SMM5Z5V1RT1G

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© Semiconductor Components Industries, LLC, 2013 July, 2013 − Rev. 9

1 Publication Order Number:

MM5ZxxxST1G Series, SZMM5ZxxxST1G Series Zener Voltage Regulators 300 mW SOD−523 Surface Mount This series of Zener diodes is packaged in a SOD −523 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. Specification Features

• Standard Zener Breakdown V oltage Range −2.4 V to 18 V
• Steady State Power Rating of 200 mW
• Small Body Outline Dimensions: 0.047″ x 0.032″ (1.20 mm x 0.80 mm)
• Low Body Height: 0.028″ (0.7 mm)
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• Tight Tolerance VZ
• SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant* Mechanical Characteristics CASE: V oid-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94, V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Max Unit Total Device Dissipation FR−5 Board, (Note 1) @ TA = 25°C Derate above 25°C PD 300 1.5 mW mW/°C Thermal Resistance from Junction−to−Ambient R/C0113JA 390 °C/W Junction and Storage Temperature Range TJ, Tstg −65 to +150 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR −4 Minimum Pad. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Device Package Shipping †

ORDERING INFORMATION

See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. DEVICE MARKING INFORMATION http://onsemi.com SOD−523 CASE 502 MARKING DIAGRAM XX = Specific Device Code M Date Code* /C0071= Pb−Free Package XX M/C0071 /C0071 1 2 (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. MM5ZxxxST1G SOD −523 3,000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. This package is inherently Pb−Free. SOD−523SZMM5ZxxxST1G 3,000 / Tape & Reel SOD−523SZMM5ZxxxST5G 8,000 / Tape & Reel

MM5ZxxxST1G Series, SZMM5ZxxxST1G Series http://onsemi.com

ELECTRICAL CHARACTERISTICS

(TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Symbol Parameter VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF /C0081VZ Maximum Temperature Coefficient of VZ C Max. Capacitance @VR = 0 and f = 1 MHz IF V I IRIZT VRVZ VF Figure 1. Zener Voltage Regulator *Include SZ-prefix devices where applicable.

Figure 2. Steady State Power Derating

MM5ZxxxST1G Series, SZMM5ZxxxST1G Series http://onsemi.com PACKAGE DIMENSIONS SOD−523 CASE 502 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO- TRUSIONS, OR GATE BURRS. E D −X− −Y− b2X M0.08 X Y A Hc DIM MIN NOM MAX MILLIMETERS D 1.10 1.20 1.30 E 0.70 0.80 0.90 A 0.50 0.60 0.70 b 0.25 0.30 0.35 c 0.07 0.14 0.20 L 0.30 REF H 1.50 1.60 1.70 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* E E RECOMMENDED TOP VIEW SIDE VIEW BOTTOM VIEW L2X 0.48 0.40 1.80 DIMENSION: MILLIMETERS PACKAGE OUTLINE L2 0.15 0.20 0.25 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 MM5Z2V4ST1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative