SMV0603M CERAMATE | Alldatasheet
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TYPE SMV0603M□□□KRR MODEL PAGE 1/9 CITATION DATE Feb. 03, 2009 SUBJECT Structure REV. C01 1. STRUCTURE NO. ITEM DESCRIPTION
1.1 Main Material Zinc Oxide
1.2 End termination Ag/Ni/Sn
1.3 Packaging Reel
1.4 Complies with
1.5 Complies with RoHS
1.6 Lead content < 1000ppm
1.7 Reflow solder profile temperature (Recommend) 250 ℃ L 1.60 ± 0.15 W 0.80 ± 0.10 T(max.) 0.90 a 0.3 ± 0.1
1.8 Dimensions
TYPE SMV0603M□□□KRR MODEL PAGE 2/9 CITATION DATE Feb. 03, 2009 2. ELECTRICAL CHARACTERISTICS N0. ITEM PERFORMANCE TEST METHODS
2.0 Standard
Unless otherwise specified, all tests are made under environmental conditions as given below: Temperature: 5~35°C Relative humidity: 45~85 % RH
2.1 Maximum
AC : *(1) Vrms DC : *(1) V Maximum continuous sine wave(RMS) or DC voltage which may be applied. 2.2 Varistor Voltage V 0.1mA : *(1) V Voltage across the varistor measured at CmA DC. 2.3 Varistor Voltage Temperature Coefficient 0 ~ −0.05 %/°C 2.4 Max. Clamping Voltage *(1) V at 1 A Peak voltage across the varistor with a specified peak impulse current of 8x20μs waveform.
2.5 Withstanding Surge
Current *(1) A The max. current within the varistor voltage change of less than ±10% when one impulse current (8x20μs) applied.
2.6 Energy *(1) Joule
The max. energy absorbed with a varistor voltage change of less than ±10% when one impulse (10x1000μs) is applied.
2.7 Response time Trise < 1 nS
I V v < 5 0μΑ at V1mA×80% 2.8 Leakage current I V v <200μA at V1mA×80% (After Reliability Test) 2.9 Capacitance *(1) pF. Capacitance shall be meas ured at 1 kHz±10%,1 Vrms max.(1 MHz below 100 pF) 0V bias and 20±2℃ *(1) See table 2.1 Electrical Characteristics
TYPE SMV0603M□□□KRR MODEL PAGE 3/9 CITATION DATE Feb. 03, 2009 Table 2.1 Electrical Characteristics Part Number Maximum Allowable Voltage Varistor Voltage Max. Clamping Voltage Withstanding Surge Current Energy Capacitance Symbol AC DC V（1mA） V(＊ 2) A(＊ 3) J PF(＊ 1)(kHz) 0603M080KRR 4 5.5 8( 7.5~10.5 ) ＜20 30 ＞0.1 360 0603M120KRR 6 9 12( 10.2~13.8 ) ＜20 30 ＞0.1 300 0603M150KRR 8 11 15 ( 12.75~17.25 ) ＜25 30 >0.1 250 0603M180KRR 11 14 18( 15.3~20.7 ) ＜30 30 ＞0.1 210 0603M240KRR 14 18 24( 21.6~26.4 ) ＜39 30 ＞0.1 160 0603M270KRR 17 22 27( 24.3~29.7 ) ＜44 48 ＞0.1 145 0603M330KRR 20 26 33( 29.7~36.3 ) ＜54 30 ＞0.1 130 0603M390KRR 25 30 39( 35.1~42.9 ) ＜65 30 ＞0.1 110 0603M470KRR 30 38 47( 42.3~51.7 ) ＜77 30 ＞0.1 90
TYPE SMV0603M□□□KRR MODEL PAGE 4/9 CITATION DATE Feb. 03, 2009 SUBJECT Reliability REV. C01 3. ENVIRONMENTAL CHARACTERISTICS No. Characteristic Test method and description 3.1 High Temperature Storage The specimen shall be subjected to 150 ± 2℃ for 1000 ± 12 hours in a thermostatic bath without load and then stored at room temperature and humidity for 1 to 2 hours. The change of varistor voltage shall be within 10﹪. Step Temperature Period 1 -40±3℃ 30Min±3
2 Room Temperature 1~2 hours
3 125±2℃ 30Min±3
3.2 Temperature Cycle
The temperature cycle of specified temperature shall be repeated five times and then stored at room temperature and humidity for one or two hours. The change of varistor voltage shall be within 10﹪and mechanical damage shall be 4 Room Temperature 1~2 hours 3.3 High Temperature Load After being continuously applied the maximum allowable voltage at 85 ± 2℃ For 1000± 2 hours, the specimen shall be stored at room temperature and humidity for one or two hours, the change of varistor voltage shall be within 10﹪. 3.4 Damp Heat Load/ Humidity Load The specimen should be subjected to 40 ± 2℃, 90 to 95%RH environment, and the maximum allowable voltage applied for 1000 hours, then stored at room temperature and humidity for one or two hours. The change of varistor voltage shall be within 10%. 3.5 Low Temperature Storage The specimen should be subjected to -40 ± 2℃, without load for 500 hours and then stored at room temperature for one or two hours. The change of varistor voltage shall be within 10﹪ 4. TECHNICAL TERM No. Item Specifications Description
4.1 Operating Temperature
-40℃ to +85℃ Operating temperature range without derating.
4.2 Storage Temperature
-40℃ to +125℃ Storage temperature range without voltage applied.
4.3 Transient Response
< 50 ns Time lag between application of surge and varistor's "turn-on" conduction action.
TYPE SMV0603M□□□KRR MODEL PAGE 5/9 CITATION DATE Feb. 03, 2009 SUBJECT Soldering REV. C01 5. SOLDERING RECOMMENDATIONS
5.1 Recommended solder pad layout
（Unit：mm）
5.2 The SIR test of the solder paste shall be done（Based on JIS-Z-3284）
5.3 Steel plate and foot distance printing
Foot distance printing (mm) Steel Plate thickness (mm) > 0.65mm 0.18mm 0.65mm~0.5mm 0.15mm 0.50mm~0.40mm 0.12mm <=0.40 mm 0.10mm
5.4 IR Soldering
Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and solder liquids times. Make sure that the element is not 2.4 The IR reflow and temperature of Soldering for Pb Free subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal gradient. During the soldering process, pre- heating to within 100 degrees of the solders peak temperature is essential to minimize thermal shock.
TYPE SMV0603M□□□KRR MODEL PAGE 6/9 CITATION DATE Feb. 03, 2009 SUBJECT Soldering REV. C01 ☆ IR reflow Pb Free Process suggestion profile (1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150μm (2) Ramp-up rate (217℃ to Peak) + 3℃/second max (3) Temp. maintain at 175 +/-25℃ 180 seconds max (4) Temp. maintain above 217 ℃ 60-150 seconds (5) Peak temperature range 245℃ +20℃/ -10 ℃ time within 5 ℃of actually peak temperature (tp) 10~20 seconds (6) Ramp down rate +6 ℃/second max. ※Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace. 5.5 Resistance to soldering heat-High Temperature Resistance:260℃,10sec-3times.
5.6 Hand Soldering
In hand soldering of the Varistors. Large temperature gradient between preheated the Varistors and the tip of soldering iron may cause electrical failures and mechanical damages such as crackings or breakings of the devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept minimum with following recommended conditions for hand soldering.
5.6.1 Recommended Soldering Condition 1
（1） Solder ： non-activated flux is recommended. （2） Preheating The Varistors shall be preheated so that Temperature Gradient between the devices and the tip of soldering iron is 150 ℃ or below.
TYPE SMV0603M□□□KRR MODEL PAGE 7/9 CITATION DATE Feb. 03, 2009 SUBJECT Soldering REV. C01 （3）Soldering Iron Rated Power of 20w max with 3mm soldering tip in diameter. Temperature of soldering iron tip 380℃max,3-5sec ( The required amount of solder shall be melted in advance on the soldering tip.) （4）Cooling After soldering. The Varistors shall be cooled gradually at room ambient temperature.
5.6.2 Recommended Soldering Condition 2（Without preheating）
（1）Solder iron tip shall not directly touch to ceramic dielectrics. （2）Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external electrode of Varistors.
5.7 Post Soldering Cleaning
5.7.1 Residues of corrosive soldering fluxes on the PC board after cleaning may greatly have influences on the electrical characteristic and the reliability (such as humidity resistance)of the Varistors which have been mounted on the board. It shall be confirmed that the characteristic and the reliability of the devices are not affected by the applied cleaning conditions. 5.7.2. When an ultrasonic cleaning is applied to the m ounted Varistors on PC Boards. Following conditions are recommended for preventing failures or damages of t he devices due to the large vibration energy and the resonance caused by the ultrasonic waves. （1）Frequency 29MHz max （2）Radiated Power 20w/lithr max （3）Period 5minuets max
TYPE SMV0603M□□□KRR MODEL PAGE 8/9 CITATION DATE Feb. 03, 2009 SUBJECT Packaging Specification REV. C01 6. PACKAGING SPECIFICATION 6.1 Carrier tape and transparent cover tape should be heat-sealed to carry the products, and the reel should be used to reel the carrier tape. 6.2 The adhesion of the heat-sealed cover tape shall be 40 +20/ -15grams. 6.3 Both the head and the end portion of the taping shall be empty for reel package and SMT auto-pickup machine. And a normal paper tape shall be connected in the head of taping for the operator to handle Symbol ±0.05 ±0.05 ±0.05 T ±0.05 ±0.05 +0.10 -0.05 ±0.05 ±0.10 ±0.10 ±0.10 W ±0.10 E ±0.10 F ±0.05
TYPE SMV0603M□□□KRR MODEL PAGE 9/9 CITATION DATE Feb. 03, 2009 SUBJECT Reel Dimension REV. C01 7. REEL DIMENSION E C B D A W Symbol A B C D E W W1 Standard packaging：1000 pcs/Reel.