SMTPB STMICROELECTRONICS | Alldatasheet
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Technical content
SMTPB SERIES TRISILTM August 1999 - Ed: 2C SCHEMATIC DIAGRAM BIDIRECTIONAL CROWBAR PROTECTION. BREAKDOWNVOLTAGE RANGE: From 62 V To 270 V. HOLDING CURRENT: I H = 150 mA min REPETITIVE PEAK PULSE CURRENT : IPP = 100 A, 10/1000µs.
FEATURES
The SMTPBxx series has been designedto protect telecommunication equipment against lightning and transient induced by AC power lines.
DESCRIPTION
FOLLOWING STANDARDS: Peak Surge Voltage (V) Voltage Waveform (µs) Current Waveform (µs) Admissible Ipp (A) Necessary Resistor (Ω ) CCITT K20 4000 10/700 5/310 100 - VDE0433 4000 10/700 5/310 100 - VDE0878 4000 1.2/50 1/20 100 - IEC-1000-4-5 level 4 level 4 1.2/50 100 100 FCC Part 68, lightning surge type A 1500 800 200 100 FCC Part 68, lightning surge type B 100 5/320 5/320 25 - BELLCORETR-NWT-001089 First level 2500 1000 500 100 BELLCORETR-NWT-001089 Second level 500 2/10 2/10 500 - CNET l31-24 4000 0.5/700 0.8/310 100 - Any sensitive equipment requiring protection against lightning strikes: ANALOG AND DIGITAL LINE CARDS MAIN DISTRIBUTION FRAMES TERMINALSAND TRANSMISSIONEQUIPMENT GMS-TUBE REPLACEMENT MAIN APPLICATIONS NO AGEING AND NO NOISE IF DESTROYED, THE SMTPB FALLS INTO SHORT CIRCUIT, STILL ENSURING PROTECTION BENEFITS
Symbol Parameter Value Unit R th(j-l) Junctionto leads 20 °C/W R th(j-a) Junctionto ambient. On printed circuit with standard footprint dimensions. 75 °C/W THERMAL RESISTANCES Symbol Parameter VRM Stand-offvoltage IRM Leakage current at stand-off voltage VR ContinuousReverse voltage VBR Breakdownvoltage VBO Breakovervoltage IH Holding current IBO Breakovercurrent IPP Peak pulse current C Capacitance ELECTRICAL CHARACTERISTICS (Tamb =25°C) Type Marking I RM @V RM IR @V R VBO @I BO IH C max. max. note1 max. note2 max. min. note3 typ. note4 Laser µAV µAV V m A m A p F SMTPB62 SMTPB68 SMTPB120 SMTPB200 SMTPB270 W07 W11 W21 W31 W43 108 180 243 120 200 270 160 267 360 800 800 800 800 800 150 150 150 150 150 160 160 140 130 120 All parameters tested at 25°C, except where indicated. Symbol Parameter Value Unit P Power dissipation T lead=5 0 °C5 W IPP Peak pulse current 10/1000µs 8/20µs 2/10µs 100 250 500 A I TSM Non repetitivesurge peak on-state current tp = 20 ms 50 A dV/dt Critical rate of rise of off-state voltage VRM 5K V / µs Tstg Tj Storage temperature range Maximum junction temperature - 55 to + 150 + 150 TL Maximum lead temperature for soldering during 10 s. + 260 °C ABSOLUTE MAXIMUM RATINGS (Tamb =2 5°C) Note 1: IR measured at VR guarantees VBRmin ≥ VR Note 2: Measured at 50 Hz (1 cycle) - Seetest circuit 1. Note 3: See test circuit 2. Note 4: VR = 1V, F = 1MHz. Refer to fig 3 for C versus VR . SMTPBxxx
TEST CIRCUIT 1 FOR IBO and VBO parameters: TEST PROCEDURE : Pulse Test duration (tp = 20ms): - For Bidirectional devices = Switch K is closed - For Unidirectionaldevices = Switch K is open. VOUT Selection - Device with VBO < 200 Volt -VOUT = 250 VRMS ,R1 = 140Ω . - Device with VBO ≥ 200 Volt -VOUT = 480 VRMS ,R2 = 240Ω . TEST CIRCUIT 2 for IH parameter. This is a GO-NOGO Test which allows to confirm the holdingcurrent (IH ) level in a functional test circuit. TEST PROCEDURE : 1) Adjust the current level at the IH value by short circuiting the AK of the D.U.T. 2) Fire the D.U.T with a surge Current : Ipp = 10A , 10/1000µs. 3) The D.U.T will come back off-state within 50 ms max. R -VP VBAT = - 48 V Surge generator D.U.T. 220V static relay. 240 140 D.U.T V BO measureIBO measure tp= 20ms K Transformer 220V/800V Auto Transformer 220V/2A Vout SMTPBxxx
Fig. 1:Non repetitive surge peak on-state current versus overload duration (Tj initial=25°C). I (A)T Tj=25°C V (V)T Fig. 4:On-state voltage versus on-state current (typical values). Fig. 3:Relative variation of junction capacitance versus reverse applied voltage(typical values). Note: For VRM upper than 56V, the curve is extrapolated(dotted line). Fig. 2:Relative variation of holding current versus junction temperature. Fig. 5:Transient thermal impedance junction to ambient versus pulse duration (for FR4 PC Board with recommended pad layout). SMTPBxxx
PACKAGE MECHANICAL DATA. SMC REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 E C LE2 D b Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com Packaging: Standardpackagingis in tapeand reel Weight : 0.25g. FOOTPRINT DIMENSIONS (in millimeters) SMC 2.0 4.2 2.0 3.3 ORDER CODE SM TPB 100 TRISIL PROTECTION 100 A VOLTAGE SURFACE MOUNT Marking :Logo, date code, type code. SMTPBxxx