SP1005

SP1005_17 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

• ESD, IEC 61000-4-2, ±30kV contact, ±30kV air
• EFT , IEC 61000-4-4, 40A (5/50ns)
• IEC 61000-4-5, 2nd edition: 8/20 Surge, 10A Surge Immunity
• Low capacitance of 30pF (@ VR=0V)
• Low leakage current of 0.1μA at 5V
• Space efficient 0201 and SOD882 footprint
• AEC-Q101 qualified (SOD882 package)
• Halogen-free, lead-free and RoHS compliant
• Mobile Phones
• Smart Phones
• Camcorders
• Portable Medical
• Digital Cameras
• MP3/PMP
• Portable Navigation Devices
• Tablets
• Point of Sale Terminals Pinout Functional Block Diagram 1 2 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example I/O Controller Outside World GND Keypads ICP3 SP1005 (x4) SP1005 Series 30pF 30kV Bidirectional Discrete TVS 1 2 SOD882 (AEC-Q101 qualified)

0201 Flipchip

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/20/17 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1005 Series Notes: 1. “1“ indicates SP1005-01WTG 0201 Flipchip, while “2” indicates SP1005-01ETG SOD882 2. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 10.0 1 A 8.0 2 TOP Operating Temperature –40 to 125 °C TSTOR Storage Temperature –55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM 6.0 V Breakdown Voltage VBR IR=1mA 8.5 9.5 V Leakage Current ILEAK VR=5V with 1 pin at GND 0.1 0.5 μA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Fwd 9.3 V IPP=2A, tp=8/20µs, Fwd 10.0 V IPP=10A, tP=8/20μs, Fwd 15.6 V Dynamic Resistance2 RDYN TLP , tp =100ns, I/O to GND 0.28 Ω ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CD Reverse Bias=0V 30 pF Reverse Bias=2.5V 23 pF Notes: 1 . Parameter is guaranteed by design and/or component characterization. 2. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. Thermal Information Parameter Rating Units Storage Temperature Range –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Pulse WaveformCapacitance vs. Reverse Bias 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 Bias Voltage (V) Capacitance (pF) 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/20/17 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1005 Series Clamping Voltage vs. IPP 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 Peak Pulse Current-IPP (A) Clamp Voltage (VC) Insertion Loss (S21) I/O to GND -35 -30 -25 -20 -15 -10 11 01 00 1000 10000 Frequency (MHz) Attenuation (dB) Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Product Characteristics of SOD-882 Package Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. T ransmission Line Pulsing(TLP) Plot 0246 81 01 21 41 6 TLP Voltage (V) TLP Current (A)

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/20/17 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1005 Series Package Dimensions — 0201 Flipchip Symbol D 0.605 0.655 0.0238 0.0258 E 0.305 0.345 0.0120 0.0140 D1 0.145 0.155 0.0057 0.0061 E1 0.245 0.255 0.0096 0.0100 D2 0.400 BSC 0.0157 BSC A 0.273 0.329 0.0107 0.0130 A2 0.265 0.315 0.0104 0.0124 A1 0.008 0.014 0.0003 0.0006

Ordering Information

Part Number Package Marking Min. Order Qty. SP1005-01WTG 0201 Flipchip • 10,000 SP1005-01ETG SOD882 •a 10,000 Part Numbering SystemPart Marking System SP 1005 01 T G Series Number of Channels Package T= Tape & Reel G= Green W: 0201 Flipchip E: SOD882 x TVS Diode Arrays (SPA Diodes) 0.325 0.325 0.975 0.650 Recommended Soldering Pad Layout 0.650 Symbol JEDEC MO-236 Millimeters Inches Min Typ Max Min Typ Max D 0.45 0.018 SP1005-01WTG a SP1005-01ETG

© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/20/17 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1005 Series Embossed Carrier T ape & Reel Specification — SOD882 Symbol Millimeters A0 0.70±0.045 B0 1 .10±0.045 K0 0.65±0.045 F 3.50±0.05 P1 2.00±0.10 Embossed Carrier T ape & Reel Specification — 0201 Flipchip 0.28 0.30 0.75 0.19 Recommended Solder Pad Footprint A0 K0 B0 T P0P1 D E FW *Sizes in mm Symbol Millimeters A0 0.41±0.03 B0 0.70±0.03 D ø 1 .50 + 0.10 D1 ø 0.20 ± 0.05 E 1 .75±0.10 F 3.50±0.05 K0 0.38±0.03 P0 2.00±0.05 P1 2.00±0.05 P2 4.00±0.10 T 0.23±0.02 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.