SMM4F6.5A-TR

SMM4FXXA STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Features

 Typical peak pulse power:  400 W (10/1000 μs)  2.4 kW (8/20 μs)  Stand-off voltage range: from 5 V to 33 V  Unidirectional type  Low leakage current:  0.2 μA at 25 °C  1 μA at 85 °C  Operating Tj max: 175 °C  JEDEC registered package outline  RoHS package  Halogen free molding compound Complies with the following standards  IEC 61000-4-2 level 4:  15 kV (air discharge)  8 kV (contact discharge)  MIL STD 883G-Method 3015-7: class3  25 kV (human body model)

Description

The SMM4F Transil serie has been designed to protect sensitive equipment against electro-static discharges according to IEC 61000-4-2, MIL STD

883 Method 3015, and electrical over stress such

as IEC 61000-4-4 and 5. They are generally for surges below 400 W 10/1000 μs. This planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. Their low clamping voltages provide a better safety margin to protect sensitive circuits with extended life time expectancy. Packaged in STmite Flat, this minimizes PCB space consumption (footprint in accordance with IPC 7531 standard). Transil is a trademark of STMicroelectronics. K A STmite Flat (DO216-AA Flat)

1 Characteristics

Table 1: Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit VPP Peak pulse voltage (IEC 61000-4-2 contact discharge) 30 kV PPP Peak pulse power dissipation Tj initial = Tamb 400 W P Power dissipation on infinite heatsink Tamb = 125 °C 2.5 W IFSM Non repetitive surge peak forward current for unidirectional types tp = 10 ms Tj initial = Tamb 30 A Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s 260 °C Table 2: Thermal resistances Symbol Parameter Value Unit Rth(j-l) Junction to leads 20 °C/W Rth(j-a) Junction to ambient on PCB with recommended pad layout 250 Figure 1: Electrical characteristics - parameter definitions (Tamb = 25 °C)

Table 3: Electrical characteristics - parameter values (Tamb = 25 °C) Type IRM max. at VRM VBR at IR(1) VCL at IPP 10/1000 μs RD(2) μs VCL at IPP 8/20 μs RD 8/20 µs(2) αT(3) µA V V mA V A Ω V A Ω 10-4/°C Notes: (1)Pulse test: tp < 50 ms. (2)To calculate maximum clamping voltage at other surge currents, use the following formula: VCLmax = RD x IPP + VBRmax (3)To calculate VBR versus junction temperature, use the following formula: VBR at Tj = VBR @ 25 °C x (1 + αT x (Tj - 25)) Figure 2: Definition of IPP pulse

1.1 Characteristics (curves)

Figure 3: Peak power dissipation versus initial junction temperature Figure 4: Peak pulse power versus exponential pulse duration (Tj initial = 25 °C) Figure 5: Clamping voltage versus peak pulse current (exponential waveform, maximum values) Figure 6: Junction capacitance versus reverse applied voltage Figure 7: Peak forward voltage drop versus peak forward current Figure 8: Relative variation of thermal impedance junction to ambient versus pulse duration (printed circuit board FR4, SCu = 1 cm2) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 25 50 75 100 125 150 175 200 T (°C)j initial PPP[Tj initial] / PPP[Tj initial = 25 °C] 0.1 1.0 10.0 Tj initial = 25 °C t (ms)p P (kW)PP 0.1 100 1000 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 IPP (A) VCL (V) Tj initial = 25 °C tp = 8/20 µs tp = 10/1000 µs SMM4F5.0A SMM4F15A SMM4F24A SMM4F33A 100 1000 10000 1 10 100 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C SMM4F5.0A SMM4F15A SMM4F24A SMM4F33A C(pF) V (V)R 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 Tj = 25 °C Tj= 125 °C I (A)FM V (V)FM 0.00 0.01 0.10 1.00 On recommended pad layout Zth(j-a) /Rth(j-a) t (S)p

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.  Case: JEDEC DO216-AA Flat molded plastic over planar junction  Terminals: solder plated, solderable per MIL-STD-750, method 2026  Polarity: for unidirectional types the band indicates cathode.  Flammability: epoxy is rated UL94V-0  RoHS package

SMM4FxxA Package information

2.1 STmite Flat package information

Figure 11: STmite Flat package outline Table 4: STmite Flat mechanical data Ref. Dimensions Millimeters Inches

SMM4FxxA Package information Figure 18: Tape and reel outline Table 5: Tape and reel mechanical data Ref. Dimensions Millimeters Min. Typ. Max. P0 3.9 4 4.1 P1 3.9 4 4.1 P2 1.9 2 2.1 ØD0 1.5 1.55 1.6 ØD1 1.5 F 5.2 5.25 5.3 K0 1.2 1.3 1.4 W 11.7 12 12.3

3 Ordering information

Figure 19: Ordering information scheme Table 6: Ordering information Order code Marking Package Weight Base qty. Delivery mode SMM4FxxA-TR See Table 6. STmite Flat 16 mg 12000 Tape and reel Table 7: Marking Type Marking SMM4F5.0A-TR 4UA SMM4F6.0A-TR 4UB SMM4F6.5A-TR 4UC SMM4F8.5A-TR 4UD SMM4F10A-TR 4UE SMM4F12A-TR 4UF SMM4F13A-TR 4UG SMM4F15A-TR 4UH SMM4F18A-TR 4UJ SMM4F20A-TR 4UK SMM4F24A-TR 4UM SMM4F26A-TR 4UN SMM4F28A-TR 4UO SMM4F33A-TR 4UQ SM M 4F xx A - TR Surface Mount Package Surge rating M = STmite package 4F = 400 W in flat package Stand off voltage 12 = 12 V Type A = Unidirectional Packaging TR = Tape and reel

4 Revision history

Table 8: Document revision history Date Revision Changes 29-Nov-2007 1 First issue. 19-Dec-2007 2 Updated IPP and RD parameters in columns 10 and 11 of Table 4. 19-Aug-2014 3 Updated package name. 19-Jan-2017 4 Updated cover page and Table 4.