SP0501BACT LITTELFUSE | Alldatasheet

Document overview

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  • PDF pages: 3

Technical content

Features

  • Single channel suppressor in an EIA 0402 device size
  • ESD Capability
  • Signal line protection for applications up to 5VDC

Applications

  • Cell phone handsets
  • Personal Digital Assistants (PDA)
  • Portable handheld equipment (Laptop, Palmtop computers)
  • Computer port, keyboard (USB1.1)
  • Set-Top Box (Audio and Video ports)
  • PCMCIA cards SP0501BAC TVS Diode Arrays Bumps Part Number SP0501BACT Quantity Per Reel 3500 Package Size mils (mm) 40x20 (1x 0.5) Diode Channels 5TVS DIODE ARRAYS

220 www.littelfuse.com SP0501BACT TVS Diode Arrays TVS Avalanche Diode in a Chip Scale Package Electrical Specifications TA = 25°C Unless Otherwise Specified PARAMETER Reverse Standoff Voltage Reverse Standoff Leakage Current Signal Clamp Voltage Positive Negative Clamp Voltage during ESD MIL-STD 833D (Method 3015.7) ESD Test Level IEC-61000-4-2, Contact discharge MIL-STD-883D Method 3015 (HBM) Capacitance Turn on/off Time Temperature Range Operating Storage TEST CONDITIONS I = 10µA V = 5.5V I = 10mA I = 10mA 8kV 5V @ 1Mhz MIN ±5.9 6.0 -9.2 -40 -65 MAX 100 9.2 - 6.0 150 UNITS V µA V V V V kV kV pF ns TYPICAL 7.5 - 7.5 0 0 15 432 Voltage Across Device (V) 0.076 (.003") 0.15 (.006") 0.36 (.014") 0.076 (.003") 1.0 (.04") 0.5 (.02") 0.36 (.014") 0.076 (.003") NOTE** Metal Bump: 63/37 (Sn/Pb) alloy Outline DrawingTypical Device Capacitance vs. Voltage

221www.littelfuse.com TVS Avalanche Diode in a Chip Scale Package SP0501BACT Printed Circuit Board Recommendations Pad Size in PCB 14 x 6 mils (0.356 x 0.152mm) Pad Shape Rectangle Pad Definition Non Solder Mask Defined Pads (NSMD) Solder Mask Opening 18 x 10 mils (0.457 x 0.254mm) Solder Stencil Thickness 6 mils (0.152mm) Solder Stencil Aperture Opening 14 x 6 mils (0356 x 0.152mm) Solder Flux Ratio 50/50 Solder Paste Type No Clean Board Trace Finish Organic Solderable Preservative (OSP) (Enteck: Cu Plus 106A) 28 mils 14 mils 18 mils 10 mils 2 mils Solder stencil opening/PCB land Solder Mask Opening 6 mils 2 mils TVS Diode Arrays 5TVS DIODE ARRAYS Typical Solder Reflow Thermal Profile (No-Clean Flux) 0 48 97 Time (s) 145 194 242 290 339 387 435 EXHCDRFZZ4Z3Z2PHEXH 250 225 200 175 150 125 100 Temperature ( o C)