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Features

t&4% *&$ ±30kV contact, ±30kV air t&'5 *&$ (5/50ns) t-JHIUOJOH *&$ 7A (8/20μs) t-PXMFBLBHFDVSSFOUPG 100nA (MAX) at 5V t5JOZ40%40% (JEDEC MO-236) package saves board space t'JUTTPMEFSGPPUQSJOUPG industry standard 0402 (1005) devices t.PCJMFQIPOFT t4NBSUQIPOFT t1%"T t1PSUBCMFOBWJHBUJPO devices t%JHJUBMDBNFSBT t1PSUBCMFNFEJDBMEFWJDFT Pinout Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example Shield Ground Signal Ground I/O port ControllerLow - speed port Outside World(4) SP1003-01 Shield Ground Signal Ground I/O port ControllerLow - speed port SP1003 Series - 30pF 30kV Unidirectional Discrete TVS SOD723 SOD882

©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: March 20, 2012 SP1003 Series General Purpose ESD Protection - SP1003 Series 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 1 2 3 4 5 6 7 Peak Pulse Current-IPP (A) Clamp Voltage (VC) 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 0 10 20 30 40 50 Temperature (ºC) Leakage Current (nA) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Pulse Current (tp=8/20μs) 7 .0 A TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -60 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Forward Voltage Drop V F IF = 10mA 0.8 1 .2 V Reverse Voltage Drop V R IR=1mA 6.0 7 .8 8.5 V Reverse Standoff Voltage V RWM IR≤1μA 5.0 V Reverse Leakage Current I LEAK VR=5V 100 nA Clamp Voltage1 VC Ipp=6A tp=8/20μs 11 .4 V Ipp=7A tp=8/20μs 12.0 V Dynamic Resistance R DYN (VC2 - VC1) / (IPP2 - IPP1) 0.6 Ω ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CD Reverse Bias=0V 30 pF Note: 1 Parameter is guaranteed by design and/or device characterization. Pulse WaveformCapacitance vs. Reverse Bias Clamping Voltage vs. IPP 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 DC Bias (V) Capacitance (pF) 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (μs) Percent of IPP Leakage vs. T emperature

37©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: March 20, 2012 SP1003 Series SP1003 General Purpose ESD Protection - SP1003 Series Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Symbol SOD723 Millimeters Inches Min Max Min Max A 0.46 0.65 0.018 0.026 b 0.23 0.35 0.009 0.014 c 0.08 0.13 0.003 0.005 D 0.90 1 .10 0.035 0.043 E 0.58 0.64 0.023 0.025 HE 1 .37 1 .47 0.054 0.058 L 0.15 0.25 0.006 0.010L HE b c A E D Recommended Solder Pad Layout 1.10 [0.043] 0.50 [0.020] 0.45 [0.018] Millimeters (Inches) JEDEC MO-236 Symbol Millimeters Inches Min Max Min Max A 0.40 0.50 0.016 0.02 A1 0.00 0.05 0.000 0.002 D 0.55 0.65 0.022 0.026 E 0.95 1 .05 0.037 0.041 b 0.40 0.60 0.016 0.024 e 0.65 TYP 0.026 TYP L 0.15 0.35 0.006 0.014 D E b e b L L L1L1 PIN 1 ID A Recommended Solder Pad Layout 1.05 0.65 0.25 0.4 0.65 Tol:+/-0.01mm

©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: March 20, 2012 SP1003 Series General Purpose ESD Protection - SP1003 Series Embossed Carrier T ape & Reel Specification — SOD723 Symbol Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.064 0.072 F 3.40 3.60 0.134 0.142 D1 0.45 0.55 0.017 0.021 PO 3.90 4.10 0.153 0.161 W 7 .90 8.20 0.311 0.322 P2/P 1 .90 2.10 0.07 4 0.082 AO 0.60 0.80 0.024 0.032 A1 0.33 REF 0.010 REF BO 1 .61 1 .81 0.063 0.071 B1 1 .10 REF 0.040 REF KO 0.54 0.78 0.021 0.031 KO AO ØD1 P ØD W EF BO t PO P2 User Feeding Direction Pin 1 Location

Ordering Information

Part Number Package Marking Min. Order Qty. SP1003-01DTG SOD723 C 8000 SP1003-01ETG SOD882 C 3000 Product Characteristics Lead Plating Pre-Plated Frame or Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Numbering System Part Marking System SP 1003 * T G Series Package D: SOD723 T= Tape & Reel G= Green Silicon Protection Array (SPA TM Family of TVS Diode Arrays E: SOD882 Number of Channels -01 = 1 Channel C Product ID Cathode Identifier SOD723 C SOD882 Product ID Cathode Identifier Embossed Carrier T ape & Reel Specification — SOD882 Symbol Millimetres Inches Min Max Min Max A 0.65 0.70 0.026 0.028 B 1 .10 1 .20 0.043 0.047 C 0.50 0.60 0.020 0.024 dØ 1 .40 1 .60 0.055 0.063 E 1 .65 1 .85 0.065 0.073 F 3.40 3.60 0.134 0.142 P0 3.90 4.10 0.154 0.161 P 1 .90 2.10 0.075 0.083 P1 1 .90 2.10 0.075 0.083 W 7 .90 8.10 0.311 0.319 User Feeding Direction Pin 1 Location