SMT80C2

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Business-Critical Continuity SXX06E Rev. 08.01.06 Page 1 of 2 Rev. 04.25.11 SIL/SMT80C2 1 of 20 Technical Reference Note SIL/SMT80C2

80 Amp

Total Power: 400 W In put Voltage: 4.7 - 13.8 VDC # o f Outputs: Sin gle Special Features

• 80 A c urrent r ating
• Input v oltage r ange: 4.7-13.8 V Output v oltage: 0.8375-5.1 V Current sh aring
• Industry le ading v alue
• Cost o ptimized de sign
• Excellent tr ansient r esponse
• Output v oltage a djustability
• Pathway f or f uture u pgrades
• Supports si licon v oltage mi gration
• Reduced de sign-in an d q ualification time
• Over-temperature p rotection
• RoHS c ompliant Safety Designed t o mee t: UL, cUL 60950-1 (EN60950) Product Family: SIL/SMT80C2 Series Function: Single In-Line Power Usage: LEDs, ASIC, Memory, FPGAs, Telecom and Networking Equipment, Servers, Industrial Equipment, POL Regulation Definition: The S IL/SMT80C2 is a ne w hi gh de nsity o pen fr ame non -isolated c onverter s eries f or s pace-sensitive a pplications. E ach m odel h as a wi de input voltage range (4.7 - 13.8 V) and offers a wide 0.8375 5.1 V o utput v oltage r ange with a A lo ad. An e xternal r esistor a djusts the o utput v oltage fr om its p re-set v alue o f 0.8375 V t o an y v alue u p t o the m aximum allo wed v alue f or th at m odel. The S IL/SMT80C2 o ffers r emote O N/OFF an d o ver-current p rotection a s standard.

a multi-phase synchronous buck topology. A block diagram of the converter is shown in Figure The output is adjustable over a range of 0.8375-5.1 V b y u sing a r esistor fr om the tr im p in t o -trim pin, or by driving the TRIM pin with a v oltage. The converter can be shut down via the enable p in. This input is run with positive logic that is c ompatible with popular logic devices. Positive logi c implies that the converter is enabled if the in put is high (or floating), and disabled if it is low. Output is monitored for overcurrent and short- circuit conditions. When the PWM controller de tects an overcurrent condition, it forces the m odule into hiccup mode. A typical application is shown in Figure Wide Operating Temperature Range The SIL/SMT80C2's ability to accommodate a wide r ange of ambient temperatures is the result of its e xtremely high power conversion efficiency and r esultant low power dissipation, combined with the e xcellent thermal performance of the PCB substrate. M aximum output power that the module can deliver de pends on a number of parameters, primarily:

• Input voltage range
• Output load current
• Air velocity (forced or natural convection)
• Mounting orientation of target application PCB, i.e., vertical/horizontal mount, or mechanically tied d own (especially important in natural convection conditions).
• Target application PCB design, especially ground planes. These can be effective heatsinks for the con- verter. The SIL/SMT80C2 module has an operating temperature range of to with suitable derating and/ or forced air cooling. Ilimit Lout Vout GNDRemote ON/OFF PWRGD Tri m Vout Vin Phase 1 Phase 2 Upper G/Drive Upper G/Drive Lower G/Drive Lower G/Drive ∩∩∩ ∩∩∩ Lout2 Phase 3 Upper G/Drive Lower G/Drive ∩∩∩ Lout3 Phase 4 Upper G/Drive Lower G/Drive ∩∩∩ Lout4 SIL80C2 Rev. 04.25.11 SIL/SMT80C2 2 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note General Description Figure 1 - Electrical Block Diagram F igure 2 - Standard Application Drawing 12-14 9 15,16,18, 20,22,24 SIL80C2 Enable On/Off Vin GND RtrimCin R L O A D Vout Cout 11 +Sense -Sense Ruvlo Ishare 6 4 Power Good GND 3,7,8,17, 19,21,23

Rev. 04.25.11 SIL/SMT80C2 4 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note Power Good The SIL/SMT80C2 modules have a power good indicator output. This output pin uses positive logic and is o pen collector. Also, the power good output is able to sink mA. The power good signal should not be p ulled any higher than 5.1 When the output of the module is within ±10% of the nominal set point, the power good pin can be pulled hi gh. Ov ertemperature Protection (OTP) The SIL/SMT80C2 is equipped with non-latching overtemperature protection. A temperature sensor m onitors the temperature of the PCB near one the main FETs. If the temperature exceeds a threshold of 150 (typical) the converter will shut down, disabling the output. When the substrate temperature has decr eased by the converter will automatically restart. The converter might experience overtemperature conditions during a persistent overload on the output. Ov erload conditions can be caused by external faults. OTP might also be entered due to a loss of control o f the environmental conditions (e.g. an increase in the converter’s ambient temperature due to a failing f an). Features and Functions

Output Voltage Adjustment (cont'd) The trim equation for the basic configuration shown in Figure is: Rtr im(kΩ) 1.675 Vout - 0.8375 Where Vout is the desired output voltage, Rtrim is the resistance required between Trim and -Trim. The trim equation for the external voltage configuration shown Figure is: Rtr im2(kΩ) Rtr im1 (1.2 - 2Vt) Rtrim1 (Vout - 0.8375) - 1.675 Where Vout is the desired output voltage, Rtrim1 and Rtrim2 are the resistors in Figure and Vt is the applied external voltage. The trim equation for the potentiometer configurations shown in Figure is: V out 0.8375 (Rtr im2 + Rpot)Rtrim1 X (2Rtrim2 + 2Rpot + Rtrim1Rtrim2 + Rtrim1Rpot + 2Rtrim1) Where Vout is the desired output voltage, Rtrim1 and Rtrim2 are the resistors in Figure and Rpot is the resistance of the potentiometer. Undervoltage Lockout The SIL/SMT80C2 has built-in undervoltage lockout to ensure reliable output power. The lockout prevents the unit from operating when the input voltage is too low. The UVLO for the SIL/SMT80C2 can be adjust- ed with the following equation: The trim equation for the undervoltage lockout is: Ru vlo (kΩ) = 124.8 + Vturn_on 10 Vturn_on - 42.06 Rev. 04.25.11 SIL/SMT80C2 6 of 20 Embedded Power for Business-Critical Continuity Application (c ont'd)

point. The remote sense lines will carry very little current and hence do not require a large cross-sectional area. However, if the sense lines are routed on a PCB, they should be located close to a ground plane in order to minimize any noise coupled onto the lines that might impair control loop stability. The module will compensate for a maximum drop of 400 mV. Remember that when using remote sense compensation all the resist ance, parasitic inductance and capacitance of the distribution system are incorporated into the feedback loop of the power module. This can have an effect on the modules compensation capabilities, affecting its stability and dynamic response. Parallel Operation Parallel operation of multiple converters is available since the SIL/SMT80C2 has a current sharing option. The converter will share to within ±10% of full load. To current share, Pin of each module should be connected. Also, the remote sense lines should be connected at the same point. Figure shows the typical current sharing application. Rev. 04.25.11 SIL/SMT80C2 7 of 20 Embedded Power for Business-Critical Continuity Figure 9 - Parallel Application Vin 12-14 Vout SIL80C2 Tri m -Trim Ishare 6 GND

11 Sense-

10 Sense+

-Trim Ishare 6 GND R L O A D Cload Application (c ont'd)

Rev. 04.25.11 SIL/SMT80C2 8 of 20 Embedded Power for Business-Critical Continuity Output Capacitance The SIL/SMT80C2 has output capacitors inside the converter. No output capacitance is required for stable operation. When powering loads with large dynamic current requirements, improved voltage regulation is obtained by inserting low ESR capacitors as close as possible to the load. Low ESR ceramic capacitors will handle the short duration high frequency components of the dynamic current requirement. In addition, higher values of electrolytic capacitors should be used to handle the mid- frequency components. It is equally important to use good design practices when configuring the dc distribution system. Low resistance and low inductance PCB layout traces should be utilized, particularly in the high current output section. Remember that the capacitance of the distribution system and the associated ESR are within the feedback loop of the power capabilities, thus affecting the stability and dynamic response of the module. Note that the maximum rated value of output capacitance varies between models and for each output voltage setpoint. A stability vs. Load Capacitance calculator, (see your sales representative), details how an external load capacitance influences the gain and phase margins of the SIL/SMT80C2. SMT Reflow Guidelines For a SnPb process: Pads should be above 183C (liquidus) for seconds max (60-75 seconds typical) with a peak temperature of 225C. For a leadfree SAC305 process: pads should be above 217C (liquidus) f or seconds max (60-75 seconds typical) with a peak temperature of 250C. W ater Washing Not recommended. Application (c ont'd)

Rev. 04.25.11 SIL/SMT80C2 9 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note Parameter Test Conditions Min Typ Max Units Absolute Maximums Input Voltage 0 13.8 V Enable Voltage 0 5 V Operating Amb ient T emperature 0 85 ˚C Non-Operating Amb ient T emperature -40 125 ˚C Input Specifications Input Voltage 4.7 13.8 Vdc Input Current (No Load) Vin(min) - Vin(max), enabled 500 mA Input Current (quiescent) Converter disabled 10 mA Input Capacitance (Internal) Internal to converter 176 uF Input C apacitance (Ex ternal) Recommend customer added capacitance 47 uF Output Specifications Ouput V oltage 0.8375 5.0 V Output Se tpoint A ccuracy -1.0 +1.0 % Output R egulation (Line) -0.2 +0.2 % O utput R egulation oad) -0.5 +0.5 % Output C urrent ontinuous) 0 80 A Output C urrent (sh ort c ircuit) 0.9, 2.5, 5.1 Vout 130 140 A Output C apacitance (In ternal) 500 uF Output C apacitance (Ex ternal) 12 Vin, 0.9 Vout (Startup capacitance) 0 63,000 uF 12 Vin, 2.5 Vout (Startup capacitance) 0 30,000 uF

12 Vin, 5 Vout (Startup capacitance) 0 11,000 uF

R ipple/Noise eak/Peak) 5 Vin, 0.9 Vout, 0 uF Cout 20 mV 12 Vin, 2.5 Vout, 0 uF Cout 20 mV

12 Vin, 5 Vout, 0 uF Cout 20 mV

Efficiency 5.1 Vin, 0.9 Vout, 80 Aout 82.2 % 12 Vin, 2.5 Vout, 80 Aout 89.1 % 12 Vin, 5 Vout, 80 Aout 93.3 % Dynamic L oad R esponse eak D eviation) 12 Vin, 0.9 Vout, 50-75% lo ad a t A/u s 95 mV Dynamic Load Response (Setting Time) 12 V in, 0.9 Vout, 50-75% lo ad a t A/u s 30 us Dynamic L oad R esponse eak D eviation) 12 Vin, 2.5 Vout, 50-75% lo ad a t A/u s 150 mV Dynamic Load Response (Setting Time) 12 V in, 2.5 Vout, 50-75% lo ad a t A/u s 30 us Dynamic L oad R esponse eak D eviation) 12 Vin, 5 Vout, 50-75% lo ad a t A/u s 150 mV Dynamic Load Response (Setting Time) 12 Vin, 5 Vout, 50-75% lo ad a t A/u s 30 us

Rev. 04.25.11 SIL/SMT80C2 10 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note Parameter Test Conditions Min Typ Max Units Turn On Specifications Turn O n D elay (with V in) 2.7 3 ms Turn O n D elay (with En able) 3 12 ms Output R ise TIme 10% 90% 1.8 2 ms En able Specifications Signal L ow nit O ff) 0 0.7 V Signal Low Current 12 Vin 0 1.2 mA Signal Hi gh nit O n) 12 Vin 3.4 V Signal Hi gh C urrent 1.0 µA Protection Specifications Over C urrent Pr otection Hiccup M ode 108 A Input Under Voltage (Rising) 4.7 V Input Under Voltage (Falling) 4.0 V General Specifications MTBF Telcorida SR-332 3.7 MHrs Weight 45.36 g Switching F requency Per P hase 500 kHz Coplanarity TBD Material Ratings Flammability UL94V-0 Material Type FR4 PCB

0.9 V Setpoint

10: Thermal Derating Curve 5.5 Vin Figure 11: Thermal Derating Curve Vin Figure 12: Effiiciency 0.9 V Figure 13: Control On/Off (Channel Output Voltage, Channel Enable) Figure 14: Typical Ripple Output Rev. 04.25.11 SIL/SMT80C2 11 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note 30 40 50 60 70 80 Ambient (C) Load Current (A)

200 LFM

300 LFM

400 LFM

500 LFM

600 LFM

Ambient (C) Load Current (A) Figure 11A: Thermal derating curve 4.7Vin and 13.8Vin 25 30 35 40 45 50 55 60 65 70 75 80 85 Load (A) Ambient temp (ºC) Thermal derating - 600LFM minimum airflow 4.7Vin, 0.84Vout 13.8Vin, 5.1Vout 13.8Vin, 5.0Vout

Rev. 04.25.11 SIL/SMT80C2 12 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note Figure 16: Short Circuit Characteristic hannel Output Current at A/div, Channel Output Voltage) 15: Transient Response 75% 100% (Channel Current Step at A/div, Channel Output Voltage Deviation)

Rev. 04.25.11 SIL/SMT80C2 13 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note

2.5 V Setpoint

17: Thermal Derating Curve 5.1 Vin Figure18: Thermal Derating Curve Vin Figure 19: Efficiency 2.5 V Figure 20: Control On/Off (Channel Output Voltage, Channel Enable) Figure 21: Typical Ripple Output F igure 22: Transient Response 75% - 100% (Channel Current Step at A/div, Channel Output Voltage Deviation) 30 40 50 60 70 80 Ambient (C) Load Current (A) Ambient (C) Load Current (A)

Rev. 04.25.11 SIL/SMT80C2 14 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note Figure 23: Short Circuit Characteristic hannel Output Current at A/div, Channel Output Voltage)

Rev. 04.25.11 SIL/SMT80C2 15 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note

5.0 V Setpoint

24: Thermal Derating Curve Vin Figure 25: Efficiency 5.0 V Figure 26: Control On/Off (Channel Output Voltage, Channel Enable) Figure 27: Typical Output Ripple ADD TEST CONDITIONS Figure 28: Transient Response 75% 100% (Channel Current Step at A/div, Channel Output Voltage Deviation) Figure 29: Short Circuit Characteristic hannel Output Current at A/div, Channel Output Voltage) 30 40 50 60 70 80 Ambient (C) Load Current (A)

Rev. 04.25.11 SIL/SMT80C2 16 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note Mechanical Dr awings SIL80C-00SADJ-VJ Footprint 2.54 21 PLACES1.27 .050 .100 TYP 2.300 58.42 .050 TYP1.27 APPLY LIQUI-BOND BETWEEN HEATSINK AND PCB. ADJUST APPLICATION STENCIL TO KEEP EXCESS LIQUI-BOND TO A MINIMUM D C B A A B C D SCALE: 3 = 2 SIZE CAD FILE: DWG. NO. B SHEET 1 OF 2 TLA DRAWING APPROVALS DRAWN ENGINEER UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN INCHES TOLERANCES:

2 PLACE 3 PLACE ANGLES

.03 MATERIAL FINISH 12345678 8 7 6 5 4 3 2 1 ARTESYN TECHNOLOGIES EDEN PRAIRIE, MN 55433 PH. 952-941-1100 REV. PROJECT USED ON: 7091259-0000 TITLE: A UPPERCUT 80THIRD ANGLE PROJECTION DATE .015 1 HOLE TOLERANCE: .005 M. HENNIES M. HENNIES 20JUN06 20JUN06 DETACHED LIST 7001259-J000 NOTE: 1. 9300161-0000 PACKAGING AND MATERIAL HANDLING PROCEDURE. 2. COSMETIC AND WORKMANSHIP PER 9300152-0000. 3. LABELS SHOWN FOR PLACEMENT REFERENCE ONLY. .040 1.02 58.932.320 1.160 29.46 31.751.250 60.962.400 .050 TYP1.27 (23X) ±.002 0.64 SQ PINS 17.53 MAX.690 1.57 .062REF 2.79 .110REF ±0.05REF .025 .140 TYP3.56 PART NUMBER REV DESCRIPTION DRAFT DATE 7091259-0000 A RELE ASE TO PRODUCTION M. HENNIES 03/08/07 REVISION RECORD Pin 1 0 0 0.51 .020 1.78 .070 6.86 .270 9.40 .370 11.94.470 14.48.570 17.02.670 19.56.770 22.10.870 24.64.970 27.181.070 29.721.170 32.261.270 34.801.370 37.341.470 39.881.570 42.421.670 44.961.770 47.501.870 50.041.970 52.582.070 4.32 .170 55.122.170 60.202.370 61.982.440 0 0 61.472.420 3.30 .130 4.88 .192 .242 6.15 .730 18.54 FOOTPRINT KEEP OUT AREA PCB OUTLINE THROUGH HOLE .040" DIA (23X) Ø 0.45 ±.003 [1.14 ±0.08] 23x

Rev. 04.25.11 SIL/SMT80C2 17 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note Mechanical Dr awings SIL/SMT80C2-00SADJ-HJ/H3J Footprint 0 0 0.51 .020 6.86 .270 9.40 .370 11.94.470 14.48.570 17.02.670 19.56.770 22.10.870 24.64.970 27.181.070 29.721.170 32.261.270 34.801.370 37.341.470 39.881.570 42.421.670 44.961.770 47.501.870 50.041.970 52.582.070 55.122.170 1.78 .070 57.662.270 60.202.370 61.472.420 61.982.440 0 0 0.51 .020 1.78 .070 31.241.230 1.270 32.26 1.290 32.77 FOOTPRINT THROUGH HOLE .040" DIA (25X) KEEP OUT AREA PCB OUTLINE D C B A A B C D SIZE DWG. NO. B SHEET 2 OF 2 FOOTPRINT 12345678 8 7 6 5 4 32 1 REV. TITLE: 7091259-0100 A Ø 0.45 ±.003 [1.14 ±0.08] 25X .050 1.27 1.160 2X29.46 58.422.300 .040 1.02 2.320 58.93 .100 TYP 2.54

21 PLACES

D C B A A B C D SCALE: 3 = 2 SIZE CAD FILE: DWG. NO. B SHEET 1 OF 1 TLA DRAWING APPROVALS DRAWN ENGINEER UNLESS OTHERWISE SPECIFIED THIRD DIMENSIONS ARE IN INCHES TOLERANCES: .03 MATERIAL FINISH 12345678 8 7 6 5 4 3 PH. 952-941-1100 REV. PROJECT USED ON: 7091259-0100 TITLE: HOLE TOLERANCE: 2 1 ARTESYN TECHNOLOGIES EDEN PRAIRIE, MN 55433 PROJECTION A UPPERCUT 80 ANGLE DATE .015 1 .005 M. HENNIES M. HENNIES 22JUN06 NOTE: 1. 9300161-0000 PACKAGING AND MATERIAL HANDLING PROCEDURE. 2. COSMETIC AND WORKMANSHIP PER 9300152-0000. 3. LABELS SHOWN FOR PLACEMENT REFERENCE ONLY. 2.400 60.96 31.751.250 .050 TYP1.27 (23X) APPLY LIQUI-BOND BETWEEN HEATSINK AND PCB. ADJUST APPLICATION STENCIL TO KEEP EXCESS LIQUI-BOND TO A MINIMUM 2.79 REF .110 .125 REF

3.18 TYP

18.03 MAX

.062 MAX 1.57 .710 REF .120 3.05 PART NUMBER REV DESCRIPTION DRAFT DATE 7091259-0100 A RELEASE TO PRODUCTION M. HENNIES 03/06/07 Pin 1 Model L Dimension SIL80C2-00SADJ REF .120 [3.05] SIL80C2-00SADJ-H3J REF .138 [3.50] L - See Table

Rev. 04.25.11 SIL/SMT80C2 18 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note Mechanical Dr awings SMT80C-00SADJ-VJ Footprint .050 1.27 .100 TYP 2.54 2.300 58.42 .040 1.02 8 7 6 5 4 3 2 1 ARTESYN TECHNOLOGIES PROJECTION DATE .015 1 .005 M. HENNIES M. HENNIES 22JUN06 22JUN06 DETACHED LIST D C B A A B C D SCALE: 3 = 2 SIZE CAD FILE: DWG. NO. B SHEET 1 OF 2 TLA DRAWING APPROVALS DRAWN ENGINEER UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN INCHES TOLERANCES: .03 MATERIAL EDEN PRAIRIE, MN 55433 PH. 952-941-1100 REV. PROJECT USED ON: 7091259-0300 TITLE: A ANGLE FINISH UPPERCUT 80THIRD 2345 HOLE TOLERANCE: 7001259-J300 APPLY LIQUI-BOND BETWEEN HEATSINK AND PCB. ADJUST APPLICATION STENCIL TO KEEP EXCESS LIQUI-BOND TO A MINIMUM .050 (23X) TYP1.27 2.400 60.96 .040 TYP1.02 (2X)1.315 33.40 2.480 62.99 DETAIL A .280 7.11 .065 1.65 NOTE: OUTSIDE SUPPORT IS HIDDEN TO SHOW PIN DIMENSIONS.A .062 1.57REF REF .110 2.79 17.20.677 .610 REF15.49 PART NUMBER REV DESCRIPTION DRAFT DATE 7091259-0300 A RELEASE TO PRODUCTION M. HENNIES 03/06/07 REVISION RECORD Pin 1 .040 1.02 .135 3.43 .140 3.56 .155 3.94 .217 5.51 .440 11.18 .445 11.30 .670 17.02 .752 19.10 .060 1.52 .110 2.79 .140 3.56 .200 5.08 .240 6.10 .340 8.64 .440 11.18 .540 13.72 .640 16.26 23.88.940 .840 21.34 26.421.040 28.961.140 66.552.620 1.240 31.50 1.340 34.04 1.440 36.58 1.540 39.12 1.640 41.66 1.740 44.20 1.840 46.74 1.940 49.28 2.040 51.82 2.140 54.36 2.240 56.90 2.420 61.47 2.440 61.98 2.510 63.75 2.560 65.02 .740 18.80 REV. TITLE: 7091259-0300 D C B A A B C D SIZE DWG. NO. B SHEET 2 OF 2 FOOTPRINT 12345678 8 7 6 5 4 32 1 A PCB OUTLINE KEEP OUT AREA.300X.040" (23X) SMT PAD VERT SMT STAND OUTLINE FOOTPRINT

Rev. 04.25.11 SIL/SMT80C2 19 of 20 Embedded Power for Business-Critical ContinuityTechnical Reference Note Mechanical Dr awings ont'd) SMT80C2-00SADJ-J Footprint .050 1.27 .100 TYP 2.54 2.300 58.42 .040 1.02 2.320 58.93 2X 1.160 29.46 22JUN06 DETACHED LIST 7001259-J200 D C B A A B C D SCALE: 3 = 2 SIZE CAD FILE: DWG. NO. B SHEET 1 OF 2 TLA DRAWING APPROVALS DRAWN ENGINEER UNLESS OTHERWISE SPECIFIED THIRD DIMENSIONS ARE IN INCHES TOLERANCES: .03 MATERIAL FINISH 12345678 8 7 6 5 4 3 PH. 952-941-1100 REV. PROJECT USED ON: 7091259-0200 TITLE: HOLE TOLERANCE: 2 1 ARTESYN TECHNOLOGIES EDEN PRAIRIE, MN 55433 PROJECTION A UPPERCUT 80 ANGLE DATE .015 1 .005 M. HENNIES M. HENNIES 22JUN06 NOTE: 1. 9300161-0000 PACKAGING AND MATERIAL HANDLING PROCEDURE. 2. COSMETIC AND WORKMANSHIP PER 9300152-0000. 3. LABELS SHOWN FOR PLACEMENT REFERENCE ONLY. 2.400 60.96 31.751.250 TYP1.27.050 (23X) .040 TYP1.02 (2X) APPLY LIQUI-BOND BETWEEN HEATSINK AND PCB. ADJUST APPLICATION STENCIL TO KEEP EXCESS LIQUI-BOND TO A MINIMUM 1.57.062REF REF .110 2.79 .710[18.03] MAX .125 3.18 PART NUMBER REV DESCRIPTION DRAFT DATE 7091259-0200 A RELEASE TO PRODUCTION M. HENNIES 03/06/07 REVISION RECORD Pin 1 .020 0.51 .040 1.02 1.195 30.35 1.270 32.26 1.290 32.77 .020 0.51 .048 1.21 .248 6.29 .348 8.83 .448 11.37 .548 13.91 .648 16.45 .748 18.99 .848 21.53 .948 24.07 1.048 26.61 1.148 29.15 1.248 31.69 1.348 34.23 1.448 36.77 1.548 39.31 1.648 41.85 1.748 44.39 1.848 46.93 1.948 49.47 2.048 52.01 2.148 54.55 2.248 57.09 2.348 59.63 2.420 61.47 2.440 61.98 FOOTPRINT D C B A A B C D SIZE DWG. NO. B SHEET 2 OF 2 FOOTPRINT 12345678 8 7 6 5 4 32 1 REV. TITLE: 7091259-0200 A KEEP OUT AREA PCB OUTLINE SMT PAD .045X.070" (25X)

C hart Pin Assignments Single O utput

1 T rim

2 N o Pin

3 G round

4 P ower Good

5 (-) T rim

6 Ishare

7 G round

8 G round

9 En able

14 V in

15 V out

16 V out

17 G round

18 V out

19 G round

20 V out

21 G round

22 V out

10 R em Sense (-)

11 R em Sense (+)

12 V in

13 V in

23 G round

24 V out

25 *Mech Su pport 26 *Mech Su pport *Horizontal v ersion onl y Rev. 04.25.11 SIL/SMT80C2 20 of 20 This is a p reliminary d atasheet. Eme rson N etwork P ower r eserves the r ight t o m ake c hanges t o the in formation c ontained he rein with out no tice an d a ssumes no li ability a s a r esult of its use or application. Embedded Power for Business-Critical ContinuityTechnical Reference Note Americas

5810 Van Allen Way

Carlsbad, CA 92008 USA Telephone: +1 760 930 4600 F acsimile: 760 930 0698 Europe (UK) Waterfront Bu siness P ark Merry Hi ll, D udley West Midlands, DY5 1LX United Kingdom Telephone: +44 (0) 1384 842 211 F acsimile: +44 (0) 1384 843 355 Asia (HK) 14/F, L u P laza

2 Wing Yip Street

Kwun Tong, Kowloon Hong K ong Telephone: +852 2176 3333 F acsimile: +852 2176 3888 For glo bal c ontact, visit : www.PowerConversion.com techsupport.embeddedpower @emerson.com While e very p recaution h as bee n t aken t o e nsure a ccuracy an d c ompleteness in this lit erature, Eme rson N etwork P ower a ssumes no r esponsibility, an d d isclaims all li ability f or d amages r esulting fr om u se o f this in formation or for any errors or omissions. Emerson N etwork P ower an d the Eme rson N etwork P ower log o ar e tr ademarks an d s er- vice m arks o f Eme rson Elec tric C ©2011 Eme rson Electric Co. EmersonNetworkPower.com Embedded Computing Embedded Power Monitoring Outside P lant Power S witching C ontrols Precision Cooling Racks In tegrated C abinets Services Surge Protection Emerson Network Power. The glo bal le ader in e nabling business-critical continuity. AC Power Connectivity DC Power RoHs Compliance(9) RoHS Compliance J Pb-free oHS compliant) Custom Options Custom Options Blank 3.05 mm pin 3.50 mm pin Rated Output Current Rated Output Current A Performance Performance C Cost Optimized Generation Generation Increased Current Density Input Voltage Input Voltage 4.7-13.8 V Output Voltage Output Voltage Single Adjustable O utput Product Family Product Family SIL Single In Line Rated Output Current Rated Output Current A Performance Performance C Cost Optimized Generation Generation Increased Current Density Input Voltage Input Voltage 4.7-13.8 V Output Voltage Output Voltage Single Adjustable O utput Mounting Option Mounting Option Blank Horizontal V Vertical Product Family Product Family SMT Surface M ount SMT 80 C 2 - 00 SADJ - X X J RoHs Compliance(9) RoHS Compliance J Pb-free oHS compliant) Custom Options Custom Options Blank 3.05 mm pin 3.50 mm pin Mounting Option Mounting Option Blank Horizontal V Vertical SIL 80 C 2 - 00 S ADJ - X X J