SP0333

SP0333 LITTELFUSE | Alldatasheet

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Technical content

Features

Applications

This new broadband protection device from Littelfuse provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces, ADSL2+, and VDSL2+. This new protector combines the TVS diode element with a diode rectifier bridge to provide both longitudinal and differential protection in one package. This design innovation results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution. The application schematic provides the connection information. Pinout Functional Block Diagram SP03-3.3 (SO-8) SeriesRoHS Pb GREEN Agency Approvals - Pending rebmuN eliF ycnegAycnegA E128662 package (JEDEC SO-8) linear capacitance and metallic protection IEC61000-4-5, 100A (8/20μs) nanoseconds component Ethernet SO-8 (Top View) Pin 1 and 8 Pin 4 and 5 Ground Pin 2, 3, 6, and 7 Line out Line outLine in Line in

98 ©2009 Littelfuse, Inc. SPA Silicon Protection Arrays TM Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance TVS protection for high-speed data interfaces SP03-3.3 (SO-8) Series Absolute Maximum Ratings stinUgnitaRretemaraP A051)sμ02/8( tnerruC esluP kaeP W0033)sμ02/8( rewoP esluP kaeP IEC 61000-4-2, Direct Discharge, (Level 4) 30 kV IEC 61000-4-2, Air Discharge, (Level 4) 30 kV Telcordia GR 1089 (Intra-Building) (2/10μs) 100 A A04)sμ013/5( 02.K UTI Electrical Characteristics (TOP = 25°C) Thermal Information stinUgnitaRretemaraP C°521 ot 55-egnaR erutarepmeT gnitarepO C°051 ot 56-egnaR erutarepmeT egarotS C°051erutarepmeT noitcnuJ mumixaM C°003)ylnO spiT daeL - CIOS( )s01 gniredloS( erutarepmeT daeL mumixaM Parameter Symbol Test Conditions Min Typ Max Units Reverse Stand-Off Voltage V RWM V3.3--- Reverse Breakdown Voltage V BR IT= 2μA 3.3 - - V Reverse Breakdown Voltage V BR IT= 50μA 3.3 - - V Reverse Leakage Current I R VRWM= 3.3V, T= 25°C - - 1 μA Clamping Voltage, Line-Ground V C IPP= 50A, tp=8/20 μs - - 11 .5 V Clamping Voltage, Line-Ground V C IPP= 100A, tp=8/20 μs - - 15 V Clamping Voltage, Line-Line V C IPP= 50A, tp=8/20 μs - - 13.5 V Clamping Voltage, Line-Line V C IPP= 100A, tp=8/20 μs - - 18 V Junction Capacitance C j Between I/O Pins and Ground VR=0V , f= 1MHz -1 6 2 5 p F Between I/O Pins VR=0V , f= 1MHz -8 1 2 p F CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

100 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance TVS protection for high-speed data interfaces SP03-3.3 (SO-8) Series Application Example The following schematic shows a high-speed data interface (differential) and longitudinal (common mode) protection from lightning induced surge events. Its surge rating is compatible with the intra-building surge requirements protects against both positive and negative induced surge events. The TeleLink fuse provides overcurrent protection to chipset (Ethernet PHY , T3/E3 PHY , etc.) RING TIP TeleLink (0461 1.25) SP03-3.3 Reflow Condition Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed 260°C Soldering Parameters SPA Silicon Protection Arrays TM

101©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance TVS protection for high-speed data interfaces SP03-3.3 (SO-8) Series SP03-3.3 (SO-8) Part Numbering System Product Characteristics

Ordering Information

.ytQ redrO .niMgnikraMegakcaPrebmuN traP 2500 Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.004 inches (0.102mm) Subsitute Material Silicon Body Material Flammability SP XX XX X T G Silicon Protection Array Series Working Voltage Package T= Tape & Reel G= Green Part Marking System Package Dimensions - Mechanical Drawings and Recommended Solder Pad Outline Package MS-012 (SO-8) 8sniP JEDEC MO-223 Issue A Millimetres Inches Min Max Min Max A 1 .35 1 .75 0.053 A1 0.10 0.25 0.004 0.010 A2 1 .25 1 .65 0.043 0.065 B 0.31 0.51 0.012 0.020 c 0.017 0.25 0.007 0.010 D 4.80 5.00 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 1 .27 BSC 0.050 BSC L 0.40 1 .27 0.016 0.050 o Recommended Soldering Pad Outline (Reference Only) FL First Line: Part number Second Line: Date code FLSP03-3.3 XXXXXXXX Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. SPA Silicon Protection Arrays TM

102 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Low Capacitance TVS protection for high-speed data interfaces SP03-3.3 (SO-8) Series Embossed Carrier T ape & Reel Specification - SOIC Package Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 2.05 0.077 0.081 D 1. 5 1. 6 0.063 D1 1 .50 Min P0 4.1 0.154 0.161 W 12.1 0.468 0.476 P 8.1 0.311 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 K0 2 2.2 0.087 Dimensions SPA Silicon Protection Arrays TM