SP1137 ETC | Alldatasheet

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Technical content

30,48 33,50 2x 1,50 38,70 2,50 4,50 A A B B C 12,50 6,00 10,50 Logo on two sides 43,00 0,30 0,10 41,40 0,30 0,10 3,00 11,50 15,00 31,12 38,70 ±0,10 41,00 ±0,10 0,635 2x 2,20 3,49 4,24 4,99 2,50 ±0,15 7,00 ±0,15 40,20 0,30 0,10 47,00 ±0,50 1,60 ±0,20 49,87 1,40 1,00 13,00 SECTION A-A 0,50 13,00 2,00 3,70 4,70 SECTION B-B p=1,27 p=1,27 1,38 0,10 0,05 0,10 DETAIL C SCALE 5 : 1 Pin 25 Pin 50 0,10 A 50x pins A 38,70 40,20 46,00 4x 2,30 2x 0,90 4x 3,60 15,00 26,50 18,50 3,00 8,10 +0,4* 50,7 -0,0 48,57 31,115 D Recommended PCB-layout General tolerances ± 0,05mm PCB outline *For PCB and drill-hole tolerances 3,50 50x 0,45 2x 2,40 Position hole 2x 1,70 Position knob p= 50x 0,635 DETAIL D SCALE 2 : 1 Note: Housing: LCP(Liquid Crystal Polymer)1. Type: S475. Color: Natural, Theromplastic, UL94 V-0 Contact: Copper Alloy2. Operation voltage: 100 VAC max3. Current rating: 0,5 Amp.4. Contact resistance: 40m ohms max.5. Insulation resistance: 1000M ohms min 500 VDC6. Dielectric withstanding voltage: 500VAC/1minute.7. Operating Temperature: -40°C to +85°C.8. Resistance to reflow solder heat:9. Peak temperature: 260°C, duration 1 min. Total reflow process time: 7 min. Durability: 5000 Cycles10. Finish/Plated:11. Terminal:15µ" min AU Plated on Contact Area, 100µ" min Tin Plated on solder area, 50µ min Ni Under Plated over all Grounded Pin: 80µ" min Tin Plated on solder area, 50µ" min Ni Under Plated over all RoHS and REACH compliant12. Storage -25°C to 65°C, 0-90% RH13. UNSPECIFIED DIMENSIONS ACCORDING TO 3D-FILE. To enable usage of other connectors (Second source) MaHal 1.11.1 Rev. Description Date Sign 1.10 Note1. Added LCP type 2019-01-30 Mahal

1.11 Updated Drawing Layout 2019-04-01 Mahal

1.11.1 Changed material definition 2019-04-15 MaHal

Rev. Description Date Sign

1.4 Added support for pins and HMS

1.5 Added pcb-outline to pcb-

1.6 Updated PCB outline value 2014-07-16 RiA

1.7 Added dimensions for contact

1.8 Added coplanarity 2017-10-04 RiA

1.9 Updated note no. 9. with reflow soldering parameters. 2018-12-12 MaHal 1.10 Note1. Added LCP type 2019-01-30 MaHal Blad:1/1 Utskriven: 2019-06-20 Filnamn : SP1137_000Filnamn : SP1137_000 Weight FinishingOwner HMS nr 2019-03-12 1 Sign: 1:1 Stationsgatan 37 S-302 45 Halmstad Tel: +46 (0)35 - 17 29 00 Fax: +46 (0)35 - 17 29 09 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. TOLERANCE: + / - 0,1 Title Date: Rev. of Sheet: Document nr SizeScale HMS Industrial Networks AB The information contained in this drawing is the sole property of HMS Industrial Networks AB. Any reproduction in part or whole whitout the written permission of HMS Industrial Networks AB is prohibited SP11371.11.1 Compact Flash, CompactCom Host Connector