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Technical content

Features

  • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air
  • EFT , IEC 61000-4-4, 50A (5/50ns)
  • Lightning, 5A (8/20μs as defined in IEC 61000-4-5 2nd Edition)
  • Low clamping voltage
  • Low leakage current
  • AEC-Q101 qualified
  • Moisture Sensitivity Level (MSL -1)
  • Halogen free, lead free and RoHS compliant
  • Industrial equipment
  • Test and medical equipment
  • Point-of-Sale terminals
  • Motor controls
  • Legacy ports (RS-232, RS-485)
  • Security and alarm system Pinout and Functional Block Diagram SP1305 30pF, 30kV TVS Diode Array RoHS Pb GREEN

©2019 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 04/11/19 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SM24CANA SP1305 Notes: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Pulse Current (tp=8/20μs) 5.0 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR=1μA, Pin1 or Pin2 to Pin3 5 V Breakdown Voltage VBR IR=1mA, Pin1 or Pin2 to Pin3 6 7 V Reverse Leakage Current ILEAK VR=5V 0.1 0.5 μA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Pin1 or Pin2 to Pin3 8.6 10 V IPP=5A, tp=8/20µs, Pin1 or Pin2 to Pin3 11 13.5 V Dynamic Resistance2 RDYN TLP , tp=100ns, Pin1 or Pin2 to Pin3 0.24 Ω ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) Pin1 or Pin2 to Pin3 ±30 kV IEC 61000-4-2 (Air Discharge) Pin1 or Pin2 to Pin3 ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V , f=1MHz; Pin1 or Pin2 to Pin3 30 40 pF Note: 1 Parameter is guaranteed by design and/or component characterization.

2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns

0.0 10.0 20.0 30.0 40.0 Capacitance (pF) Bias Voltage (V) Capacitance vs. Reverse Bias (Pin1 or Pin2 to Pin3) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 Clamp Voltage-VC (V) Peak Pulse Current-IPP (A) Clamping Voltage vs. Peak Pulse Current

©2019 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 04/11/19 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SM24CANA SP1305 8/20μs Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP Positive T ransmission Line Pulsing (TLP) Plot IEC 61000-4-2 +8kV Contact ESD Clamping Voltage IEC 61000-4-2 -8kV Contact ESD Clamping Voltage 100 110 02 55 07 51 00 1251 50 Ambient Temperature - TA (oC) % of Rated Power I PP Power Derating Curve -40 -35 -30 -25 -20 -15 -10 TLP Current (A) TLP Voltage (V) Negative T ransmission Line Pulsing (TLP) Plot 024681 01 21 41 61 82 0 TLP Current (A) TLP Voltage (V)

©2019 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 04/11/19 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SM24CANA SP1305 Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.004 inches(0.102mm) Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0

Ordering Information

Part Number Package Min. Order Qty. SP1305-02HTG SOT23-3 3000 Part Numbering System Part Marking System SP 1305 02 T G Series Number of Channels Package H: SOT23-3 T= Tape & Reel G= Green TVS Diode Arrays (SPA Diodes) H ALF* Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters

©2019 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 04/11/19 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SM24CANA SP1305 D E e b x 3 A Pin1 Top View Bottom View Side View 0.60 1.300.80 Recommended soldering pad layout (unit :mm) Detail A Detail A L L L1 (gauge plane) θ Drawing# : H01-B 1.30 2.50 2.90 Pins 3 JEDEC TO-236 Millimeters Inches Min Nom Max Min Nom Max A1 0.03 - 0.09 0.001 - 0.004 e 0.95 BSC 0.037 BSC e1 1 .90 BSC 0.075 BSC L1 0.25 BSC 0.010 BSC θ 0° - 8° 0° - 8° θ1 7°TYP 7°TYP GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. COVER TAPE USER DIRECTION OF FEED PIN 1 SOT23-3 (8mm POCKET PITCH) 8.4mm 180mm 14.4mm 13mm 60mm ACCESS HOLE 8mm TAPE AND REEL Embossed Carrier T ape & Reel Specification — SOT23-3 Symbol Millimeters Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 3.40 3.60 0.134 0.142 P2 1 .90 2.10 0.075 0.083 D 1 .40 1 .60 0.055 0.063 P0 3.90 4.10 0.154 0.161 W 7 .70 8.30 0.303 0.327 P 3.90 4.10 0.154 0.161 A0 3.05 3.25 0.120 0.128 B0 2.67 2.87 0.105 0.113 K0 1. 12 1 .32 0.044 0.052 t 0.22 0.24 0.009 0.009 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.