SP1001-05XTG

SP1001-02JTG LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

t-PXDBQBDJUBODFPGQ' (TYP) per I/O t&4%QSPUFDUJPOPGL7 contact discharge, 15kV air discharge, (Level 4, IEC61000-4-2) t&'5QSPUFDUJPO IEC61000-4-4, 40A (5/50 ns) t-PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t4NBMMQBDLBHFTBWFT board space t-JHIUOJOH1SPUFDUJPO IEC61000-4-5, 2.5A (8/μs)

Applications

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12 ©2008 Littelfuse, Inc. Silicon Protection Arrays TM Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 8pF ESD Protection Array SP1001 Lead-Free/Green Series Absolute Maximum Ratings Symbol Parameter Value Units IP Peak Current (tp=8/20μs) 2 A TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -60 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units Forward Voltage Drop V F IF=10mA 0.7 0.9 1 .2 V Reverse Voltage Drop V R IR=10mA 6.0 6.7 8.0 V Reverse Standoff V RWM IR≤1μA 5.5 V Reverse Leakage Current I LEAK VR=5V 0.5 μA Clamp Voltage1 VC IPP=1A, tp=8/20μs, Fwd 8.0 11 .0 V IPP=2A, tp=8/20μs, Fwd 9.7 13.0 V ESD Withstand Voltage1,2 VESD IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 kV Diode Capacitance1 CD Reverse Bias=0V 12 pF Reverse Bias=2.5V 8 pF Reverse Bias=5V 7 pF Notes:

1 Parameter is guaranteed by device characterization

2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode Thermal Information Parameter Rating Units Storage Temperature Range -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 300 °C Capacitance vs. Reverse Bias DC Bias (V) Capacitance (pF)

13©2008 Littelfuse, Inc. Silicon Protection Arrays TM Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 8pF ESD Protection Array SP1001 Lead-Free/Green Series Lead-Free/Green SP1001 Application Example Design Consideration Because of the fast rise-time of the ESD transient, placement of ESD devices is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install the ESD suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes max. Do not exceed 260°C Soldering Parameters Shield Ground SP 1001-04JTG (SC70-5) SP 1001-04XTG (SOT553) Outside World Input LCD module Controller Signal Ground

14 ©2008 Littelfuse, Inc. Silicon Protection Arrays TM Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 8pF ESD Protection Array SP1001 Lead-Free/Green Series B E HE e e D A2 A C L Pins 3 JEDEC MO-203 Issue A Millimeters Inches Min Max Min Max A 0.80 1 .10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1 .00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1 .85 2.25 0.073 0.089 E 1 .15 1 .35 0.045 0.053 e 0.66 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Part Numbering System

Ordering Information

Part Number Package Marking Min. Order Qty. SP1001-02JTG SC70-3 A X2 3000 SP1001-02XTG SOT553 A X2 5000 SP1001-04JTG SC70-5 A X4 3000 SP1001-04XTG SOT553 A X4 5000 SP1001-05JTG SC70-6 A X5 3000 SP1001-05XTG SOT563 A X5 5000 Part Marking System SP1001 -02 JT G Silicon Protection Array Series Number of Channels 02 = 2 Channel 04 = 4 Channel 05 = 5 Channel Package J = SC70-3, -5 or -6, 3000 qty X = SOT553 or SOT563, 5000 qty T= Tape & Reel G= Green Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. AXX A X X Product Series A = SP1001 series Assembly Site (varies) Number of Channels (varies) Solder Pad Layout

15©2008 Littelfuse, Inc. Silicon Protection Arrays TM Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 8pF ESD Protection Array SP1001 Lead-Free/Green Series Lead-Free/Green SP1001 Pins 6 JEDEC MO-203 Issue A Millimeters Inches Min Max Min Max A 0.80 1 .10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1 .00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1 .85 2.25 0.073 0.089 E 1 .15 1 .35 0.045 0.053 e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 D A2 A C L E HE 21 3 6 5 4 B B B D A2 A C L E HE 21 3 6 5not used 4 e e B Pins 5 JEDEC MO-203 Issue A Millimeters Inches Min Max Min Max A 0.80 1 .10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1 .00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1 .85 2.25 0.073 0.089 E 1 .15 1 .35 0.045 0.053 e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions - SOT 553 Package SOT 553 Pins 5 Millimeters Inches Min Max Min Max A 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.018 0.003 0.007 D 1 .50 1 .70 0.059 0.067 E 1 .10 1 .30 0.043 0.051 e 0.50 BSC 0.014 BSC L 0.10 0.30 0.004 0.012 HE 1 .50 1 .70 0.059 0.067 5(not used) c HE L A D 6 4 2 3 E e B Solder Pad Layout Solder Pad Layout Solder Pad Layout

16 ©2008 Littelfuse, Inc. Silicon Protection Arrays TM Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 8pF ESD Protection Array SP1001 Lead-Free/Green Series Package Dimensions - SOT 563 Package SOT 563 Pins 6 Millimeters Inches Min Max Min Max A 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1 .50 1 .70 0.059 0.067 E 1 .10 1 .30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1 .50 1 .70 0.059 0.067 c HE L AD 6 4 2 3 E e B Embossed Carrier T ape & Reel Specification - SC70-3 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.077 0.081 D 1 .40 1 .60 0.055 0.063 D1 1 .00 1 .25 0.039 0.049 P0 3.90 4.10 0.154 0.161 W 7 .70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.30 2.50 0.090 0.098 A1 1 .00 Ref 0.039 Ref B0 2.30 2.50 0.090 0.098 B1 1 .90 Ref 0.07 4 K0 1 .10 1 .30 0.043 0.051 K1 0.60 Ref 0.023 Ref t 0.27 max 0.010 Dimensions Solder Pad Layout

17©2008 Littelfuse, Inc. Silicon Protection Arrays TM Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 8pF ESD Protection Array SP1001 Lead-Free/Green Series Lead-Free/Green SP1001 Embossed Carrier T ape & Reel Specification - SC70-5 and SC70-6 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.077 0.081 D 1 .40 1 .60 0.055 0.063 D1 1 .00 1 .25 0.039 0.049 P0 3.90 4.10 0.154 0.161 W 7 .70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1 .12 1 .32 0.044 0.051 t 0.27 max 0.010 max Dimensions Embossed Carrier T ape & Reel Specification - SOT553 and SOT563 Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1 .95 2.05 0.077 0.081 D 1 .40 1 .60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.1 0.154 0.161 W 7 .70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1 .73 1 .83 0.068 0.072 B0 1 .73 1 .83 0.068 0.072 K0 0.64 0.7 4 0.025 0.029 t 0.22 max 0.010 max Dimensions