SP0504BAC LITTELFUSE | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Features

  • An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale Package (.65mm bump pitch)
  • ESD Capability per HBM Standards
  • Signal line protection for applications up to 5VDC

Applications

  • Cell phone handsets
  • Personal Digital Assistants (PDA)
  • Portable handheld equipment (Laptop, Palmtop computers)
  • Computer port, keyboard (USB1.1)
  • Set-Top Box (Audio and Video Ports)
  • PCMCIA cards
  • MP3 players
  • Digital still cameras
  • Digital video cameras PART NUMBER SP0504BACT SP0508BACT SP0516BACT QUANTITY PER REEL 3500 3500 3500 CS PACKAGE SIZE (MM) 1.804 x 1.154 3.104 x 1.154 3.104 x 2.454 DIODE CHANNELS BUMPS B1 B2 B3 A1 A2 A3 D1 D2 D3 D4 D5 C1 C2 C3 C4 C5 B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 R1 R2 R3 R4 R5 A1 A2 A3 A4 A5 SP0504BAC SP0516BAC SP0508BAC

223www.littelfuse.com SP0504BAC, SP0508BAC, SP0516BAC TVS Avalanche Diode Array in a Unipolar Chip Scale Package TVS Diode Arrays PARAMETER Reverse Standoff Voltage Reverse Standoff Leakage Current Signal Clamp Voltage Positive Negative Clamp Voltage during ESD MIL-STD-883D Method 3015 ESD Test Level IEC-61000-4-2, Contact discharge MIL-STD-883D Method 3015 (HBM) Capacitance Turn on/off Time Temperature Range Operating Storage TEST CONDITIONS I = 10µA V =TBD I = 10mA I = 10mA 8kV Positive 8kV Negative 2.5VDC @ 1Mhz MIN ± 5.5 5.6 - 1.2 - 40 - 65 MAX 100 8.0 - 0.4 150 UNITS V nA V V V V kV kV pF ns TYPICAL 6.8 - 0.8 - 8 <1 5TVS DIODE ARRAYS PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER V ALUE Pad Size on PCB 0.300mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.350mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.360mm Round Solder Flux Ratio 50/50 by volume Solder Paste T ype No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) T olerance — Edge T o Corner Ball + 50µm Solder Ball Side Coplanarity + 20µm Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260 °C Typical Solder Reflow Thermal Profile (No-Clean Flux) 0 48 97 Time (s) 145 194 242 290 339 387 435 EXHCDRFZZ4Z3Z2PHEXH 250 225 200 175 150 125 100 Temperature ( o C)

TVS Avalanche Diode Array in a Unipolar Chip Scale Package SP0504BAC, SP0508BAC, SP0516BAC TVS Diode Arrays 224 www.littelfuse.com 325 41 B A D C Orientation Marking 325 41 B A Orientation Marking 321 B A Orientation Marking C2C1 D2D1 A2A1 B2B1 A2A1 B2B1 A2A1 B2B1 SP0504BAC SP0508BAC SP0516BAC PACKA GE / PINOUT DIAGRAMS Notes: BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) 1) These drawings are not to scale. Solder Mask Opening 0.350mm DIA. Non-Solder Mask Defined Pad 0.300mm DIA. Solder Stencil Opening 0.360mm DIA.

225www.littelfuse.com 5SILICON PROTECTION CIRCUITS SP0504BAC, SP0508BAC, SP0516BAC TVS Diode Arrays TVS Avalanche Diode Array in a Unipolar Chip Scale Package SP0504BAC 6-bump CSP Mechanical Specificati ons The SP0504BAC SP0504BAC devices are packaged in a 6-bump custom Chip Scale Package (CSP). Dimensions are presented below. CSP Tape and Reel Specificati ons PACKAGE DIMENSIONS Package Custom CSP Bumps 6 Dim Millimeters Inches Min Nom Max Min Nom Max # per tape and reel 3500 pieces Controlling dimension: millimeters B DIMENSIONS IN MILLIMETERS BOTTOM VIEW SIDE VIEW A 0.35 DIA. 63/37 Sn/Pb (Eutectic) or SOLDER BUMPS PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIA. QTY PER REEL P0 P1 To p For tape feeder reference Cover Ta p e P1only including draft.Concentric around B. Ko Embossment User Direction of Feed ±0.2 mm Po Center Lines of Cavity W

10 Pitches Cumulative

Mechanical Package Diagrams Tape Specifications

226 www.littelfuse.com SP0504BAC, SP0508BAC, SP0516BAC TVS Avalanche Diode Array in a Unipolar Chip Scale Package The SP0508BAC devices are packaged in a 6-bump custom Chip Scale Package (CSP). Dimensions are presented below. CSP Tape and Reel Specificati ons PACKAGE DIMENSIONS Package Custom CSP Bumps 10 Dim Millimeters Inches Min Nom Max Min Nom Max # per tape and reel 3500 pieces Controlling dimension: millimeters Mechanical Package Diagrams B B2C2 BOTTOM VIEW SIDE VIEW A DIMENSIONS IN MILLIMETERS AB 0.35 DIA. 63/37 Sn/Pb (Eutectic) or SOLDER BUMPS PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 To p For tape feeder reference Cover Ta p e P1only including draft. Concentric around B. Ko Embossment User Direction of Feed ±0.2 mm Po Center Lines of Cavity W CSP Mechanical Specificati ons SP0508BAC10-bump Tape Specifications

devices are packaged in a 20-bump custom Chip Scale Package (CSP). Dimensions are presented below. CSP Tape and Reel Specificati ons PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Dim Millimeters Inc hes Min Nom Max Min Nom Max # per tape and reel 3500 pieces Controlling dimension: millimeters Mechanical Package Diagrams B B2C2 BOTTOM VIEW SIDE VIEW A DIMENSIONS IN MILLIMETERS ABCD 0.35 DIA. 63/37 Sn/Pb (Eutectic) or SOLDER BUMPS PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 To p For tape feeder reference Cover Ta p e P1only including draft.Concentric around B. Ko Embossment User Direction of Feed ±0.2 mm Po Center Lines of Cavity W CSP Mechanical Specificati ons TVS Diode Arrays 227www.littelfuse.com 5SILICON PROTECTION CIRCUITS TVS Avalanche Diode Array in a Unipolar Chip Scale Package SP0504BAC, SP0508BAC, SP0516BAC Tape Specifications