SP1004

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Features

t&4% *&$ ±30kV contact, ±30kV air t&'5 *&$ (5/50ns) t-JHIUOJOH *&$ 7A (8/20μs) t-PXMFBLBHFDVSSFOUPG 100nA (MAX) at 5V t5JOZ40%QBDLBHF saves board space t'JUTTPMEFSGPPUQSJOUPG industry standard 0402 (1005) devices t.PCJMFQIPOFT t4NBSUQIPOFT t1%"T t1PSUBCMFOBWJHBUJPO devices t%JHJUBMDBNFSBT t1PSUBCMFNFEJDBMEFWJDFT Pinout Functional Block Diagram HF -JGF4VQQPSU/PUF Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

Revised: November 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products ESD/Surge Protection Devices SP1003 Lead-Free/Green Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units I11 1FBL1VMTF$VSSFOU Up=8/20μs) 7 .0 A T01 Operating Temperature -40 to 85 °C TSTOR Storage Temperature -60 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range -65 to 150 °C Maximum Junction Temperature 150 °C .BYJNVN-FBE5FNQFSBUVSF 4PMEFSJOHT 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units 'PSXBSE7PMUBHF%SPQ V' I' = 10mA 0.8 1 .2 V Reverse Voltage Drop V R IR=1mA 7 .0 7 .8 8.5 V Reverse Standoff Voltage V RWM IR≤1μA 5.0 V 3FWFSTF-FBLBHF$VSSFOU I-&", VR=5V 100 nA Clamp Voltage1 VC Ipp=6A tp=8/20μs 11 .4 V Ipp=7A tp=8/20μs 12.0 V Dynamic Resistance R %:/ (VC2 - VC1) / (I11 - I11) 0.6 Ω ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CD Reverse Bias=0V 30 Q' /PUF11BSBNFUFSJTHVBSBOUFFECZEFTJHOBOEPSEFWJDFDIBSBDUFSJ[BUJPO

33©2010 Littelfuse, Inc. Revised: November 9, 2010 SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. ESD/Surge Protection Devices SP1003 Lead-Free/Green Series Lead-Free/Green SP1003 Pulse WaveformCapacitance vs. Reverse Bias Clamping Voltage vs. IPP 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 DC Bias (V) Capacitance (pF) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 1 2 3 4 5 6 7 Peak Pulse Current-IPP (A) Clamp Voltage (VC) 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Leakage vs. T emperature 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 0 10 20 30 40 50 Temperature (ºC) Leakage Current (nA)

Revised: November 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products ESD/Surge Protection Devices SP1003 Lead-Free/Green Series Application Example Reflow Condition 1Co'SFFBTTFNCMZ Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) oTFDT Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) oTFDPOET Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) oTFDPOET Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Shield Ground Signal Ground I/O port ControllerLow - speed port Outside World(4) SP1003-01DTG Shield Ground Signal Ground I/O port ControllerLow-speed port

35©2010 Littelfuse, Inc. Revised: November 9, 2010 SPA™ Silicon Protection Array Products Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. ESD/Surge Protection Devices SP1003 Lead-Free/Green Series Lead-Free/Green SP1003 Symbol SOD723 Millimeters Inches Min Max Min Max A 0.46 0.51 0.018 0.020 b 0.23 0.28 0.009 0.011 c 0.08 0.13 0.003 0.005 D 0.99 1 .04 0.039 0.041 E 0.58 0.64 0.023 0.025 HE 1 .37 1 .47 0.054 0.058 L 0.15 0.25 0.006 0.010 L HE b c A E D Recommended Solder Pad Layout 1.10 [0.043] 0.50 [0.020] 0.45 [0.018] Millimeters (Inches)

Revised: November 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products ESD/Surge Protection Devices SP1003 Lead-Free/Green Series Embossed Carrier T ape & Reel Specification – SOD723 Symbol Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.064 0.072 F 3.45 3.55 0.135 0.139 D1 0.45 0.55 0.017 0.021 D 150 - - 0.06 - - PO 3.90 4.10 0.153 0.161 W 7 .90 8.20 0.311 0.322 PO 1 .90 2.10 0.07 4 0.082 AO 0.63 0.73 0.024 0.028 A1 3&' 3&' BO 1 .66 1 .76 0.07 0.07 B1 3&' 3&' KO 0.54 0.64 0.021 0.025 KO AO ØD1 P ØD W EF BO t PO

Ordering Information

Part Number Package Marking Min. Order Qty. 41%5( SOD723 C 8000 Product Characteristics Lead Plating 1SF1MBUFE'SBNFPS.BUUF5JO Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability 6-7 /PUFT 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. "MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF" 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 1BDLBHFTVSGBDFNBUUFmOJTI7%* Part Numbering System Part Marking System SP 1003 01 D T G Silicon Protection Array Series Number of Channels Package D: SOD723 T= Tape & Reel G= Green C Product SeriesPin 1 Indicator