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Technical content

Features

  • RoHS compliant and Lead-free
  • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air
  • EFT , IEC 61000-4-4, 40A (5/50ns)
  • Lightning, IEC 61000-4-5, 2nd Edition, 5A (8/20µs)
  • Low leakage current of 0.5µA (MAX) at 5V
  • Space efficient 0201 footprint)
  • Mobile phones
  • Smart phones
  • PDAs
  • Digital cameras
  • Portable navigation devices
  • Portable medical devices Pinout Pin 1 Pin 2 Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example I/O Controller Outside World Case GND Keypads IC P3 SP1006 (x4) SP1006 Series 25pF 30kV Unidirectional Discrete TVS Additional Information Datasheet SamplesResources

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1006 Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Pulse Current (tp=8/20μs) 5 A TOP Operating Temperature –40 to 125 °C TSTOR Storage Temperature –55 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 30s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM 6.0 V Breakdown Voltage VBR IR=1mA (Pin 1 to 2) 7. 8 V Forward Voltage Drop VF IR=1mA (Pin 2 to 1) 0.8 V Leakage Current ILEAK VR=5V 0.1 0.5 μA Clamp Voltage1 VC Ipp=1A, tp=8/20µs (Pin 1 to 2) 8.3 V Ipp=2A, tp=8/20µs (Pin 1 to 2) 9.2 V Dynamic Resistance RDYN (VC2 - VC1) / (IPP2 - IPP1) 0.9 Ω ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CD Reverse Bias=0V 25 pF Reverse Bias=2.5V 15 pF Note: 1 Parameter is guaranteed by design and/or device characterization. Pulse WaveformCapacitance vs. Reverse Bias Bias Voltage (V) Capacitance (pF) 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1006 Series Clamping Voltage vs. IPP Peak Pulse Current-IPP (A) Clamp Voltage (VC) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Soldering Parameters Package Dimensions — μDFN-2 (0201) Package μDFN-2 (0201) JEDEC MO-236 Symbol Millimeters Min Nom Max A 0.28 0.30 0.32 A1 0.00 0.02 0.05 A2 0.05 0.10 0.15 b 0.20 0.25 0.30 D 0.55 0.60 0.65 E 0.25 0.30 0.35 L1 0.14 0.19 0.24 L2 0.13 0.18 0.23 K1 0.165 REF TOP VIEW BOTTOM VIEW SIDE VIEW

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1006 Series Embossed Carrier T ape & Reel Specification — μDFN-2 Symbol Millimetres Inches Min Max Min Max A0 0.36 0.42 0.014 0.017 B0 0.66 0.72 0.026 0.028 D0 1 .40 1 .60 0.055 0.063 E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.136 0.140 K0 0.39 0.45 0.015 0.018 P0 1 .95 2.05 0.077 0.081 P1 1 .95 2.05 0.077 0.081 P2 3.90 4.10 0.154 0.161 T 0.18 0.22 0.007 0.009 W 7 .90 8.30 0.311 0.327 0º MAX 0º MAX T W P2 P1 D0 E F 0.20 ± 0.05

Ordering Information

Part Number Package Marking Min. Order Qty. SP1006-01UTG μDFN-2 II 10000 Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Numbering System Part Marking System U: /uni03BCDFN-2 SP 1006 01 U T G Series Packag e T= Tape & Reel G= Green Number of Channels TVS Diode Arrays (SPA ® Diodes) Pin 2 Pin 1 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.