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Technical content

Features

t-PXDBQBDJUBODFPGQ' (TYP) I/O to I/O t&4%QSPUFDUJPOPGœL7 contact discharge, ±15kV air discharge, (Level 4, IEC61000-4-2) t&'5QSPUFDUJPO IEC61000-4-4, 40A (5/50ns) t-PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t4NBMMQBDLBHFTBWFT board space t-JHIUOJOH1SPUFDUJPO IEC61000-4-5, 2A (8/20μs)

Applications

t$PNQVUFS1FSJQIFSBMT t.PCJMF1IPOFT t%JHJUBM$BNFSBT t%FTLUPQT/PUFCPPLT t-$%1%157T t4FU5PQ#PYFT t%7%1MBZFST t.11.1 NC SP1002-01JTG SP1002-02JTG NC (SC70-3) (SC70-5) 1 3 5 4 SP1002-01JTG SP1002-02JTG Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example SCART MultiMedia Application of SP1002-01 2 x SP1002-01 MultiMedia Device Audio Out L Audio Out R MultiMedia Device Audio In L Audio In R SP1002 Series 5pF 8kV Bidirectional TVS Array

©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: April 14, 2011 SP1002 Series General Purpose ESD Protection - SP1002 Series Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units Voltage Drop V D IR=1mA 8.0 8.8 9.5 V Reverse Standoff Voltage V RWM IR≤1μA with 1 I/O at GND 6.0 V Leakage Current I LEAK VR=5V with I/O at GND 0.5 μA Clamp Voltage1 VC IPP=1A, tp=8/20μs, Fwd 9.2 13.0 V IPP=2A, tp=8/20μs, Fwd 11 .2 16.0 V Dynamic Resistance R DYN (VC2 - VC1) / (IPP2 - IPP1) 2.0 Ω ESD Withstand Voltage1,2 VESD IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 kV Diode Capacitance1 CD Reverse Bias=0V 6 pF Reverse Bias=2.5V 5 pF Reverse Bias=5V 5 pF Notes:

1 Parameter is guaranteed by device characterization

2 A minimum of 1,000 ESD pulses are applied at 1s intervals

Storage Temperature Range -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 2 A TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -60 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes max. Do not exceed 260°C Soldering Parameters

29©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: April 14, 2011 SP1002 Series SP1002 General Purpose ESD Protection - SP1002 Series B E HE e e D A2 A C L 1.30 [0.0512] 0.65 [0.0256] 0.70 [0.0276] 1.90 [0.0748] 0.90 [0.0354] Pins 3 JEDEC MO-203 Issue A Millimeters Inches Min Max Min Max A 0.80 1 .10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1 .00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1 .85 2.25 0.073 0.089 E 1 .15 1 .35 0.045 0.053 e 0.66 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Solder Pad Layout D A2 A C L E HE 21 3 6 5not used 4 e e B Pins 5 JEDEC MO-203 Issue A Millimeters Inches Min Max Min Max A 0.80 1 .10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1 .00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1 .85 2.25 0.073 0.089 E 1 .15 1 .35 0.045 0.053 e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Solder Pad Layout Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13.

©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: April 14, 2011 SP1002 Series General Purpose ESD Protection - SP1002 Series Embossed Carrier T ape & Reel Specification — SC70-3 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.077 0.081 D 1 .40 1 .60 0.055 0.063 D1 1 .00 1 .25 0.039 0.049 P0 3.90 4.10 0.154 0.161 W 7 .70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.30 2.50 0.090 0.098 A1 1 .00 Ref 0.039 Ref B0 2.30 2.50 0.090 0.098 B1 1 .90 Ref 0.07 4 K0 1 .10 1 .30 0.043 0.051 K1 0.60 Ref 0.023 Ref t 0.27 max 0.010 PO ØD1 ØD AO P KO F E W BO t Embossed Carrier T ape & Reel Specification — SC70-5 and SC70-6 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.077 0.081 D 1 .40 1 .60 0.055 0.063 D1 1 .00 1 .25 0.039 0.049 P0 3.90 4.10 0.154 0.161 W 7 .70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1 .12 1 .32 0.044 0.052 t 0.27 max 0.010 max Part Numbering System

Ordering Information

Part Number Package Marking Min. Order Qty. SP1002-01JTG SC70-3 BX1 3000 SP1002-02JTG SC70-5 BX2 3000 Part Marking System SP 1002 XX J T G Series Number of Channels Package T= Tape & Reel G= Green J = SC70-3 SC70-5 -01 = 1 Channel, SC70-3 Package -02 = 2 Channel, SC70-5 Package Silicon Protection Array (SPA TM Family of TVS Diode Arrays BXX BXX Product Series Assembly Site Number of Channels B = SP1002 Series (varies)