SMS12T1G ONSEMI | Alldatasheet

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Technical content

Features

  • SC-74 Package Allows Four Separate Unidirectional Configurations
  • Peak Power − 350 W, 8 x 20 /C0109S
  • ESD Rating of Class N (Exceeding 25 kV) per the Human Body Model
  • ESD Rating: IEC 61000−4−2 (ESD) 15 kV (air) 8 kV (contact) IEC 61000−4−4 (EFT) 40 A (5/50 ns) IEC 61000−4−5 (lightning) 23 A (8/20 /C0109s)
  • UL Flammability Rating of 94 V−0
  • Pb−Free Packages are Available Typical Applications
  • Hand Held Portable Applications such as Cell Phones, Pagers, Notebooks and Notebook Computers MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation 8 x 20 /C0109S @ TA = 25°C (Note 1) Ppk 350 W Total Power Dissipation on FR−5 Board @ TA = 25°C (Note 2) Derate Above 25°C PD 225 1.8 mW mW/°C Thermal Resistance, Junction−to−Ambient R/C0113JA 556 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C Lead Solder Temperature Maximum 10 Seconds Duration TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Non−repetitive current pulse 8 x 20 /C0109S exponential decay waveform SC−74 QUAD TRANSIENT VOLTAGE SUPPRESSOR

350 WATTS PEAK POWER

5 VOLTS

SC−74 CASE 318F STYLE 1 MARKING DIAGRAM PIN ASSIGNMENT PIN 1. CATHODE 2. ANODE 3. CATHODE 4. CATHODE 5. ANODE 6. CATHODE See specific marking information in the device marking column of the Electrical Characteristics table on page 2 o f this data sheet. DEVICE MARKING INFORMATION http://onsemi.com See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

/C0071 xxx = Specific Device Code M = Date Code* /C0071= Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location.

http://onsemi.com

ELECTRICAL CHARACTERISTICS

(TA = 25°C unless otherwise noted) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current /C0081VBR Maximum Temperature Coefficient of VBR IF Forward Current VF Forward Voltage @ IF ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK Uni−Directional IPP IF V I IRIT VRWMVC VBR VF ELECTRICAL CHARACTERISTICS − UNIDIRECTIONAL Device Device Marking Breakdown Voltage Max Reverse Leakage Current Max Reverse Voltage (Clamping Voltage) At Specified Reverse Surge Current (IRSM) Max Reverse Voltage (Clamping Voltage) At Specified Reverse Surge Current (IRSM) Capacitance @ 0 Volt Bias,

1 MHz

VBR(V) IT IR VR IRSM (8x20 /C0109s) VRSM (8x20 /C0109s) IRSM (8x20 /C0109s) VRSM (8x20 /C0109s) (pF) Min Nom Max (mA) (/C0109A) (V) (A) (V) (A) (V) Min Max Device Package Shipping† SMS05T1 SC−74 3000 / Tape & ReelSMS05T1G SC−74 (Pb−Free) SMS12T1 SC−74 3000 / Tape & ReelSMS12T1G SC−74 (Pb−Free) SMS15T1 SC−74 3000 / Tape & ReelSMS15T1G SC−74 (Pb−Free) SMS24T1 SC−74 3000 / Tape & ReelSMS24T1G SC−74 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

Figure 1. Non−Repetitive Peak Pulse Power Figure 2. Power Derating Curve Figure 3. Pulse Waveform Figure 4. Clamping Voltage versus Figure 5. 8 x 20 /C0109s VF Figure 6. Typical Capacitance (SMS05 Series)

8 X 20 /C0109s SURGE

http://onsemi.com PACKAGE DIMENSIONS SC−74 (SC−59ML) CASE 318F−05 ISSUE M STYLE 1: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. CATHODE 5. ANODE 6. CATHODE 456 D e b E A0.05 (0.002) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD 318F−05. C L HE DIM A MIN NOM MAX MIN MILLIMETERS 0.90 1.00 1.10 0.035 INCHES A1 0.01 0.06 0.10 0.001 b 0.25 0.37 0.50 0.010 c 0.10 0.18 0.26 0.004 D 2.90 3.00 3.10 0.114 E 1.30 1.50 1.70 0.051 e 0.85 0.95 1.05 0.034 0.20 0.40 0.60 0.008 0.039 0.043 0.002 0.004 0.015 0.020 0.007 0.010 0.118 0.122 0.059 0.067 0.037 0.041 0.016 0.024 NOM MAX − − L 0° 10° 0° 10° /C0113 /C0113 0.7 0.028 1.9 0.074 0.95 0.037 2.4 0.094 1.0 0.039 0.95 0.037 /C0466mm inches/C0467SCALE 10:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 SMS05T1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative