technical content

Features

  • ESD, IEC 61000-4-2, ±24kV contact, ±30kV air
  • EFT , IEC 61000-4-4, 40A (5/50ns)
  • Lightning, 3A (8/20 as defined in IEC 61000-4-5 nd edition)
  • Low capacitance of 11pF (@ VR=0V)
  • Low leakage current of 0.02μA(TYP) at 12V
  • Industries smallest ESD footprint available (01005)
  • Halogen free, lead free and RoHS compliant
  • Mobile Phones
  • Smart Phones
  • Camcorders
  • Portable Medical
  • Digital Cameras
  • Wearable Technology
  • Portable Navigation Components
  • Tablets
  • Point of Sale Terminals Pinout Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREENSP1312 11pF 24kV Bidirectional Discrete TVS

0201 Flipchip

Note: Drawing not to scale SP1312 1 2

©2018 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 06/06/18 General Purpose ESD Protection - SP1054 Notes: 1. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 3 1 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR≤1μA 12 V Breakdown Voltage VBR IR=1mA 13 15 V Reverse Leakage Current ILEAK VR=12V 0.02 0.5 μA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Fwd 18.5 22 V IPP=3A, tp=8/20µs, Fwd 22.5 27 V Dynamic Resistance2 RDYN TLP , tP=100ns, I/O to I/O 0.48 Ω ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±24 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CD Reverse Bias=0V 11 14 pF Note: 1 Parameter is guaranteed by design and/or component characterization.

2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns

Clamp voltage vs. IPP for 8/20μs Waveshape 0.0 5.0 10.0 15.0 20.0 25.0 11 .5 22 .5 3 Clamp Voltage-Vc (V) Peak Pulse Current-IPP (A) Capacitance vs. Reverse Bias 0.0 3.0 6.0 9.0 12.0 0123456789 10 11 12 Capacitance (pF) Reverse Bias Voltage (V) SP1312

©2018 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 06/06/18 General Purpose ESD Protection - SP1054 8/20μs Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP SP1312 Positive T ransmission Line Pulsing (TLP) Plot 01 02 03 04 05 06 0 TLP Current (A) TLP Voltage (V) Negative T ransmission Line Pulsing (TLP) Plot -40 -35 -30 -25 -20 -15 -10 -60- 50 -40- 30 -20- 10 0 TLP Current (A) TLP Voltage (V) Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone T L to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters

©2018 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 06/06/18 General Purpose ESD Protection - SP1054 Product Characteristics Lead Plating Tin plating Lead Material Copper bump Substrate material Silicon Flammability UL Recognized compound meeting flammability rating V-0

Ordering Information

Part Number Package Min. Order Qty. SP1312-01WTG 01005 Flipchip 15000 Part Numbering System Part Marking System SP 1312 01 T G Series Number of Channels Package T= Tape & Reel G= Green W:01005 Flipchip TVS Diode Arrays (SPA Diodes) W SP1312 Package Dimensions — 01005 Flipchip Symbol

01005 Flipchip

e 0.280 BSC 0.0110 BSC e P A E Top View Bottom View Side View Pin 1 0.15mm 0.23mm 0.30mm 0.15mm 0.23mm 0.30mm 0.15mm Recommended soldering pad layout Stencil apertures D Stencil thickness : 80um Drawing# : W01-A

©2018 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 06/06/18 General Purpose ESD Protection - SP1054 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. SP1312 Embossed Carrier T ape & Reel Specification — 01005 Flipchip ,Ref. ,Ref. ,Ref.